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公开(公告)号:US11066295B2
公开(公告)日:2021-07-20
申请号:US16476609
申请日:2017-11-16
申请人: Robert Bosch GmbH
发明人: Philip Kaupmann , Stefan Pinter , Helmut Grutzeck , Jochen Franz , Joerg Muchow
摘要: A micromechanical component having a mount, an adjustable element, which is connected via at least one spring to the mount, and an actuator device, a first oscillatory motion of the adjustable element about a first axis of rotation and simultaneously a second oscillatory motion of the adjustable element, which is set into the first oscillatory motion, being excitable about a second axis of rotation in response to the actuator device; and the adjustable element being configured by the at least one spring to be adjustable on the mount in such a way that the adjustable element is adjustable by a resulting angular momentum about a rotational axis, which is oriented orthogonally to the first axis of rotation and orthogonally to second axis of rotation. Also, a method for manufacturing a micromechanical component. Moreover, a method for exciting a motion of an adjustable element about a rotational axis.
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公开(公告)号:US10431474B2
公开(公告)日:2019-10-01
申请号:US15318702
申请日:2015-05-29
申请人: Robert Bosch GmbH
IPC分类号: H01L21/30 , H01L21/48 , H01L21/308 , B81C1/00 , B81B1/00
摘要: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
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公开(公告)号:US20180257932A1
公开(公告)日:2018-09-13
申请号:US15914092
申请日:2018-03-07
申请人: Robert Bosch GmbH
CPC分类号: B81C1/00626 , B81B7/0067 , B81B2201/042 , B81C2201/0123 , B81C2201/0133 , B81C2201/016 , B81C2201/053 , G02B26/0833
摘要: A method for manufacturing a micromechanical device includes providing a silicon substrate having a front side and a rear side, where a first normal of the front side deviates by a first angle from the direction of the silicon substrate; forming in the front side first and second trenches that are spaced apart from and essentially parallel to each other, with the first and second trenches extending along a direction of the deviation; forming on the front side a first etching mask that covers the front side except for a first opening area between the first and second trenches; and anisotropically etching the front side using the etching mask, thereby forming in the opening area an oblique surface having a second angle to the first normal, which approximately corresponds to the first angle.
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公开(公告)号:US20170140943A1
公开(公告)日:2017-05-18
申请号:US15318702
申请日:2015-05-29
申请人: Robert Bosch GmbH
CPC分类号: H01L21/4803 , B81B1/00 , B81B2203/0315 , B81B2203/033 , B81B2203/0384 , B81C1/00103 , B81C1/0042 , B81C2201/013 , H01L21/3083
摘要: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.
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公开(公告)号:US20240258765A1
公开(公告)日:2024-08-01
申请号:US18040407
申请日:2021-09-28
申请人: Robert Bosch GmbH
发明人: Stefan Pinter
IPC分类号: H01S5/02257 , H01S5/02208 , H01S5/02255 , H01S5/02345 , H01S5/40
CPC分类号: H01S5/02257 , H01S5/02208 , H01S5/02255 , H01S5/02345 , H01S5/4031
摘要: A laser diode device including at least one laser diode. The laser diode is an edge emitter. The laser diode device includes a housing having a transparent optical window, the transparent optical window being embodied as a first side wall of the housing. The housing is designed to shield the laser diode from an external environment of the laser diode device, in particular hermetically. The transparent optical window is designed to transmit at least one laser beam generated by the laser diode into the external environment. The laser diode is at least indirectly fastened to a base of the housing. The side walls of the housing and a housing cover situated opposite the housing base are produced from a multiplicity of wafers, in particular at least three.
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公开(公告)号:US20220329039A1
公开(公告)日:2022-10-13
申请号:US17761999
申请日:2020-07-28
申请人: Robert Bosch GmbH
发明人: Stefan Pinter
IPC分类号: H01S5/02257 , H01S5/02253 , H01S5/02255 , H01S5/02326 , H01S5/024
摘要: A micromechanical optical component having a substrate, a spacer, and a cover, which are positioned one above the other and delimit a hermetically sealed cavity. A semiconductor laser is situated in the cavity, on the substrate. An optical element, which is attached to the spacer, is positioned in a beam path of the semiconductor laser. A method for manufacturing a micromechanical optical component is also described.
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公开(公告)号:US20220283427A1
公开(公告)日:2022-09-08
申请号:US17634360
申请日:2020-10-01
申请人: Robert Bosch GmbH
发明人: Eugene Moliere Tanguep Njiokep , Frank Schatz , Helmut Grutzeck , Stefan Pinter , Johannes Baader , Rainer Straub , Timo Schary
摘要: A micromechanical oscillation system that is designed as a micromirror system. The micromechanical oscillation system includes a micromechanical oscillating body that includes at least one micromirror. The micromechanical oscillating body is designed to oscillate about an oscillation axis, in particular at a resonant frequency of the oscillating body. The micromechanical oscillating body has a total mass made up of mass elements. The mass elements are distributed as a function of a lateral horizontal spacing of the mass elements from the oscillation axis.
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公开(公告)号:US20220003936A1
公开(公告)日:2022-01-06
申请号:US16919545
申请日:2020-07-02
申请人: Robert Bosch GmbH
发明人: Ning Wang , Christoph Schelling , Alexander Huebel , Hartmut Kueppers , Stefan Pinter , Uma Krishnamoorthy
摘要: An optical switch includes a bus waveguide supported by a substrate, an actuation electrode supported by the substrate, the actuation electrode having fins that protrude in a direction perpendicular to the substrate and to the bus waveguide, and a reaction electrode having interdigitated fins configured to form a comb drive with the actuation electrode. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the reaction electrode is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the reaction electrode is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.
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公开(公告)号:US20220003925A1
公开(公告)日:2022-01-06
申请号:US16919602
申请日:2020-07-02
申请人: Robert Bosch GmbH
发明人: Ning Wang , Alexander Huebel , Christoph Schelling , Jan Niklas Caspers , Hartmut Kueppers , Stefan Pinter
摘要: An optical switch includes a first bus waveguide supported by a substrate, an optical antenna suspended over the first bus waveguide via a spring, and interdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide. When a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position offset from the first bus waveguide, and the offset at the second position is greater than at the first position.
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公开(公告)号:US11130672B2
公开(公告)日:2021-09-28
申请号:US16636939
申请日:2018-07-30
申请人: Robert Bosch GmbH
发明人: Johannes Baader , Nicolas Schorr , Rainer Straub , Stefan Pinter , Tina Steigert
摘要: A micromechanical apparatus and a corresponding production method are described. The micromechanical apparatus encompasses a base substrate having a front side and a rear side; and a cap substrate, at least one surrounding trench having non-flat side walls being embodied in the front side of the base substrate; the front side of the base substrate and the trench being coated with at least one metal layer; the non-flat side walls of the trench being covered nonconformingly with the metal so that they do not form an electrical current path in a direction extending perpendicularly to the front side; and a closure, in particular a seal-glass closure, being embodied in the region of the trench between the base substrate and the cap substrate.
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