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公开(公告)号：US20240424614A1
公开(公告)日：2024-12-26
申请号：US18575136
申请日：2022-07-04
Applicant: Resonac Corporation
Inventor： Hideo NAKAKO , Yoshinori EJIRI , Toshiaki TANAKA , Dai ISHIKAWA , Michiko NATORI
Abstract: A metal paste for bonding contains metal particles, a dispersion medium, and a sintering accelerator, the metal particles contain copper particles, the sintering accelerator includes a coordinating compound having electron back donation properties, and the coordinating compound is at least one type selected from the group consisting of a nitrogen-containing aromatic heterocyclic compound, an acetylene derivative, an ethylene derivative, an organic arsenic compound, and a cyanide.
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公开(公告)号：US20240300055A1
公开(公告)日：2024-09-12
申请号：US18575080
申请日：2022-07-04
Applicant: Resonac Corporation
Inventor： Hideo NAKAKO , Yoshinori EJIRI , Toshiaki TANAKA , Dai ISHIKAWA , Michiko NATORI
CPC classification number: B23K35/302 , B22F1/052 , B22F1/068 , B22F7/064 , B23K35/025 , B22F2301/10 , B22F2304/05 , B22F2304/10 , B22F2998/10
Abstract: A metal paste for bonding includes metal particles, a dispersion medium, a reducing agent, and a reduction aid, in which the metal particles contain copper particles, the reduction aid includes a coordinating compound having electron back-donation properties, the coordinating compound is at least one selected from the group consisting of an organic phosphorus compound and an organic sulfur compound, and the metal paste for bonding contains, as a reducing agent, 1.6 parts by mass or more and 10 parts by mass or less of a polyol-based compound with respect to 100 parts by mass of the total mass of the copper particles.
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Patent Agency Ranking
3.发明公开公开(公告)号：US20240297135A1
公开(公告)日：2024-09-05
申请号：US18263712
申请日：2021-02-03
Applicant: Resonac Corporation
Inventor： Yoshinori EJIRI , Shinichirou SUKATA , Kunihiko AKAI , Masumi SAKAMOTO , Chiaki SHIMIZU , Junichi KAKEHATA , Ayumi YOSHIBA
IPC: H01L23/00
CPC classification number: H01L24/11 , H01L2224/11466 , H01L2224/11505
Abstract: A method for forming solder bumps by using a solder paste containing solder particles and a volatile dispersion medium, the method including: applying a solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature below the melting point of solder constituting the solder particles to form a solder particle-containing layer; heating the member and the solder particle-containing layer in a reducing atmosphere and at a temperature equal to or higher than the melting point of the solder constituting the solder particles to form solder bumps; and removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent solder bumps, in which the solder particles have an average particle size of 10 μm or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.
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公开(公告)号：US20230356294A1
公开(公告)日：2023-11-09
申请号：US18026244
申请日：2021-09-16
Applicant: Resonac Corporation
Inventor： Hideo NAKAKO , Toshiaki TANAKA , Dai ISHIKAWA , Yoshinori EJIRI , Michiko NATORI
CPC classification number: B22F3/1035 , B22F1/12 , F28D15/046 , B22F2301/10 , B22F2304/10
Abstract: Provided is a copper paste for forming a wick of a heat pipe, the copper paste containing copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium.
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公开(公告)号：US20240383035A1
公开(公告)日：2024-11-21
申请号：US18770661
申请日：2024-07-12
Applicant: RESONAC CORPORATION
Inventor： Yoshinori EJIRI , Shinichirou SUKATA , Masaya TOBA , Hideo NAKAKO , Yuki KAWANA , Kosuke URASHIMA , Motoki YONEKURA , Takaaki NOHDOH , Yoshiaki KURIHARA , Hiroshi MASUDA , Keita SONE
Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.
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公开(公告)号：US20240282684A1
公开(公告)日：2024-08-22
申请号：US18641480
申请日：2024-04-22
Applicant: RESONAC CORPORATION
Inventor： Kazuyuki MITSUKURA , Masaya TOBA , Yoshinori EJIRI , Kazuhiko KURAFUCHI
IPC: H01L23/498 , H01L21/48 , H01L23/12 , H01L23/14 , H01L23/32 , H01L23/538 , H01L25/065 , H05K1/09
CPC classification number: H01L23/49822 , H01L21/4857 , H01L23/12 , H01L23/145 , H01L23/32 , H01L23/49866 , H01L23/49894 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5389 , H01L25/0652 , H01L2225/06506 , H01L2225/06548 , H01L2225/06572 , H05K1/09
Abstract: An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.
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7.发明公开公开(公告)号：US20240105653A1
公开(公告)日：2024-03-28
申请号：US18263711
申请日：2021-02-03
Applicant: Resonac Corporation
Inventor： Yoshinori EJIRI , Shinichirou SUKATA , Kunihiko AKAI , Masumi SAKAMOTO , Chiaki SHIMIZU , Junichi KAKEHATA , Ayumi YOSHIBA
CPC classification number: H01L24/11 , H01L21/4853 , H01L21/60 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2021/6024 , H01L2224/1181 , H01L2224/11848 , H01L2224/13023 , H01L2224/16225 , H01L2224/81024 , H01L2224/81801
Abstract: A method for forming solder bumps by using a solder paste containing solder particles, a flux, and a volatile dispersion medium, the method including: applying the solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature below the melting point of solder constituting the solder particles to form a solder particle-containing layer; heating the member and the solder particle-containing layer at a temperature equal to or higher than the melting point of the solder constituting the solder particles to form solder bumps; and removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent solder bumps, in which the solder particles have an average particle size of 10 μm or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.
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