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    Method for structuring a layered structure from two semiconductor layers, and micromechanical component
    1.
    发明授权
    Method for structuring a layered structure from two semiconductor layers, and micromechanical component 有权
    从两个半导体层构造层状结构的方法和微机械部件

    公开(公告)号：US09490137B2

    公开(公告)日：2016-11-08

    申请号：US14616004

    申请日：2015-02-06

    申请人： Robert Bosch GmbH

    发明人： Simon Armbruster ,  Frank Fischer ,  Johannes Baader ,  Rainer Straub

    IPC分类号： H01L21/311 ,  H01L21/02 ,  B81C1/00

    CPC分类号： H01L21/311 ,  B81C1/00801 ,  B81C2201/014 ,  H01L21/02118 ,  H01L21/02164 ,  H01L21/02178 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/0228

    摘要： A method for structuring a layered structure, for example, of a micromechanical component, from two semiconductor layers between which an insulating and/or etch stop layer is situated includes forming a first etching mask on a first side of the first semiconductor layer, carrying out a first etching step, starting from a first outer side, for structuring the first semiconductor layer, forming a second etching mask on a second side of the second semiconductor layer, and carrying out a second etching step, starting from the second outer side, for structuring the second semiconductor layer. After carrying out the first etching step and prior to carrying out the second etching step, at least one etching protection material is deposited on at least one trench wall of at least one first trench, which is etched in the first etching step.

    摘要翻译： 用于从两个半导体层构成诸如微机械部件的分层结构的绝缘和/或蚀刻停止层的方法包括在第一半导体层的第一侧上形成第一蚀刻掩模，执行 第一蚀刻步骤，从第一外侧开始，用于构造第一半导体层，在第二半导体层的第二侧上形成第二蚀刻掩模，并且执行第二蚀刻步骤，从第二外侧开始，用于 构造第二半导体层。 在执行第一蚀刻步骤之后并且在进行第二蚀刻步骤之前，至少一个蚀刻保护材料沉积在至少一个第一沟槽的至少一个沟槽壁上，该第一沟槽在第一蚀刻步骤中被蚀刻。

    MICROMIRROR AND MANUFACTURING METHOD FOR AT LEAST ONE MICROMIRROR WHICH IS SITUATABLE OR SITUATED IN A MICROMIRROR DEVICE
    3.
    发明申请
    MICROMIRROR AND MANUFACTURING METHOD FOR AT LEAST ONE MICROMIRROR WHICH IS SITUATABLE OR SITUATED IN A MICROMIRROR DEVICE 有权
    用于至少一个在微镜器件中可视或形成的微型计算机的微型计算机和制造方法

    公开(公告)号：US20150153566A1

    公开(公告)日：2015-06-04

    申请号：US14553707

    申请日：2014-11-25

    申请人： Robert Bosch GmbH

    发明人： Simon Armbruster ,  Helmut Grutzeck ,  Joerg Muchow ,  Frederic Njikam Njimonzie ,  Johannes Baader ,  Stefan Pinter ,  Rainer Straub ,  Zoltan Lestyan

    IPC分类号： G02B26/08 ,  G02B1/12

    CPC分类号： G02B26/0841 ,  G02B26/085 ,  G02B26/0858

    摘要： A micromirror for a micromirror device includes: a mirror side; and a back side which is directed away from the mirror side, at least one central area of the back side having at least one surface which is plane parallel to the mirror side, the back side being shaped in such a way that on two opposite sides of the central area, a side area having at least one side surface of the back side in each case, which is curved and/or oriented inclined toward the mirror side borders on the central area of the back side, and a height of the micromirror continuously decreasing starting from the central area along a cross section of the micromirror, which runs through the central area and the two side areas.

    摘要翻译： 用于微镜装置的微反射镜包括：镜面; 以及远离反射镜侧的背面，后侧的至少一个中心区域具有至少一个平行于镜面的平面的表面，所述后侧的形状使得在两相对侧 所述中央区域的侧面区域具有在每种情况下具有背侧的至少一个侧表面，所述侧面在所述背面的中心区域上朝向所述镜侧边缘弯曲和/或定向倾斜，并且所述微镜的高度 沿着穿过中心区域和两个侧面区域的微镜的横截面从中心区域开始连续地减小。