公开(公告)号：US09345139B2

公开(公告)日：2016-05-17

申请号：US13490245

申请日：2012-06-06

申请人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

发明人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

IPC分类号： H05K1/18 ,  H05K7/20 ,  H05K5/00 ,  F16H61/00 ,  H05K1/02 ,  H05K3/32

CPC分类号： H05K1/18 ,  F16H61/0006 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/325 ,  H05K5/0082 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2203/1147 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

摘要翻译： 描述了使用具有至少一个壳体部分和多层印刷电路板的控制模块作为壳体的内部空间与位于壳体部分外部的部件之间的电连接。 多层印刷电路板是用于电子电路的电气部件的载体，并且同时与用于传输的壳体部分和/或冷却元件，特别是变速器的液压板的热接触 控制安装在自动变速器中。

公开(公告)号：US08488324B2

公开(公告)日：2013-07-16

申请号：US12452126

申请日：2008-05-13

申请人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

发明人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34 ,  H01L23/26

CPC分类号： H05K1/18 ,  F16H61/0006 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/325 ,  H05K5/0082 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2203/1147 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.

摘要翻译： 电气控制单元具有印刷电路板基板，电子电路位于该印刷电路板基板上，该电路包括通过印刷电路板基板的印刷导体互连的多个电气部件，以及用于覆盖印刷电路板基板上的电气部件的外壳部件 印刷电路板基板和位于印刷电路板基板上的至少一个设备插头连接器部分，位于印刷电路板基板的被壳体部分覆盖的部分之外。 在由至少一个壳体部分覆盖的部分外部以及设置有设备插头连接器部分的印刷电路板基板的部分外部，用于附加电气部件的至少一个接触点位于印刷电路板基板上。

公开(公告)号：US20120240396A1

公开(公告)日：2012-09-27

申请号：US13490245

申请日：2012-06-06

申请人： Rolf BECKER ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

发明人： Rolf BECKER ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

IPC分类号： H05K3/32 ,  H05K3/30 ,  H05K3/28

CPC分类号： H05K1/18 ,  F16H61/0006 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/325 ,  H05K5/0082 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2203/1147 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

摘要翻译： 描述了使用具有至少一个壳体部分和多层印刷电路板的控制模块作为壳体的内部空间与位于壳体部分外部的部件之间的电连接。 多层印刷电路板是用于电子电路的电气部件的载体，并且同时与用于传输的壳体部分和/或冷却元件，特别是变速器的液压板的热接触 控制安装在自动变速器中。

公开(公告)号：US20100202110A1

公开(公告)日：2010-08-12

申请号：US12452126

申请日：2008-05-13

申请人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

发明人： Rolf Becker ,  Christian Lammers ,  Juergen Jerg ,  Joachim Wolff ,  Volker Hochholzer ,  Ulrich Trescher ,  Helmut Bubeck ,  Klaus Voigtlaender ,  Jan Benzler ,  Thomas Raica ,  Willi Kuehn ,  Thomas Wiesa ,  Michael Krapp

IPC分类号： H05K7/20 ,  H05K5/00

CPC分类号： H05K1/18 ,  F16H61/0006 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/325 ,  H05K5/0082 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2203/1147 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Electric control units are known having a printed circuit board substrate 2 on which an electronic circuit 9 is situated which includes multiple electrical components 11 which are interconnected via printed conductors 12 of the printed circuit board substrate, housing parts 3, 4 for covering the electrical components on the printed circuit board substrate and at least one device plug connector part 6 which is electrically connected to the components and situated on the printed circuit board substrate outside the section of the printed circuit board substrate 2 covered by the housing parts 3, 4, the electrical connections between the components and the device plug connector part being established via printed conductors 14 of the printed circuit board substrate. It is proposed that, outside the section covered by the at least one housing part 3, 4 and outside the section of the printed circuit board substrate 2 provided with the device plug connector part 6, at least one contact point 21, 22 for an additional electrical component 7, 8 is situated on the printed circuit board substrate 2.

摘要翻译： 已知电控单元具有印刷电路板基板2，电子电路9位于该印刷电路板基板2上，该电路板基板2包括通过印刷电路板基板的印刷导体12相互连接的多个电气部件11，用于覆盖电气部件的壳体部件3,4 在印刷电路板基板上以及至少一个器件插头连接器部件6，该器件插头连接器部件6电连接到部件并且位于印刷电路板基板上的外壳部件3,4覆盖的印刷电路板基板2的外部的外部， 通过印刷电路板基板的印刷导体14建立部件和设备插头连接器部件之间的电连接。 建议在由至少一个壳体部分3,4覆盖的部分外部以及设置有装置插头连接器部分6的印刷电路板基板2的部分外部，至少一个接触点21,22用于附加 电气部件7,8位于印刷电路板基板2上。

公开(公告)号：US06678948B1

公开(公告)日：2004-01-20

申请号：US09530536

申请日：2000-12-11

申请人： Jan Benzler ,  Albert-Andreas Hoebel ,  Gerhard Schmidt ,  Stefan Rupprecht ,  Thomas Ruzicka ,  Reiner Schuetz ,  Jiang Hongquan

发明人： Jan Benzler ,  Albert-Andreas Hoebel ,  Gerhard Schmidt ,  Stefan Rupprecht ,  Thomas Ruzicka ,  Reiner Schuetz ,  Jiang Hongquan

IPC分类号： H05K334

CPC分类号： H05K3/3436 ,  H01L22/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0269 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper surface of the carrier substrate. A solder bump is deposited on at least one of the pads to be connected, the component is alignedly mated with the carrier substrate, and the at least one solder bump is soldered in order to wet the contact surfaces. It is provided that during the soldering, the at least one solder bump is deformed within the contacting plane in such a way as to achieve a degree of deformation that permits the two-dimensional analysis of said degree of deformation by a radiograph of the interconnection site.

摘要翻译： 描述了将电子部件连接到载体基板的方法。 至少一个部件的焊盘导电地连接到载体衬底的上表面上的至少一个焊盘。 焊料凸块沉积在待连接的焊盘中的至少一个焊盘上，该部件与载体衬底对准地配合，并且焊接至少一个焊料凸点以便使接触表面湿润。提供在焊接期间 所述至少一个焊料凸块在所述接触平面内变形，以便实现允许通过所述互连部位的X射线来对所述变形程度进行二维分析的一定程度的变形。