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公开(公告)号：US06613442B2
公开(公告)日：2003-09-02
申请号：US09749924
申请日：2000-12-29
IPC分类号： B23B1504
CPC分类号： H01J37/32477 , C23C16/4404
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a boron nitride/yttria composite containing surface and process for manufacture thereof.
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公开(公告)号：US07128804B2
公开(公告)日：2006-10-31
申请号：US09749921
申请日：2000-12-29
IPC分类号： H01L21/306
CPC分类号： H01J37/32467 , H01J37/32477 , H01J37/32559
摘要： A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.
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公开(公告)号：US06537429B2
公开(公告)日：2003-03-25
申请号：US09749925
申请日：2000-12-29
IPC分类号： C23C1400
CPC分类号： H01J37/32495 , B01J19/0073 , B01J19/02 , B01J2219/0231 , B01J2219/025 , C23C16/0272 , C23C16/27 , C23C16/4404 , Y10T428/26 , Y10T428/30 , Y10T428/31678
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a diamond containing surface and process for manufacture thereof.
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公开(公告)号：US08486841B2
公开(公告)日：2013-07-16
申请号：US12559177
申请日：2009-09-14
IPC分类号： H01L21/302
CPC分类号： H01J37/32467 , H01J37/32477 , H01J37/32559
摘要： A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.
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5.发明授权Zirconia toughened ceramic components and coatings in semiconductor processing equipment and method of manufacture thereof 有权氧化锆增韧陶瓷部件和半导体加工设备中的涂层及其制造方法公开(公告)号：US07255898B2
公开(公告)日：2007-08-14
申请号：US10442980
申请日：2003-05-22
CPC分类号： H01J37/32477 , C23C14/083 , C23C16/405 , Y10T428/265
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber comprises zirconia toughened ceramic material as an outermost surface of the component. The component can be made entirely of the ceramic material or the ceramic material can be provided as a coating on a substrate such as aluminum or aluminum alloy, stainless steel, or refractory metal. The zirconia toughened ceramic can be tetragonal zirconia polycrystalline (TZP) material, partially-stabilized zirconia (PSZ), or a zirconia dispersion toughened ceramic (ZTC) such as zirconia-toughened alumina (tetragonal zirconia particles dispersed in Al2O3). In the case of a ceramic zirconia toughened coating, one or more intermediate layers may be provided between the component and the ceramic coating. To promote adhesion of the ceramic coating, the component surface or the intermediate layer surface may be subjected to a surface roughening treatment prior to depositing the ceramic coating.
摘要翻译： 诸如等离子体室的半导体加工设备的耐腐蚀部件包括作为部件的最外表面的氧化锆增韧陶瓷材料。 该组件可以完全由陶瓷材料制成，或者陶瓷材料可以作为涂层提供在诸如铝或铝合金，不锈钢或难熔金属的基底上。 氧化锆增韧陶瓷可以是四方晶氧化锆多晶（TZP）材料，部分稳定的氧化锆（PSZ）或氧化锆分散体增韧陶瓷（ZTC），如氧化锆增韧的氧化铝（分散在Al 2+中的四方晶氧化锆颗粒） SUB> O 3 3）。 在陶瓷氧化锆增韧涂层的情况下，可以在组件和陶瓷涂层之间提供一个或多个中间层。 为了促进陶瓷涂层的粘合，可以在沉积陶瓷涂层之前对组分表面或中间层表面进行表面粗糙化处理。
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6.发明授权Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof 有权半导体加工设备的氮化硼/氧化钇复合元件及其制造方法公开(公告)号：US06773751B2
公开(公告)日：2004-08-10
申请号：US10393010
申请日：2003-03-21
IPC分类号： C23C1634
CPC分类号： H01J37/32477 , C23C16/4404
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a boron nitride/yttria composite containing surface and process for manufacture thereof.
摘要翻译： 诸如等离子体室的半导体处理设备的耐腐蚀部件包括含氮化硼/氧化钇复合材料表面及其制造方法。
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公开(公告)号：US06620520B2
公开(公告)日：2003-09-16
申请号：US09750056
申请日：2000-12-29
IPC分类号： B32B1504
CPC分类号： H01J37/32477 , C23C14/083 , C23C16/405 , Y10T428/265
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber comprises zirconia toughened ceramic material as an outermost surface of the component. The component can be made entirely of the ceramic material or the ceramic material can be provided as a coating on a substrate such as aluminum or aluminum alloy, stainless steel, or refractory metal. The zirconia toughened ceramic can be tetragonal zirconia polycrystalline (TZP) material, partially-stabilized zirconia (PSZ), or a zirconia dispersion toughened ceramic (ZTC) such as zirconia-toughened alumina (tetragonal zirconia particles dispersed in Al2O3). In the case of a ceramic zirconia toughened coating, one or more intermediate layers may be provided between the component and the ceramic coating. To promote adhesion of the ceramic coating, the component surface or the intermediate layer surface may be subjected to a surface roughening treatment prior to depositing the ceramic coating.
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公开(公告)号：US07605086B2
公开(公告)日：2009-10-20
申请号：US11525102
申请日：2006-09-22
IPC分类号： H01L21/302
CPC分类号： H01J37/32467 , H01J37/32477 , H01J37/32559
摘要： A corrosion resistant component of a plasma chamber includes a liquid crystalline polymer. In a preferred embodiment, the liquid crystalline polymer (LCP) is provided on an aluminum component having an anodized or non-anodized surface. The liquid crystalline polymer can also be provided on an alumina component. The liquid crystalline polymer can be deposited by a method such as plasma spraying. The liquid crystalline polymer may also be provided as a preformed sheet or other shape adapted to cover the exposed surfaces of the reaction chamber. Additionally, the reactor components may be made entirely from liquid crystalline polymer by machining the component from a solid block of liquid crystalline polymer or molding the component from the polymer. The liquid crystalline polymer may contain reinforcing fillers such as glass or mineral fillers.
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9.发明授权Fullerene coated component of semiconductor processing equipment and method of manufacturing thereof 失效半导体加工设备的富勒烯涂层部件及其制造方法公开(公告)号：US06790242B2
公开(公告)日：2004-09-14
申请号：US09749923
申请日：2000-12-29
IPC分类号： H01L2100
CPC分类号： B82Y30/00 , B01J19/02 , B01J2219/0204 , B01J2219/0263 , B01J2219/0277 , B01J2219/0295 , C23C16/4404 , H01J37/32477 , Y10S423/39 , Y10S423/40 , Y10S977/844 , Y10S977/847 , Y10T29/41
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a fullerene containing surface and process for manufacturing thereof.
摘要翻译： 诸如等离子体室的半导体加工设备的耐腐蚀部件包括含富勒烯的表面及其制造方法。
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10.发明授权公开(公告)号：US06533910B2
公开(公告)日：2003-03-18
申请号：US09750251
申请日：2000-12-29
IPC分类号： C23C1434
CPC分类号： H01J37/32477 , B01J19/02 , B01J2219/00171 , B01J2219/0218 , C23C16/4404
摘要： A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a carbonitride containing surface and process for manufacture thereof.
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