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1.
公开(公告)号:US07388756B1
公开(公告)日:2008-06-17
申请号:US11609806
申请日:2006-12-12
申请人: Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人: Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
IPC分类号: H05K7/00
CPC分类号: H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译: 提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。 该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板,使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接 该结构包括层压到作为外层的第一元件上的柔性基板,具有至少一个接合焊盘的柔性基板,以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板 在第二个元素上。
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2.
公开(公告)号:US20080137317A1
公开(公告)日:2008-06-12
申请号:US11609806
申请日:2006-12-12
申请人: Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
发明人: Robert T. Worl , Bruce L. Blaser , Peter T. Heisen , Julio A. Navarro , Douglas A. Pietila , Scott A. Raby , Jimmy S. Takeuchi
CPC分类号: H05K1/118 , H01L2924/19107 , H01R12/52 , H01R12/62 , H05K1/0237 , H05K3/361 , H05K3/4691 , H05K2201/09081 , H05K2201/09109 , H05K2201/09318 , H05K2203/049
摘要: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.
摘要翻译: 提供了一种使用柔性基板在第一元件和第二元件之间产生成角度的RF连接的方法和结构。 该方法包括将柔性基板层压到第一元件上; 弯曲柔性基板,使得柔性基板上的接合焊盘处于与第二元件上的接合焊盘相似的平面中; 以及通过将所述接合焊盘引导到所述柔性基板上的所述接合焊盘和所述第二元件上的所述接合焊盘来产生所述成角度的RF连接 该结构包括层压到作为外层的第一元件上的柔性基板,具有至少一个接合焊盘的柔性基板,以及能够以与焊盘相同的平面将接合焊盘放置在一起的角度弯曲的柔性基板 在第二个元素上。
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公开(公告)号:US20080316139A1
公开(公告)日:2008-12-25
申请号:US11765332
申请日:2007-06-19
申请人: Bruce Larry Blaser , Peter Timothy Heisen , Richard N. Bostwick , John B. O'Connell , Stephen Lee Fahley , Julio A. Navarro , Mark Richard Davis , Harold Peter Soares, JR. , Scott A. Raby , Jimmy S. Takeuchi
发明人: Bruce Larry Blaser , Peter Timothy Heisen , Richard N. Bostwick , John B. O'Connell , Stephen Lee Fahley , Julio A. Navarro , Mark Richard Davis , Harold Peter Soares, JR. , Scott A. Raby , Jimmy S. Takeuchi
CPC分类号: H01Q21/064 , H01Q21/0006 , H01Q21/0037
摘要: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.
摘要翻译: 包括多个微波模块,控制层,安装层和信号分布层的天线阵列核心。 控制层能够向多个微波模块分配控制信号。 多个微波模块附接到安装层的上表面,并且安装层由能够冷却多个微波模块的导热材料制成。 所述信号分配层位于所述安装层的下方,其中所述信号分布层能够向所述多个微波模块发送微波信号,并且其中所述多个微波模块在所述安装层,所述控制层和所述波形 分配网络形成天线核心的分层架构。 该体系结构是平衡,尺寸,热控制,可制造性,成本和性能之间的平衡,以便成为独特的解决方案。
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公开(公告)号:US07889135B2
公开(公告)日:2011-02-15
申请号:US11765332
申请日:2007-06-19
申请人: Bruce Larry Blaser , Peter Timothy Heisen , Richard N. Bostwick , John B. O'Connell , Stephen Lee Fahley , Julio A. Navarro , Mark Richard Davis , Harold Peter Soares, Jr. , Scott A. Raby , Jimmy S. Takeuchi
发明人: Bruce Larry Blaser , Peter Timothy Heisen , Richard N. Bostwick , John B. O'Connell , Stephen Lee Fahley , Julio A. Navarro , Mark Richard Davis , Harold Peter Soares, Jr. , Scott A. Raby , Jimmy S. Takeuchi
IPC分类号: H01Q1/38
CPC分类号: H01Q21/064 , H01Q21/0006 , H01Q21/0037
摘要: An antenna array core comprising a plurality of microwave modules, a control layer, a mounting layer, and a signal distribution layer. The control layer is capable of distributing control signals to the plurality of microwave modules. The plurality of microwave modules are attached to an upper surface of the mounting layer and the mounting layer is made from a heat conductive material capable of cooling the plurality of microwave modules. The signal distribution layer is located below the mounting layer, wherein the signal distribution layer is capable of transmitting microwave signals to the plurality of microwave modules and wherein the arrangement of the plurality of microwave modules on the mounting layer, the control layer, and the wave distribution network form a layered architecture for the antenna core. The architecture is a balance between, size, thermal control, manufacturability, cost, and performance so as to be a unique solution.
摘要翻译: 包括多个微波模块,控制层,安装层和信号分布层的天线阵列核心。 控制层能够向多个微波模块分配控制信号。 多个微波模块附接到安装层的上表面,并且安装层由能够冷却多个微波模块的导热材料制成。 所述信号分配层位于所述安装层的下方,其中所述信号分布层能够向所述多个微波模块发送微波信号,并且其中所述多个微波模块在所述安装层,所述控制层和所述波形 分配网络形成天线核心的分层架构。 该体系结构是平衡,尺寸,热控制,可制造性,成本和性能之间的平衡,以便成为独特的解决方案。
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公开(公告)号:US20090140751A1
公开(公告)日:2009-06-04
申请号:US11999061
申请日:2007-12-04
IPC分类号: G01R27/04
摘要: A microwave paint thickness sensor includes a single cylindrical cavity, a microwave source, and a signal detector. The cylindrical cavity is open at one end, the open end having a choke joint for interfacing with a painted surface. The cylindrical cavity is designed so that the electronic field is normal to the painted surface. In a preferred embodiment, this is accomplished by providing an optimally designed TM011 mode cavity. In this configuration, the resonant frequency of the cavity is linearly related to the inverse of the paint thickness. In accordance with one aspect of the present invention, the resonant cavity is optimally sized to resonate at a frequency where the sensor footprint can be minimized. Thus with the use of the choke joint, the small sensor interface area of the present invention may easily be applied to a curved surface.
摘要翻译: 微波涂料厚度传感器包括单个圆柱形腔,微波源和信号检测器。 圆柱形腔在一端开口,开口端具有与涂漆表面对接的扼流圈。 圆柱形腔被设计成使电子场垂直于涂漆表面。 在优选实施例中,这是通过提供最佳设计的TM011模式腔实现的。 在这种构造中,空腔的谐振频率与涂层厚度的倒数线性相关。 根据本发明的一个方面,谐振腔的最大尺寸使得能够以可以最小化传感器覆盖区的频率谐振。 因此,通过使用扼流圈,本发明的小传感器接口区域可以容易地应用于弯曲表面。
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公开(公告)号:US08344820B1
公开(公告)日:2013-01-01
申请号:US13007947
申请日:2011-01-17
申请人: Ming Chen , Jimmy S. Takeuchi
发明人: Ming Chen , Jimmy S. Takeuchi
IPC分类号: H01P1/387
CPC分类号: H01P1/387
摘要: A circulator/isolator assembly is disclosed. The assembly includes a first magnetic substrate having first surface and a second surface and a first ground plane formed on the first surface. A dielectric layer is disposed adjacent first magnetic substrate. The dielectric layer includes a multi-port junction circuit coupled to transmission traces. One of the traces forms an input port and another forms an output port. A first magnet is disposed proximate the multi-port junction circuit of the dielectric layer. The first magnet excites a circular, unidirectional magnetic flux field in the first magnetic substrate that limits electromagnetic wave propagation to a single direction.
摘要翻译: 公开了一种循环器/隔离器组件。 该组件包括具有第一表面和第二表面的第一磁性基底和形成在第一表面上的第一接地平面。 电介质层设置在第一磁性基片附近。 电介质层包括耦合到透射迹线的多端口结电路。 其中一条迹线形成一个输入端口,另一条形成输出端口。 第一磁体设置在电介质层的多端口结电路附近。 第一磁体在第一磁性基板中激发圆形的单向磁通场,其将电磁波传播限制到单个方向。
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公开(公告)号:US07898265B2
公开(公告)日:2011-03-01
申请号:US11999061
申请日:2007-12-04
IPC分类号: G01R27/04
摘要: A microwave paint thickness sensor includes a single cylindrical cavity, a microwave source, and a signal detector. The cylindrical cavity is open at one end, the open end having a choke joint for interfacing with a painted surface. The cylindrical cavity is designed so that the electronic field is normal to the painted surface. In a preferred embodiment, this is accomplished by providing an optimally designed TM011 mode cavity. In this configuration, the resonant frequency of the cavity is linearly related to the inverse of the paint thickness. In accordance with one aspect of the present invention, the resonant cavity is optimally sized to resonate at a frequency where the sensor footprint can be minimized. Thus with the use of the choke joint, the small sensor interface area of the present invention may easily be applied to a curved surface.
摘要翻译: 微波涂料厚度传感器包括单个圆柱形腔,微波源和信号检测器。 圆柱形腔在一端开口,开口端具有与涂漆表面对接的扼流圈。 圆柱形腔被设计成使电子场垂直于涂漆表面。 在优选实施例中,这是通过提供最佳设计的TM011模式腔实现的。 在这种构造中,空腔的谐振频率与涂层厚度的倒数线性相关。 根据本发明的一个方面,谐振腔的最大尺寸使得能够以可以最小化传感器覆盖区的频率谐振。 因此,通过使用扼流圈,本发明的小传感器接口区域可以容易地应用于弯曲表面。
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公开(公告)号:US4559489A
公开(公告)日:1985-12-17
申请号:US537696
申请日:1983-09-30
摘要: A multi-port power controller uses remote-controllable variable reactive elements to set the amount of power delivered to the ports.
摘要翻译: 多端口功率控制器使用远程可控可变无功元件来设置传送到端口的功率量。
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