Method for forming a cavity and a component having a cavity

    公开(公告)号:US10431474B2

    公开(公告)日:2019-10-01

    申请号:US15318702

    申请日:2015-05-29

    申请人: Robert Bosch GmbH

    摘要: A method for forming a cavity in a silicon substrate, a surface of the silicon substrate having a tilting angle relative to a first plane of the silicon substrate, and the first plane being a {111} plane of the silicon substrate, and situation of an etching mask on the surface of the silicon substrate. The etching mask has a retarding structure that protrudes into the mask opening, and a first etching projection region. All further edges of the mask opening outside the first etching projection region are situated essentially parallel to {111} planes of the silicon substrate. The method includes an anisotropic etching of the silicon substrate during a defined etching duration. An etching rate in the directions of the silicon substrate is lower than in other spatial directions, and the first retarding structure is undercut in a first undercut direction going out from the first etching projection region.

    LASER DIODE DEVICE AND PRODUCTION METHOD
    5.
    发明公开

    公开(公告)号:US20240258765A1

    公开(公告)日:2024-08-01

    申请号:US18040407

    申请日:2021-09-28

    申请人: Robert Bosch GmbH

    发明人: Stefan Pinter

    摘要: A laser diode device including at least one laser diode. The laser diode is an edge emitter. The laser diode device includes a housing having a transparent optical window, the transparent optical window being embodied as a first side wall of the housing. The housing is designed to shield the laser diode from an external environment of the laser diode device, in particular hermetically. The transparent optical window is designed to transmit at least one laser beam generated by the laser diode into the external environment. The laser diode is at least indirectly fastened to a base of the housing. The side walls of the housing and a housing cover situated opposite the housing base are produced from a multiplicity of wafers, in particular at least three.

    MEMS Optical Switch With Stop Control

    公开(公告)号:US20220003936A1

    公开(公告)日:2022-01-06

    申请号:US16919545

    申请日:2020-07-02

    申请人: Robert Bosch GmbH

    IPC分类号: G02B6/35 B81B3/00

    摘要: An optical switch includes a bus waveguide supported by a substrate, an actuation electrode supported by the substrate, the actuation electrode having fins that protrude in a direction perpendicular to the substrate and to the bus waveguide, and a reaction electrode having interdigitated fins configured to form a comb drive with the actuation electrode. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the reaction electrode is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the reaction electrode is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.

    In-Plane MEMS Optical Switch
    9.
    发明申请

    公开(公告)号:US20220003925A1

    公开(公告)日:2022-01-06

    申请号:US16919602

    申请日:2020-07-02

    申请人: Robert Bosch GmbH

    IPC分类号: G02B6/12 B81B3/00

    摘要: An optical switch includes a first bus waveguide supported by a substrate, an optical antenna suspended over the first bus waveguide via a spring, and interdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide. When a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position offset from the first bus waveguide, and the offset at the second position is greater than at the first position.

    Micromechanical device and corresponding production method

    公开(公告)号:US11130672B2

    公开(公告)日:2021-09-28

    申请号:US16636939

    申请日:2018-07-30

    申请人: Robert Bosch GmbH

    IPC分类号: B81B7/02 B81C1/00

    摘要: A micromechanical apparatus and a corresponding production method are described. The micromechanical apparatus encompasses a base substrate having a front side and a rear side; and a cap substrate, at least one surrounding trench having non-flat side walls being embodied in the front side of the base substrate; the front side of the base substrate and the trench being coated with at least one metal layer; the non-flat side walls of the trench being covered nonconformingly with the metal so that they do not form an electrical current path in a direction extending perpendicularly to the front side; and a closure, in particular a seal-glass closure, being embodied in the region of the trench between the base substrate and the cap substrate.