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    Method and system for creating three-dimensional images using tomosynthetic computed tomography
    1.
    发明申请
    Method and system for creating three-dimensional images using tomosynthetic computed tomography 有权
    使用断层合成计算机断层扫描创建三维图像的方法和系统

    公开(公告)号：US20070165922A1

    公开(公告)日：2007-07-19

    申请号：US11505255

    申请日：2006-08-16

    申请人： Richard Webber ,  Roger Horton

    发明人： Richard Webber ,  Roger Horton

    IPC分类号： G06K9/00

    CPC分类号： A61B6/145 ,  A61B6/12 ,  G06T11/005 ,  G06T11/008 ,  G06T2211/436

    摘要： A system for constructing image slices through a selected object, the system comprising an identifiable fiducial reference in a fixed position relative to the selected object, wherein the fiducial reference comprises at least two identifiable reference markers. A source of radiation is provided for irradiating the selected object and the fiducial reference to form a projected image of the selected object and the fiducial reference which is recorded by a recording medium.

    摘要翻译： 一种用于通过所选择的对象构建图像切片的系统，所述系统包括相对于所选对象的固定位置中的可识别基准参考，其中所述基准参考包括至少两个可识别参考标记。 提供辐射源以照射所选择的对象和基准参考，以形成由记录介质记录的所选对象和基准参考的投影图像。

    MEMS device package with thermally compliant insert
    3.
    发明申请
    MEMS device package with thermally compliant insert 审中-公开
    具有热兼容插件的MEMS器件封装

    公开(公告)号：US20070228499A1

    公开(公告)日：2007-10-04

    申请号：US11544089

    申请日：2006-10-06

    申请人： John Dangtran ,  Roger Horton

    发明人： John Dangtran ,  Roger Horton

    IPC分类号： H01L29/84

    CPC分类号： B81B7/0048 ,  H01L2924/19105

    摘要： A low cost micro-electronic package for MEMS applications includes a package substrate, a MEMS device and a buffer insert which is placed between the MEMS device and the package substrate. The buffer insert has a coefficient of thermal expansion (CTE) which is compatible with the material of the MEMS device and is sufficiently rigid to isolate the MEMS device from thermal, mechanical and other physical stresses applied to the package substrate. In an embodiment, the package is formed as an integrated device which includes both the MEMS device and a signal conditioning integrated circuit, potentially found in the same die. The substrate insert may be made of a material having a CTE value compatible with silicon (Si), such as Kovar, Invar, or an appropriate ceramic material or the like.

    摘要翻译： 用于MEMS应用的低成本微电子封装包括封装衬底，MEMS器件和放置在MEMS器件和封装衬底之间的缓冲插入件。 缓冲插入件具有与MEMS器件的材料相容的热膨胀系数（CTE），并且具有足够的刚性以将MEMS器件与施加到封装衬底的热，机械和其他物理应力隔离。 在一个实施例中，封装被形成为集成器件，其包括MEMS器件和可能在同一管芯中发现的信号调节集成电路。 衬底插入物可以由具有与硅（Si）相容的CTE值的材料制成，例如Kovar，Invar或适当的陶瓷材料等。

    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
    4.
    发明申请
    PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER 审中-公开
    当在水平分离MEMS表面时最小化流动的过程

    公开(公告)号：US20130130424A1

    公开(公告)日：2013-05-23

    申请号：US13695980

    申请日：2011-05-03

    申请人： Roger Horton ,  Javed Hussain

    发明人： Roger Horton ,  Javed Hussain

    IPC分类号： H01L21/78

    CPC分类号： B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

    摘要： A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

    摘要翻译： 一种用于在微电子机械系统（MEMS）晶片上分离多个管芯的方法，包括在第一表面上的多个管芯中的至少两个之间划定晶片的第一侧上的缺口并在其上沉积金属 多个管芯的第一表面。 该方法还包括在多个管芯中的至少两个从其第二表面通过凹口划线晶片的第二侧。 第一侧面和第二侧面基本上平行且彼此相对，并且第一表面和第二表面基本上平行且彼此相对。 在根据本发明的方法中，提供了一种在晶片锯切期间最小化MEM器件的接合部分的破损的方法，其最小程度地影响与在晶片上分离晶片相关的工艺步骤。

    Sensor Device Packaging And Method
    5.
    发明申请
    Sensor Device Packaging And Method 有权
    传感器装置包装与方法

    公开(公告)号：US20100044809A1

    公开(公告)日：2010-02-25

    申请号：US12196196

    申请日：2008-08-21

    申请人： John Dangtran ,  Roger Horton

    发明人： John Dangtran ,  Roger Horton

    IPC分类号： H01L29/84 ,  H01L21/58

    CPC分类号： B81B7/0077 ,  B81B7/0019

    摘要： A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

    摘要翻译： 一种传感器装置和一种形成方法包括：芯片垫接收诸如MEMS器件的传感器装置。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 管芯焊盘包括基座和具有符合第一和第二CTE的CTE的支撑结构。 管芯焊盘具有从基部突出的支撑结构。 支撑结构具有高度和壁厚度，当底座经受来自头部的热膨胀或收缩力时，能够最大限度地减小芯片焊盘和MEMS器件感觉到的力。

    Mechanical packaging technique of attaching MEMS and flex circuit
    6.
    发明授权
    Mechanical packaging technique of attaching MEMS and flex circuit 有权
    MEMS和柔性电路的机械封装技术

    公开(公告)号：US08806925B2

    公开(公告)日：2014-08-19

    申请号：US13430528

    申请日：2012-03-26

    申请人： Ihioma U. Nzeadibe ,  Javed Hussain ,  Joseph Castagna ,  Li Yuan ,  Roger Horton

    发明人： Ihioma U. Nzeadibe ,  Javed Hussain ,  Joseph Castagna ,  Li Yuan ,  Roger Horton

    IPC分类号： G01M15/08 ,  G01L23/14

    CPC分类号： G01L23/145

    摘要： The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

    摘要翻译： 所公开的本发明提供了用于各种实现的坚固，紧凑的感测装置，包括在内燃机过程中需要低成本精确的压力感测的汽车，船舶和其他燃烧技术的那些。 在本发明的一个或多个方面中，提出了具有柔性电路的MEMS传感器连接，并且其通信优选通过使用引线键合技术实现。

    Sensor device packaging
    7.
    发明授权
    Sensor device packaging 有权
    传感器装置包装

    公开(公告)号：US08643127B2

    公开(公告)日：2014-02-04

    申请号：US12196196

    申请日：2008-08-21

    申请人： John Dangtran ,  Roger Horton

    发明人： John Dangtran ,  Roger Horton

    IPC分类号： H01L29/84

    CPC分类号： B81B7/0077 ,  B81B7/0019

    摘要： A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

    摘要翻译： 一种传感器装置和一种形成方法包括：芯片垫接收诸如MEMS器件的传感器装置。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 管芯焊盘包括基座和具有符合第一和第二CTE的CTE的支撑结构。 管芯焊盘具有从基部突出的支撑结构。 支撑结构具有高度和壁厚度，当底座经受来自头部的热膨胀或收缩力时，可以最大限度地减小芯片焊盘和MEMS器件感觉到的力。