Colloidal silica composite films for premetal dielectric applications
    2.
    发明授权
    Colloidal silica composite films for premetal dielectric applications 失效
    用于金属前介电应用的胶体二氧化硅复合膜

    公开(公告)号:US06967172B2

    公开(公告)日:2005-11-22

    申请号:US10680026

    申请日:2003-10-07

    IPC分类号: H01L21/316 H01L21/302

    摘要: A colloidal suspension of nanoparticles composed of a dense material dispersed in a solvent is used in forming a gap-filling dielectric material with low thermal shrinkage. The dielectric material is particularly useful for pre-metal dielectric and shallow trench isolation applications. According to the methods of forming a dielectric material, the colloidal suspension is deposited on a substrate and dried to form a porous intermediate layer. The intermediate layer is modified by infiltration with a liquid phase matrix material, such as a spin-on polymer, followed by curing, by infiltration with a gas phase matrix material, followed by curing, or by curing alone, to provide a gap-filling, thermally stable, etch resistant dielectric material.

    摘要翻译: 使用由分散在溶剂中的致密材料构成的纳米颗粒的胶体悬浮液来形成具有低热收缩率的间隙填充介电材料。 电介质材料特别适用于预金属电介质和浅沟槽隔离应用。 根据形成电介质材料的方法,将胶体悬浮液沉积在基底上并干燥以形成多孔中间层。 通过用液相基质材料(例如旋涂聚合物)渗透,然后通过用气相基质材料渗透,随后固化,或通过单独固化来改性中间层,从而提供间隙填充 ,耐热稳定的,耐蚀刻的介电材料。