利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

46 条记录 (耗时 0.022 秒)

    FLUID EJECTION DEVICE AND METHODS OF FABRICATION
    1.
    发明申请
    FLUID EJECTION DEVICE AND METHODS OF FABRICATION 失效
    流体喷射装置和制造方法

    公开(公告)号：US20130050347A1

    公开(公告)日：2013-02-28

    申请号：US13217307

    申请日：2011-08-25

    申请人： Rio Rivas ,  Minalben Bhavin Shah ,  Henry Kang

    发明人： Rio Rivas ,  Minalben Bhavin Shah ,  Henry Kang

    IPC分类号： B41J2/05 ,  H01L21/306

    CPC分类号： B41J2/1601 ,  B41J2/14145 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642

    摘要： In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

    摘要翻译： 在一个实施例中，流体喷射装置包括：模具，其包括从模具的背面延伸到前侧的流体供给槽;形成在前侧的喷射室，用于从进料槽接收流体;流体分配歧管 粘附到后侧以向进料槽提供流体，以及涂覆模具背面的耐腐蚀层，以便不延伸到进料槽中。

    Fluid ejection device and methods of fabrication
    2.
    发明授权
    Fluid ejection device and methods of fabrication 失效
    流体喷射装置及其制造方法

    公开(公告)号：US08382253B1

    公开(公告)日：2013-02-26

    申请号：US13217307

    申请日：2011-08-25

    申请人： Rio Rivas ,  Minalben Bhavin Shah ,  Henry Kang

    发明人： Rio Rivas ,  Minalben Bhavin Shah ,  Henry Kang

    IPC分类号： B41J2/05

    CPC分类号： B41J2/1601 ,  B41J2/14145 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1642

    摘要： In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

    摘要翻译： 在一个实施例中，流体喷射装置包括：模具，其包括从模具的背面延伸到前侧的流体供给槽;形成在前侧的喷射室，用于从进料槽接收流体;流体分配歧管 粘附到后侧以向进料槽提供流体，以及涂覆模具背面的耐腐蚀层，以便不延伸到进料槽中。

    Fluid dispenser
    3.
    发明授权
    Fluid dispenser 有权
    流体分配器

    公开(公告)号：US09211713B2

    公开(公告)日：2015-12-15

    申请号：US14359241

    申请日：2011-12-21

    申请人： Silam J. Choy ,  Garrett E. Clark ,  Rio Rivas ,  Ed Friesen ,  Kelly Ronk

    发明人： Silam J. Choy ,  Garrett E. Clark ,  Rio Rivas ,  Ed Friesen ,  Kelly Ronk

    IPC分类号： B41J2/14 ,  B05B1/14

    CPC分类号： B41J2/1433 ,  B05B1/14 ,  B41J2/14145 ,  B41J2002/14387 ,  B41J2002/14419 ,  B41J2202/07 ,  B41J2202/11

    摘要： A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.

    摘要翻译： 本文公开了流体分配器。 这种流体分配器的示例包括构造成限定多个喷嘴的构件，流体被喷射通过该孔，以及包括多个流体通道的歧管，每个流体通道被构造成相对于构件具有不同的角度。 流体分配器的该示例另外包括多个槽，每个槽连接到歧管的不同的一个流体通道，以将流体从流体通道导向孔。 本文公开了该流体分配器的附加特征和修改，以及流体分配器的其它示例。

    PRINTHEADS WITH CONDUCTOR TRACES ACROSS SLOTS
    4.
    发明申请
    PRINTHEADS WITH CONDUCTOR TRACES ACROSS SLOTS 审中-公开
    带导线的PRINTHEADS ACS通过SLOTS

    公开(公告)号：US20150145925A1

    公开(公告)日：2015-05-28

    申请号：US14396161

    申请日：2012-05-31

    申请人： Rio Rivas ,  Christopher Bakker ,  Edward Friesen ,  James R. Przybyla

    发明人： Rio Rivas ,  Christopher Bakker ,  Edward Friesen ,  James R. Przybyla

    IPC分类号： B41J2/045 ,  H05K3/10

    CPC分类号： B41J2/04541 ,  B41J2/14072 ,  B41J2/1753 ,  B41J2/17553 ,  H05K3/10 ,  Y10T29/49155

    摘要： The present disclosure describes a printhead circuit, devices, and methods of forming the printhead circuit. An example of a printhead circuit includes a substrate including a slot having a first, a second, and a third dimension in the substrate, circuitry on a first side and a second side of the slot, and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot.

    摘要翻译： 本公开描述了打印头电路，装置和形成打印头电路的方法。 打印头电路的示例包括：衬底，其包括在衬底中具有第一，第二和第三维度的槽，在槽的第一侧和第二侧上的电路，以及沿着槽延伸的多个导体迹线 沿着与槽的第一侧和第二侧上的电路基本相同的几何平面。

    Printhead cap assembly
    5.
    发明授权
    Printhead cap assembly 有权
    打印头盖组件

    公开(公告)号：US08434853B1

    公开(公告)日：2013-05-07

    申请号：US13280579

    申请日：2011-10-25

    申请人： Greg K Justice ,  Rio Rivas

    发明人： Greg K Justice ,  Rio Rivas

    IPC分类号： B41J2/165

    CPC分类号： B41J2/16511

    摘要： Example embodiments disclosed herein relate to a printhead cap assembly. An example includes a rigid base member and a mount gimbaled with respect to the rigid base member and configured to define a recess including a side. The printhead cap assembly additionally includes a sealing member configured to include a retention feature positioned in the recess and engaging the side to orient and couple the sealing member to the mount so that the sealing member retains an original shape.

    摘要翻译： 本文公开的示例性实施例涉及打印头盖组件。 一个实例包括刚性基座构件和相对于刚性基座构件平衡的安装件，并且构造成限定包括侧面的凹部。 打印头盖组件还包括密封构件，该密封构件被构造成包括定位在凹部中并且与侧面接合的保持特征，以将密封构件定向并联接到安装件，使得密封构件保持原始形状。

    Method of forming orifice plate for fluid ejection device
    6.
    发明授权
    Method of forming orifice plate for fluid ejection device 失效
    形成流体喷射装置孔板的方法

    公开(公告)号：US07807079B2

    公开(公告)日：2010-10-05

    申请号：US11030036

    申请日：2005-01-05

    申请人： John Rausch ,  Kevin Brown ,  Rio Rivas

    发明人： John Rausch ,  Kevin Brown ,  Rio Rivas

    IPC分类号： B29C41/20 ,  B29C41/22

    CPC分类号： B41J2/1625 ,  B41J2/162 ,  B41J2/1626 ,  B41J2/1631

    摘要： A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.

    摘要翻译： 一种形成用于流体喷射装置的孔板的方法包括在导电表面上沉积和图案化掩模材料，在导电表面上形成第一层，在第一层上形成第二层，并除去第一层和第二层 层，其中所述第一层包括金属材料，并且所述第二层包括聚合物材料。

    Mandrel for electroformation of an orifice plate
    7.
    发明授权
    Mandrel for electroformation of an orifice plate 失效
    用于孔板电铸的心轴

    公开(公告)号：US07530169B2

    公开(公告)日：2009-05-12

    申请号：US11372648

    申请日：2006-03-10

    申请人： Deanna J. Bergstrom ,  Rio Rivas

    发明人： Deanna J. Bergstrom ,  Rio Rivas

    IPC分类号： B23P17/00 ,  B41J2/135

    CPC分类号： B41J2/1629 ,  B41J2/1433 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1628 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/494 ,  Y10T29/49401 ,  Y10T29/5313

    摘要： A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.

    摘要翻译： 一种制造用于孔板电铸的心轴的方法。 可以在衬底附近形成掩模元件阵列。 通常设置在掩模元件之间的基板的表面区域可以被去除，以产生具有基底表面的基底和根据掩模元件阵列从基底表面延伸的多个柱。 每个支柱可以具有由掩模元件之一的正交投影限定在基板上的周界。 导电增强剂可以沉积在基底表面附近并至少基本上终止于周边，以产生导电层以支持孔板的生长。

    Fluid ejection device
    10.
    发明授权
    Fluid ejection device 有权
    流体喷射装置

    公开(公告)号：US09463485B2

    公开(公告)日：2016-10-11

    申请号：US14375672

    申请日：2012-04-24

    申请人： Rio Rivas ,  Corey Deyo ,  Ed Friesen

    发明人： Rio Rivas ,  Corey Deyo ,  Ed Friesen

    IPC分类号： H01B13/00 ,  B05B17/06 ,  B41J2/175 ,  B41J2/16 ,  B23K26/36

    CPC分类号： B05B17/0615 ,  B23K26/361 ,  B23K26/362 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/164 ,  B41J2/1642 ,  B41J2/17553

    摘要： A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.

    摘要翻译： 一种形成用于流体喷射装置的基板的方法包括：通过所述基板形成开口，所述开口具有长轴轮廓和短轴轮廓，并且所述长轴轮廓包括从所述基板的最小尺寸延伸的第一部分 长轴轮廓到所述基底的第一侧，以及第二部分，其包括并从所述长轴轮廓的最小尺寸延伸到所​​述基底的与所述第一侧相对的第二侧。 该方法还包括在开口的长轴轮廓的第二部分的侧壁上形成保护层，并且从开口的长轴轮廓的第一部分的侧壁排除保护层。