Spinal fixation plate
    1.
    发明申请
    Spinal fixation plate 有权
    脊柱固定板

    公开(公告)号:US20050085913A1

    公开(公告)日:2005-04-21

    申请号:US10927778

    申请日:2004-08-27

    摘要: Spinal fixation plates for maintaining adjacent vertebrae in and fixed position are provided. In an exemplary embodiment, the plate includes opposed superior and inferior portions that are angled in a direction anterior to an anterior face of a mid-portion of the plate. The plate also includes a curvature formed therein about a longitudinal axis in a sagittal plane thereof. In use, when the plate is attached to adjacent vertebrae, the angle of the superior and inferior portions and the curvature in the plate are effective to position one or more thru-bores formed in the superior and inferior portions at the anterior rims of the adjacent vertebrae. In another embodiment, a spinal fixation plate is provided that is adapted to engage and mate to a fusion cage or other vertebral implant disposed between adjacent vertebra. The present invention also provides spinal fixation kits or assemblies, and methods for implanting the same.

    摘要翻译: 提供用于将相邻椎骨保持在固定位置的脊椎固定板。 在一个示例性实施例中,板包括相对的上部和下部,其在板的中间部分的前表面的前方的方向成角度。 该板还包括围绕其矢状平面中的纵向轴线形成的曲率。 在使用中,当板附接到相邻的椎骨时,上部和下部的角度和板中的曲率有效地将形成在上部和下部的一个或多个穿孔定位在相邻的前边缘 椎骨 在另一个实施例中,提供脊柱固定板,其适于接合并配合到设置在相邻椎骨之间的融合笼或其它椎骨植入物。 本发明还提供了脊柱固定套件或组件,以及用于植入它们的方法。

    Container Closure
    5.
    发明申请
    Container Closure 审中-公开
    集装箱关闭

    公开(公告)号:US20060021982A1

    公开(公告)日:2006-02-02

    申请号:US11191000

    申请日:2005-07-28

    IPC分类号: B65D17/34

    摘要: A container closure (10) including a peripheral ring member (20) for securing the closure to a container or can body (not shown), and including a molded, polymer ring member (14) and central end panel (12) that are removable from the peripheral ring member for opening the end of the container or can body. The polymer ring member is adhesively bonded to a vertical wall portion (24) of the peripheral ring member and includes an integral lip portion (28) for covering a raw terminal edge of wall portion 24. The adhesive is formulated so that the bond fails cohesively during removal of the polymer ring member. The polymer ring member contains an oxygen-scavenging additive for reducing oxygen inside the container and reducing oxygen ingress into the closed container.

    摘要翻译: 一种容器封闭件(10),其包括用于将所述封闭件固定到容器或罐体(未示出)的外围环构件(20),并且包括模制的聚合物环构件(14)和中心端板(12) 从外围环构件开口容器或罐体的端部。 聚合物环构件粘合到外围环构件的垂直壁部分(24)上,并且包括用于覆盖壁部分24的原始末端边缘的整体唇部(28)。 配制粘合剂,使得粘合剂在去除聚合物环构件期间内聚失效。 聚合物环构件含有用于减少容器内的氧气并减少氧气进入密闭容器的氧气清除添加剂。

    Electrostatic RF absorbant circuit carrier assembly and method for
making the same
    7.
    发明授权
    Electrostatic RF absorbant circuit carrier assembly and method for making the same 失效
    静电RF吸收电路载体组件及其制造方法

    公开(公告)号:US5185654A

    公开(公告)日:1993-02-09

    申请号:US799235

    申请日:1991-11-27

    摘要: An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising:a thermosetting matrix system;a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; anda conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.

    摘要翻译: 静电RF吸收剂回路载体组件(200)被描述为具有塑料支撑结构(100),该塑料支撑结构由一体形成的基部(180)和围绕的侧壁(170)组成,这些侧壁一起形成内部空腔(185)。 多个导体路径(125,165)设置在空腔(185)内。 组件(200)由聚合物盖(110)完成,聚合物盖(110)具有整体形式的表面,包括用于与空腔(185)内的导电路径(165)接触的壁构件(145)。 为了促进RF隔离和静电耗散,盖(110)用表面材料层压,包括:热固性基体系; 一种非导电RF吸收填料,其包含25-87重量%的热固性基体系的负荷; 以及包含1至4重量%的热固性基体系和RF吸收填料的导电填料。