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    Method of chemical mechanical polishing a substrate
    1.
    发明授权
    Method of chemical mechanical polishing a substrate 有权
    化学机械抛光底物的方法

    公开(公告)号：US09102034B2

    公开(公告)日：2015-08-11

    申请号：US14014498

    申请日：2013-08-30

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Michelle Jensen ,  Bainian Qian ,  Fengji Yeh ,  Marty W. DeGroot ,  Mohammad T. Islam ,  Matthew Richard Van Hanehem ,  Darrell String ,  James Murnane ,  Jeffrey James Hendron ,  John G. Nowland

    IPC分类号： B24B37/24 ,  B24B1/00 ,  C08G18/10 ,  H01L21/321 ,  H01L21/306 ,  B24B37/20 ,  B24B37/22

    CPC分类号： B24B37/24 ,  B24B1/00 ,  B24B37/205 ,  B24B37/22 ,  C08G18/10 ,  H01L21/30625 ,  H01L21/3212

    摘要： A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

    摘要翻译： 提供了一种化学机械抛光衬底的方法，包括：提供衬底; 提供一种化学机械抛光垫，包括：具有组成和抛光表面的抛光层，其中选择抛光层的组成以显示初始水解稳定性; 加上持续的水解不稳定性; 具有顶表面和底表面的刚性层; 插入在抛光层的基面和刚性层的顶表面之间的热熔胶; 其中所述热熔粘合剂将所述抛光层粘合到所述刚性层; 具有堆叠侧和压板侧的压敏压板粘合剂层; 其中压敏压板粘合剂层的堆叠侧与刚性层的底表面相邻; 并且在抛光表面和衬底之间产生动态接触以抛光衬底的表面。

    METHOD OF CHEMICAL MECHANICAL POLISHING A SUBSTRATE
    2.
    发明申请
    METHOD OF CHEMICAL MECHANICAL POLISHING A SUBSTRATE 有权
    化学机械抛光方法

    公开(公告)号：US20150065014A1

    公开(公告)日：2015-03-05

    申请号：US14014498

    申请日：2013-08-30

    申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials CMP Holdings, Inc.

    发明人： Michelle Jensen ,  Bainian Qian ,  Fengji Yeh ,  Marty W. DeGroot ,  Mohammad T. Islam ,  Matthew Richard Van Hanehem ,  Darrell String ,  James Murnane ,  Jeffrey James Hendron ,  John G. Nowland

    IPC分类号： B24B37/24 ,  B24B37/22 ,  B24B37/20

    CPC分类号： B24B37/24 ,  B24B1/00 ,  B24B37/205 ,  B24B37/22 ,  C08G18/10 ,  H01L21/30625 ,  H01L21/3212

    摘要： A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

    摘要翻译： 提供了一种化学机械抛光衬底的方法，包括：提供衬底; 提供一种化学机械抛光垫，包括：具有组成和抛光表面的抛光层，其中选择抛光层的组成以显示初始水解稳定性; 加上持续的水解不稳定性; 具有顶表面和底表面的刚性层; 插入在抛光层的基面和刚性层的顶表面之间的热熔胶; 其中所述热熔粘合剂将所述抛光层粘合到所述刚性层; 具有堆叠侧和压板侧的压敏压板粘合剂层; 其中压敏压板粘合剂层的堆叠侧与刚性层的底表面相邻; 并且在抛光表面和衬底之间产生动态接触以抛光衬底的表面。