公开(公告)号：US10114288B2

公开(公告)日：2018-10-30

申请号：US15254935

申请日：2016-09-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Li Cui ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/11 ,  G03F7/075 ,  C08F20/14 ,  C08F20/28 ,  C08F20/32 ,  C08F24/00 ,  C08G67/00 ,  C08G73/12 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  G03F7/16 ,  G03F7/20 ,  G03F7/30 ,  G03F7/42 ,  C08F20/10 ,  C08F220/14 ,  C08F220/20 ,  C08F220/24 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F220/18 ,  C08F220/28 ,  C08F220/32

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US10007184B2

公开(公告)日：2018-06-26

申请号：US15254929

申请日：2016-09-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Li Cui ,  Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/42 ,  G03F7/11 ,  G03F7/16 ,  G03F7/20 ,  G03F7/30 ,  C08F16/10 ,  C08F24/00 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  C08G63/08 ,  C08F20/14 ,  C08F20/30 ,  C08F20/06

CPC classification number: G03F7/11 ,  C08F16/10 ,  C08F20/06 ,  C08F20/10 ,  C08F20/14 ,  C08F20/30 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/34 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G63/08 ,  C08G77/04 ,  C08G77/20 ,  C08G77/80 ,  C09D5/20 ,  C09D183/04 ,  G03F7/0752 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422 ,  G03F7/423 ,  C08K5/19 ,  C08L33/14

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US20180059547A1

公开(公告)日：2018-03-01

申请号：US15254935

申请日：2016-09-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Li Cui ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/11 ,  G03F7/16 ,  G03F7/42 ,  G03F7/20 ,  G03F7/30 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  C08F20/14 ,  C08F24/00 ,  C08G73/12 ,  C08F20/32 ,  C08G67/00 ,  C08F20/28

CPC classification number: G03F7/11 ,  C08F20/10 ,  C08F20/14 ,  C08F20/28 ,  C08F20/32 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/24 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G67/00 ,  C08G73/128 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  G03F7/0752 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422 ,  G03F7/423

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US20130164545A1

公开(公告)日：2013-06-27

申请号：US13705677

申请日：2012-12-05

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Jessica P. Evans ,  Christopher P. Sullivan

IPC: C09D5/00

CPC classification number: C09D5/006 ,  B05D5/06 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/24 ,  C08L83/06 ,  C09D4/00 ,  C09D183/06 ,  C09D183/08 ,  G03F7/0752 ,  G03F7/091 ,  Y10T428/31663

Abstract: A composition comprising the following: A) a cure catalyst selected from Formula A: [NR1′R2′R3′R4′]+X−  (Formula A), R1′, R2′, R3′, R4′ are each independently selected from hydrogen, alkyl, substituted alkyl, aryl, or substituted aryl; X is a monovalent anion, and wherein at least one of R1′, R2′, R3′ or R4′ is a methyl; and B) a prepolymer formed from a first composition comprising: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; R1, R2, R3 are described herein; Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; R4, R5, R6 are described herein; Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; R7, R8, R9 described herein; and R10, R11, R12, R13 described herein.

Abstract translation: 一种组合物，其包含以下物质：A）选自式A的固化催化剂：[NR1'R2'R3'R4'] + X-（式A），R1'，R2'，R3'，R4'各自独立地选自 氢，烷基，取代的烷基，芳基或取代的芳基; X是一价阴离子，其中R1'，R2'，R3'或R4'中的至少一个是甲基; 和B）由第一组合物形成的预聚物，其包含：Ra包含一个或多个多重键，条件是如果Ra包含多于多个键，则这些多重键不是共轭构型; R1，R2，R3在本文中描述; Rb选自H或包含烷基，亚烷基或亚烷基的饱和基团; R4，R5，R6在本文中描述; Rc包含多于一个多键，并且这些多键是共轭构型; 本文所述的R7，R8，R9; 和R 10，R 11，R 12，R 13。

公开(公告)号：US20180253006A1

公开(公告)日：2018-09-06

申请号：US15971103

申请日：2018-05-04

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Li Cui ,  Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/11 ,  G03F7/20 ,  C08F24/00 ,  C08F20/06 ,  C08F16/10 ,  C08F20/30 ,  C08F20/14 ,  C08G63/08 ,  C09D183/04 ,  C09D5/20 ,  C08G77/04 ,  G03F7/42 ,  G03F7/16 ,  G03F7/30

CPC classification number: G03F7/11 ,  C08F16/10 ,  C08F20/06 ,  C08F20/10 ,  C08F20/14 ,  C08F20/30 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/34 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G63/08 ,  C08G77/04 ,  C08G77/20 ,  C08G77/80 ,  C09D5/20 ,  C09D183/04 ,  G03F7/0752 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422 ,  G03F7/423 ,  C08K5/19 ,  C08L33/14

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US20180059546A1

公开(公告)日：2018-03-01

申请号：US15254929

申请日：2016-09-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Li Cui ,  Charlotte A. Cutler ,  Suzanne M. Coley ,  Owendi Ongayi ,  Christopher P. Sullivan ,  Paul J. LaBeaume ,  Shintaro Yamada ,  Mingqi Li ,  James F. Cameron

IPC: G03F7/11 ,  G03F7/16 ,  G03F7/42 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  C08G63/08 ,  C08F20/14 ,  C08F20/30 ,  C08F16/10 ,  C08F20/06 ,  C08F24/00 ,  G03F7/20 ,  G03F7/30

CPC classification number: G03F7/11 ,  C08F16/10 ,  C08F20/06 ,  C08F20/10 ,  C08F20/14 ,  C08F20/30 ,  C08F24/00 ,  C08F220/14 ,  C08F220/20 ,  C08F220/34 ,  C08F222/06 ,  C08F222/40 ,  C08F230/08 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1891 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/325 ,  C08F2800/10 ,  C08G63/08 ,  C08G77/04 ,  C09D5/20 ,  C09D183/04 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/422

Abstract: Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising Si—O linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

公开(公告)号：US09068086B2

公开(公告)日：2015-06-30

申请号：US13705677

申请日：2012-12-05

Applicant: Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

Inventor： Jessica P. Evans ,  Christopher P. Sullivan

IPC: C08G77/08 ,  C09D5/00 ,  B05D5/06 ,  C09D4/00 ,  C08G77/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  G03F7/075 ,  G03F7/09 ,  C09D183/06 ,  C08L83/06 ,  C09D183/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20

CPC classification number: C09D5/006 ,  B05D5/06 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/24 ,  C08L83/06 ,  C09D4/00 ,  C09D183/06 ,  C09D183/08 ,  G03F7/0752 ,  G03F7/091 ,  Y10T428/31663

Abstract: A composition comprising the following: A) a cure catalyst selected from Formula A: [NR1′R2′R3′R4′]+X−  (Formula A), R1′, R2′, R3′, R4′ are each independently selected from hydrogen, alkyl, substituted alkyl, aryl, or substituted aryl; X is a monovalent anion, and wherein at least one of R1′, R2′, R3′ or R4′ is a methyl; and B) a prepolymer formed from a first composition comprising: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; R1, R2, R3 are described herein; Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; R4, R5, R6 are described herein; Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; R7, R8, R9 are described herein; and R10, R11, R12, R13 described herein.

Abstract translation: 一种组合物，其包含以下物质：A）选自式A的固化催化剂：[NR1'R2'R3'R4'] + X-（式A），R1'，R2'，R3'，R4'各自独立地选自 氢，烷基，取代的烷基，芳基或取代的芳基; X是一价阴离子，其中R1'，R2'，R3'或R4'中的至少一个是甲基; 和B）由第一组合物形成的预聚物，其包含：Ra包含一个或多个多重键，条件是如果Ra包含多于多个键，则这些多重键不是共轭构型; R1，R2，R3在本文中描述; Rb选自H或包含烷基，亚烷基或亚烷基的饱和基团; R4，R5，R6在本文中描述; Rc包含多于一个多键，并且这些多键是共轭构型; 本文描述了R7，R8，R9; 和R 10，R 11，R 12，R 13。