摘要:
A digital-to-analog converter (DAC) for converting a digital signal to an analog signal includes a first thermometer decoder and a second thermometer decoder. The first thermometer decoder is configured to decode most-significant bits (MSBs) of the digital signal to generate a first thermometer code. The second thermometer decoder is configured to decode middle bits of the digital signal to generate a second thermometer code. The DAC further includes a plurality of macro cells with each controlled by one bit of the first thermometer code. The plurality of macro cells is configured to provide a first analog signal according to the first thermometer code. The DAC further includes a macro cell configured to provide a second analog signal according to the second thermometer code. The macro cell is further configured to provide a third analog signal according to least-significant bits (LSBs) of the digital signal.
摘要:
A digital-to-analog converter (DAC) for converting a digital signal to an analog signal includes a first thermometer decoder and a second thermometer decoder. The first thermometer decoder is configured to decode most-significant bits (MSBs) of the digital signal to generate a first thermometer code. The second thermometer decoder is configured to decode middle bits of the digital signal to generate a second thermometer code. The DAC further includes a plurality of macro cells with each controlled by one bit of the first thermometer code. The plurality of macro cells is configured to provide a first analog signal according to the first thermometer code. The DAC further includes a macro cell configured to provide a second analog signal according to the second thermometer code. The macro cell is further configured to provide a third analog signal according to least-significant bits (LSBs) of the digital signal.
摘要:
A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.
摘要:
A word line decoder comprises a plurality of driver circuits, a plurality of word lines provided at respective outputs of the driver circuits, and a plurality of primary input lines coupled to the driver circuits and oriented in a first direction. The word line decoder also comprises a plurality of secondary input lines coupled to the driver circuits and oriented in the first direction. The word line decoder also comprises a local decode line coupled to each of the primary input lines. The word line decoder also comprises a decode line coupled to the local decode line and oriented in the first direction. A cluster decode line is coupled to the decode line. The word line decoder is configured to select at least one of the word lines based on signals provided by the cluster decode line and the secondary input lines.
摘要:
A semiconductor device comprises first, second, and third. The first conductor is a gate conductor formed above an oxide region over a substrate and having a contact. The second conductor is coupled to the contact and extends across a width of the oxide region. The second conductor has a lower resistance than the gate conductor. The third conductor is a word line conductor. The second conductor is routed to not intersect the word line conductor.
摘要:
A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias.