公开(公告)号：US20120168801A1

公开(公告)日：2012-07-05

申请号：US13383211

申请日：2009-07-10

申请人： Rong Xuan ,  Chao-Wei Li ,  Hung-Lieh Hu ,  Mu-Tao Chu ,  Chih-Hao Hsu ,  Jenq-Dar Tsay

发明人： Rong Xuan ,  Chao-Wei Li ,  Hung-Lieh Hu ,  Mu-Tao Chu ,  Chih-Hao Hsu ,  Jenq-Dar Tsay

IPC分类号： H01L33/58 ,  H01L29/20 ,  H01L33/42

CPC分类号： H01L33/02 ,  H01L33/38 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device package structure includes a carrier, at least one light-emitting device and a magnetic element. The magnetic element aids in enhancing overall luminous output efficiency.

摘要翻译： 发光器件封装结构包括载体，至少一个发光器件和磁性元件。 磁性元件有助于提高整体的发光效率。

公开(公告)号：US20090179214A1

公开(公告)日：2009-07-16

申请号：US12146422

申请日：2008-06-25

申请人： Rong Xuan ,  Chih-Hao Hsu ,  Jenq-Dar Tsay ,  Mu-Tao Chu

发明人： Rong Xuan ,  Chih-Hao Hsu ,  Jenq-Dar Tsay ,  Mu-Tao Chu

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L24/32 ,  H01L33/14 ,  H01L33/20 ,  H01L33/22 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device with magnetic field includes a light-emitting structure and a first magnetic-source layer. The light-emitting structure includes a first doped structural layer, a second doped structural layer, an active layer between the two doped structural layers, a first electrode, and a second electrode. The first magnetic-source layer is integrated with the light-emitting structure to produce a magnetic field in the light-emitting structure. The magnetic field transversely shifts a driving current of the light-emitting structure to redistribute in the light-emitting structure.

摘要翻译： 具有磁场的发光器件包括发光结构和第一磁源层。 发光结构包括第一掺杂结构层，第二掺杂结构层，两个掺杂结构层之间的有源层，第一电极和第二电极。 第一磁源层与发光结构集成，以在发光结构中产生磁场。 磁场横向移动发光结构的驱动电流，以在发光结构中重新分布。

公开(公告)号：US07989818B2

公开(公告)日：2011-08-02

申请号：US12146422

申请日：2008-06-25

申请人： Rong Xuan ,  Chih-Hao Hsu ,  Jenq-Dar Tsay ,  Mu-Tao Chu

发明人： Rong Xuan ,  Chih-Hao Hsu ,  Jenq-Dar Tsay ,  Mu-Tao Chu

IPC分类号： H01L27/15

CPC分类号： H01L33/38 ,  H01L24/32 ,  H01L33/14 ,  H01L33/20 ,  H01L33/22 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device with magnetic field includes a light-emitting structure and a first magnetic-source layer. The light-emitting structure includes a first doped structural layer, a second doped structural layer, an active layer between the two doped structural layers, a first electrode, and a second electrode. The first magnetic-source layer is integrated with the light-emitting structure to produce a magnetic field in the light-emitting structure. The magnetic field transversely shifts a driving current of the light-emitting structure to redistribute in the light-emitting structure.

摘要翻译： 具有磁场的发光器件包括发光结构和第一磁源层。 发光结构包括第一掺杂结构层，第二掺杂结构层，两个掺杂结构层之间的有源层，第一电极和第二电极。 第一磁源层与发光结构集成，以在发光结构中产生磁场。 磁场横向移动发光结构的驱动电流，以在发光结构中重新分布。

公开(公告)号：US20100244085A1

公开(公告)日：2010-09-30

申请号：US12815432

申请日：2010-06-15

申请人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

发明人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

IPC分类号： H01L33/02 ,  H01L33/62 ,  H01L33/36

CPC分类号： H01L33/38 ,  H01L33/14 ,  H01L33/22 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A light emitting device including a light emitting chip and a magnetic material is provided. The light emitting chip includes a first doped semiconductor layer, a second doped semiconductor layer, and a light emitting semiconductor layer disposed between the first doped semiconductor layer and the second doped semiconductor layer. The magnetic material is disposed beside the light emitting chip, wherein the magnetic material is not disposed on a conducting path of a current causing the light emitting chip to emit light.

摘要翻译： 提供了包括发光芯片和磁性材料的发光器件。 发光芯片包括第一掺杂半导体层，第二掺杂半导体层和设置在第一掺杂半导体层和第二掺杂半导体层之间的发光半导体层。 磁性材料设置在发光芯片旁边，其中磁性材料不设置在导致发光芯片发光的电流的导电路径上。

公开(公告)号：US08502259B2

公开(公告)日：2013-08-06

申请号：US12815432

申请日：2010-06-15

申请人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

发明人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L33/14 ,  H01L33/22 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A light emitting device including a light emitting chip and a magnetic material is provided. The light emitting chip includes a first doped semiconductor layer, a second doped semiconductor layer, and a light emitting semiconductor layer disposed between the first doped semiconductor layer and the second doped semiconductor layer. The magnetic material is disposed beside the light emitting chip, wherein the magnetic material is not disposed on a conducting path of a current causing the light emitting chip to emit light.

摘要翻译： 提供了包括发光芯片和磁性材料的发光器件。 发光芯片包括第一掺杂半导体层，第二掺杂半导体层和设置在第一掺杂半导体层和第二掺杂半导体层之间的发光半导体层。 磁性材料设置在发光芯片旁边，其中磁性材料不设置在导致发光芯片发光的电流的导电路径上。

公开(公告)号：US20090179209A1

公开(公告)日：2009-07-16

申请号：US12117747

申请日：2008-05-09

申请人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

发明人： Rong Xuan ,  Jenq-Dar Tsay ,  Chih-Hao Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L24/32 ,  H01L33/14 ,  H01L33/20 ,  H01L33/22 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device is provided. In the present invention, a magnetic material is added to the light emitting device to change the current path and the distribution of the current density. As the main distribution of the current density is moved from the area between the electrodes to the area under light-out plane, the emitted light is no longer blocked by the electrodes, such that the light emitting efficiency can be enhanced and the distribution of the current density remains homogeneous.

摘要翻译： 提供了一种发光器件。 在本发明中，将磁性材料添加到发光器件中以改变电流路径和电流密度的分布。 由于电流密度的主要分布从电极之间的区域移动到发光面以下，所以发射的光不再被电极阻挡，从而能够提高发光效率， 电流密度保持均匀。

公开(公告)号：US08698166B2

公开(公告)日：2014-04-15

申请号：US12837513

申请日：2010-07-16

申请人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

发明人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

IPC分类号： H01L33/00

CPC分类号： H01L33/48 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

摘要翻译： 发光芯片封装模块包括衬底，发光芯片封装结构和磁性器件。 基板具有表面。 发光芯片封装结构设置在基板的表面上。 发光芯片封装结构包括载体，发光芯片和密封剂。 发光芯片设置在载体上并与其电连接。 密封剂设置在载体上并覆盖发光芯片。 磁性装置设置在发光芯片封装结构的旁边，以向发光芯片施加磁场。

公开(公告)号：US20120012868A1

公开(公告)日：2012-01-19

申请号：US12837513

申请日：2010-07-16

申请人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

发明人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

IPC分类号： H01L33/52 ,  H01L33/62 ,  H01L33/48

CPC分类号： H01L33/48 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

摘要翻译： 发光芯片封装模块包括衬底，发光芯片封装结构和磁性器件。 基板具有表面。 发光芯片封装结构设置在基板的表面上。 发光芯片封装结构包括载体，发光芯片和密封剂。 发光芯片设置在载体上并与其电连接。 密封剂设置在载体上并覆盖发光芯片。 磁性装置设置在发光芯片封装结构的旁边，以向发光芯片施加磁场。

公开(公告)号：US20100282304A1

公开(公告)日：2010-11-11

申请号：US12273501

申请日：2008-11-18

申请人： Ming-Hsien Wu ,  Wen-Yung Yeh ,  Rong Xuan ,  Wen-Yih Liao ,  Jung-Tsung Hsu ,  Mu-Tao Chu

发明人： Ming-Hsien Wu ,  Wen-Yung Yeh ,  Rong Xuan ,  Wen-Yih Liao ,  Jung-Tsung Hsu ,  Mu-Tao Chu

IPC分类号： H01L31/0256 ,  H01L31/00 ,  H01L31/02 ,  H01L31/18

CPC分类号： H01L31/0693 ,  H01L25/167 ,  H01L31/03044 ,  H01L31/03048 ,  H01L31/054 ,  H01L31/056 ,  H01L31/077 ,  H01L31/1852 ,  H01L31/1892 ,  H01L33/20 ,  H01L33/32 ,  H01L33/382 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02P70/521 ,  H01L2924/00

摘要： A bi-functional photovoltaic device is provided. The bi-functional photovoltaic device includes at least one solar cell and a control device. Each of the solar cell includes a multilayer semiconductor layer of group III-V compound semiconductor, a first electrode disposed on the back of the multilayer semiconductor layer, and a second electrode disposed on the front of the multilayer semiconductor layer. The control device connects with the at least one solar cell in order to control them functioning as solar cell or light emitting diode.

摘要翻译： 提供了一种双功能光伏器件。 双功能光伏器件包括至少一个太阳能电池和控制装置。 所述太阳能电池单元包括III-V族化合物半导体的多层半导体层，配置在所述多层半导体层的背面的第一电极和配置在所述多层半导体层的前方的第二电极。 控制装置与至少一个太阳能电池连接，以便控制它们作为太阳能电池或发光二极管起作用。

公开(公告)号：US20100244078A1

公开(公告)日：2010-09-30

申请号：US12813515

申请日：2010-06-11

申请人： Chih-Hao Hsu ,  Rong Xuan

发明人： Chih-Hao Hsu ,  Rong Xuan

IPC分类号： H01L33/46

CPC分类号： H01L33/38 ,  H01L24/32 ,  H01L33/14 ,  H01L33/20 ,  H01L33/22 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device package including a light emitting device and a magnetic ring is provided. The magnetic ring surrounds the light emitting device for forming a magnetic source for applying a magnetic field to the light emitting device.

摘要翻译： 提供了包括发光器件和磁环的发光器件封装。 磁环围绕发光器件，用于形成用于向发光器件施加磁场的磁源。