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1.发明授权公开(公告)号：US07388756B1
公开(公告)日：2008-06-17
申请号：US11609806
申请日：2006-12-12
申请人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
IPC分类号： H05K7/00
CPC分类号： H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要： A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译： 提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。 该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板，使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接 该结构包括层压到作为外层的第一元件上的柔性基板，具有至少一个接合焊盘的柔性基板，以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板 在第二个元素上。
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公开(公告)号：US20080137317A1
公开(公告)日：2008-06-12
申请号：US11609806
申请日：2006-12-12
申请人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人： Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
CPC分类号： H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要： A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译： 提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。 该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板，使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接 该结构包括层压到作为外层的第一元件上的柔性基板，具有至少一个接合焊盘的柔性基板，以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板 在第二个元素上。
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公开(公告)号：US08054224B1
公开(公告)日：2011-11-08
申请号：US12913093
申请日：2010-10-27
IPC分类号： H01Q3/00
摘要： A method and apparatus for creating an antenna system. A configuration for a plurality of antenna cells is selected for an antenna in the antenna system. Each antenna cell in the plurality of antenna cells comprises a plurality of antenna elements having a symmetric arrangement. A portion of antenna elements in the plurality of antenna elements for each antenna cell in the plurality of antenna cells on a substrate is selected to transmit electromagnetic waves.
摘要翻译： 一种用于创建天线系统的方法和装置。 在天线系统中为天线选择多个天线小区的配置。 多个天线单元中的每个天线单元包括具有对称布置的多个天线元件。 选择在基板上的多个天线单元中的每个天线单元的多个天线元件中的天线元件的一部分，以发射电磁波。
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公开(公告)号：US5298288A
公开(公告)日：1994-03-29
申请号：US987502
申请日：1992-12-07
IPC分类号： B05D3/02 , C04B41/00 , C04B41/48 , C04B41/80 , C04B41/83 , C09J179/08 , H01L21/48 , H05K3/00 , B05D5/12
CPC分类号： C04B41/009 , B05D3/0254 , C04B41/0072 , C04B41/488 , C04B41/80 , C04B41/83 , C09J179/08 , H01L21/481 , C04B2111/00844 , C04B2111/92 , H05K3/0091
摘要： A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove moisture, curtain coated with a single coating of a viscous heat curable liquid dielectric such as polyimide, and heated to cure the dielectric by increasing the temperature at most 15.degree. C. per minute to a predetermined cure temperature not exceeding 450.degree. C. The invention is well suited for fabricating a dielectric layer in a high density multichip module.
摘要翻译： 涂覆有液体电介质的单个涂层的多孔基底幕，其被固化成至少15微米厚的均匀度小于5微米的良好粘附的膜。 清洁基底以除去污染物，加热以除去水分，用单一涂层的粘性可热固化液体电介质如聚酰亚胺帘幕涂布，并加热以通过将每分钟最高15℃的温度升高至 预定的固化温度不超过450℃。本发明非常适用于制造高密度多芯片模块中的介电层。
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