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    Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof
    2.
    发明授权
    Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof 有权
    氧化锆增韧陶瓷部件和半导体加工设备中的涂层及其制造方法

    公开(公告)号：US07255898B2

    公开(公告)日：2007-08-14

    申请号：US10442980

    申请日：2003-05-22

    申请人： Robert J. O'Donnell ,  Christopher C. Chang ,  John E. Daugherty

    发明人： Robert J. O'Donnell ,  Christopher C. Chang ,  John E. Daugherty

    IPC分类号： B05D1/02 ,  C23C16/40

    CPC分类号： H01J37/32477 ,  C23C14/083 ,  C23C16/405 ,  Y10T428/265

    摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber comprises zirconia toughened ceramic material as an outermost surface of the component. The component can be made entirely of the ceramic material or the ceramic material can be provided as a coating on a substrate such as aluminum or aluminum alloy, stainless steel, or refractory metal. The zirconia toughened ceramic can be tetragonal zirconia polycrystalline (TZP) material, partially-stabilized zirconia (PSZ), or a zirconia dispersion toughened ceramic (ZTC) such as zirconia-toughened alumina (tetragonal zirconia particles dispersed in Al2O3). In the case of a ceramic zirconia toughened coating, one or more intermediate layers may be provided between the component and the ceramic coating. To promote adhesion of the ceramic coating, the component surface or the intermediate layer surface may be subjected to a surface roughening treatment prior to depositing the ceramic coating.

    摘要翻译： 诸如等离子体室的半导体加工设备的耐腐蚀部件包括作为部件的最外表面的氧化锆增韧陶瓷材料。 该组件可以完全由陶瓷材料制成，或者陶瓷材料可以作为涂层提供在诸如铝或铝合金，不锈钢或难熔金属的基底上。 氧化锆增韧陶瓷可以是四方晶氧化锆多晶（TZP）材料，部分稳定的氧化锆（PSZ）或氧化锆分散体增韧陶瓷（ZTC），如氧化锆增韧的氧化铝（分散在Al 2+中的四方晶氧化锆颗粒） SUB> O 3 3）。 在陶瓷氧化锆增韧涂层的情况下，可以在组件和陶瓷涂层之间提供一个或多个中间层。 为了促进陶瓷涂层的粘合，可以在沉积陶瓷涂层之前对组分表面或中间层表面进行表面粗糙化处理。

    CORROSION RESISTANT COMPONENT OF SEMICONDUCTOR PROCESSING EQUIPMENT AND METHOD OF MANUFACTURE THEREOF
    7.
    发明申请
    CORROSION RESISTANT COMPONENT OF SEMICONDUCTOR PROCESSING EQUIPMENT AND METHOD OF MANUFACTURE THEREOF 有权
    半导体加工设备的耐腐蚀性成分及其制造方法

    公开(公告)号：US20100003826A1

    公开(公告)日：2010-01-07

    申请号：US12559177

    申请日：2009-09-14

    申请人： ROBERT J. O'DONNELL ,  Christopher C. Chang ,  John E. Daugherty

    发明人： ROBERT J. O'DONNELL ,  Christopher C. Chang ,  John E. Daugherty

    IPC分类号： H01L21/3065

    CPC分类号： H01J37/32467 ,  H01J37/32477 ,  H01J37/32559

    摘要： A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.

    摘要翻译： 等离子体室的耐腐蚀组分包括液晶聚合物。 在优选的实施方案中，液晶聚合物（LCP）设置在具有阳极化或非阳极氧化表面的铝组分上。 液晶聚合物也可以提供在氧化铝组分上。 液晶聚合物可以通过诸如等离子喷涂的方法沉积。 液晶聚合物也可以被提供为预成型片或适于覆盖反应室暴露表面的其它形状。 此外，反应器组分可以通过从液晶聚合物的固体块中加工组分或从聚合物模塑组分而完全由液晶聚合物制成。 液晶聚合物可以含有增强填料如玻璃或矿物填料。