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    Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
    1.
    发明申请
    Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array 有权
    用于在测试仪与被测试的多个器件之间处理信号的装置，系统和方法在高温下并且具有探针阵列的单次触地

    公开(公告)号：US20070247140A1

    公开(公告)日：2007-10-25

    申请号：US11410699

    申请日：2006-04-24

    申请人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Puente ,  John Andberg

    发明人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Puente ,  John Andberg

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2889

    摘要： Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.

    摘要翻译： 设备用于在测试仪和被测设备之间处理信号。 在一个实施例中，该装置包括至少一个多芯片模块。 每个多芯片模块在一组连接器与测试器之间具有多个微机电开关，以及一组连接器到被测器件。 提供至少一个驱动器以操作每个微机电开关。 公开了一种在测试仪和被测器件之间处理信号的方法。 在一个实施例中，该方法包括用至少一个多芯片模块连接测试器和被测设备。 所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。 该方法包括操作每个微机电开关。 还公开了其他实施例。

    APPARATUS AND SYSTEMS FOR PROCESSING SIGNALS BETWEEN A TESTER AND A PLURALITY OF DEVICES UNDER TEST
    2.
    发明申请
    APPARATUS AND SYSTEMS FOR PROCESSING SIGNALS BETWEEN A TESTER AND A PLURALITY OF DEVICES UNDER TEST 审中-公开
    测试仪与测试仪器之间的信号处理信号的装置和系统

    公开(公告)号：US20110089966A1

    公开(公告)日：2011-04-21

    申请号：US12974950

    申请日：2010-12-21

    申请人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Dela Puente ,  John Andberg

    发明人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Dela Puente ,  John Andberg

    IPC分类号： G01R31/00

    CPC分类号： G01R31/2889

    摘要： Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. Other embodiments are also disclosed.

    摘要翻译： 设备用于在测试仪和被测设备之间处理信号。 在一个实施例中，该装置包括至少一个多芯片模块。 每个多芯片模块在一组连接器与测试器之间具有多个微机电开关，以及一组连接器到被测器件。 提供至少一个驱动器以操作每个微机电开关。 还公开了其他实施例。

    Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
    3.
    发明授权
    Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array 有权
    用于在测试仪与被测试的多个器件之间处理信号的装置，系统和方法在高温下并且具有探针阵列的单次触地

    公开(公告)号：US07859277B2

    公开(公告)日：2010-12-28

    申请号：US11410699

    申请日：2006-04-24

    申请人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Dela Puente ,  John Andberg

    发明人： Romi Mayder ,  Pam Stellmacher ,  Edmundo Dela Puente ,  John Andberg

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2889

    摘要： Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.

    摘要翻译： 设备用于在测试仪和被测设备之间处理信号。 在一个实施例中，该装置包括至少一个多芯片模块。 每个多芯片模块在一组连接器与测试器之间具有多个微机电开关，以及一组连接器到被测器件。 提供至少一个驱动器以操作每个微机电开关。 公开了一种在测试仪和被测器件之间处理信号的方法。 在一个实施例中，该方法包括用至少一个多芯片模块连接测试器和被测设备。 所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。 该方法包括操作每个微机电开关。 还公开了其他实施例。

    Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment
    9.
    发明授权
    Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment 有权
    模拟晶圆，使用模拟晶圆校准的系统以及校准自动测试设备的方法

    公开(公告)号：US07323897B2

    公开(公告)日：2008-01-29

    申请号：US11014473

    申请日：2004-12-16

    申请人： Romi Mayder

    发明人： Romi Mayder

    IPC分类号： G01R31/26

    CPC分类号： G01R35/005 ,  G01R31/2886

    摘要： In one embodiment, a mock wafer for calibrating automated test equipment includes a printed circuit board having a number of interconnect areas, with each interconnect area having a pair of mock die pads that are coupled via a connecting trace. In another embodiment, a method for calibrating automated test equipment (ATE) may include coupling the mock wafer to the ATE, and then causing the ATE to i) index the mock wafer with respect to a test head connector, ii) couple a number of probes or the test head connector to a number of the mock wafer's mock die pads, iii) transmit a test signal between a pair of the probes that are coupled via a pair of mock die pads and connecting trace of the mock wafer, and iv) calibrate a selected signal path or paths of the ATE by recording a characteristic of the transmitted test signal.

    摘要翻译： 在一个实施例中，用于校准自动测试设备的模拟晶片包括具有多个互连区域的印刷电路板，每个互连区域具有通过连接迹线耦合的一对模拟管芯焊盘。 在另一个实施例中，用于校准自动化测试设备（ATE）的方法可以包括将模拟晶片耦合到ATE，然后使ATE相对于测试头连接器对模拟晶片进行索引，ii）将多个 探针或测试头连接器连接到多个模拟晶片的模拟芯片焊盘，iii）在通过一对模拟裸片焊盘和模拟晶片的连接迹线耦合的一对探针之间传输测试信号，以及iv） 通过记录发送的测试信号的特性来校准所选择的信号路径或ATE的路径。

    Zero insertion force printed circuit assembly connector system and method
    10.
    发明授权
    Zero insertion force printed circuit assembly connector system and method 有权
    零插入力印刷电路组件连接器系统和方法

    公开(公告)号：US07147499B1

    公开(公告)日：2006-12-12

    申请号：US11253446

    申请日：2005-10-19

    申请人： Romi Mayder ,  John W. Andberg ,  Don Chiu ,  Noriyuki Sugihara

    发明人： Romi Mayder ,  John W. Andberg ,  Don Chiu ,  Noriyuki Sugihara

    IPC分类号： H01R13/62

    CPC分类号： G01R31/2889

    摘要： In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.

    摘要翻译： 在一个实施例中，匹配电路组件通过1）将安装在第一和第二衬底中的至少一个上的至少第一插入件机械地和电耦合到配合电路组件而耦合到系统。 使用至少第一和第二弹簧机构实现机械和电耦合，其中第一和第二弹簧机构安装在连接器壳体与第一和第二基板中的相应的基板之间。 第一和第二基板中的至少一个在第一插入器和系统之间传输信号。 第一插入器通过在连接器壳体与第一和第二基板中的至少一个之间产生真空而与配合电路组件电气和机械地分离。 还公开了其他实施例。