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    Light emitting chip package module and light emitting chip package structure and manufacturing method thereof
    2.
    发明授权
    Light emitting chip package module and light emitting chip package structure and manufacturing method thereof 有权
    发光芯片封装模块及其发光芯片封装结构及其制造方法

    公开(公告)号：US08698166B2

    公开(公告)日：2014-04-15

    申请号：US12837513

    申请日：2010-07-16

    申请人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

    发明人： Hsueh-Chih Chang ,  Rong Xuan ,  Chao-Wei Li ,  Chih-Hao Hsu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/48 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.

    摘要翻译： 发光芯片封装模块包括衬底，发光芯片封装结构和磁性器件。 基板具有表面。 发光芯片封装结构设置在基板的表面上。 发光芯片封装结构包括载体，发光芯片和密封剂。 发光芯片设置在载体上并与其电连接。 密封剂设置在载体上并覆盖发光芯片。 磁性装置设置在发光芯片封装结构的旁边，以向发光芯片施加磁场。

    Detachable LED module
    4.
    发明授权
    Detachable LED module 有权
    可拆卸LED模组

    公开(公告)号：US08814418B2

    公开(公告)日：2014-08-26

    申请号：US13565692

    申请日：2012-08-02

    申请人： Cheng-Da Shaw ,  Ya-Hui Chiang ,  Hung-Lieh Hu ,  Hsin-Yun Tsai ,  Chun-Hsing Lee ,  Chao-Wei Li

    发明人： Cheng-Da Shaw ,  Ya-Hui Chiang ,  Hung-Lieh Hu ,  Hsin-Yun Tsai ,  Chun-Hsing Lee ,  Chao-Wei Li

    IPC分类号： F21V23/06 ,  G02B6/42 ,  F21V19/00 ,  A61B1/06

    CPC分类号： F21V23/06 ,  A61B1/0661 ,  F21V19/003 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4292

    摘要： A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

    摘要翻译： 模块化照明装置包括保持基座，照明模块和导光元件。 保持基座包括弹性定位单元。 照明模块可移除地设置在保持基座上，并且具有滑动槽和保持槽。 光导元件设置在保持基座上并面向照明模块。 当照明模块沿着插入方向安装到固定座时，弹性定位单元从滑动槽滑动到保持槽，以将照明模块保持在保持基座中。

    CCT MODULATING METHOD, LED LIGHT SOURCE MODULE, AND PACKAGE STRUCTURE THEREOF
    6.
    发明申请
    CCT MODULATING METHOD, LED LIGHT SOURCE MODULE, AND PACKAGE STRUCTURE THEREOF 审中-公开
    CCT调制方法，LED光源模块及其包装结构

    公开(公告)号：US20120099303A1

    公开(公告)日：2012-04-26

    申请号：US12980351

    申请日：2010-12-29

    申请人： Chao-Wei Li ,  Ai-Lien Chang ,  Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu

    发明人： Chao-Wei Li ,  Ai-Lien Chang ,  Hsiang-Chi Chung ,  Ji-Feng Chen ,  Hung-Lieh Hu

    IPC分类号： F21V9/00

    CPC分类号： H05B33/086 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A correlated color temperature (CCT) modulating method including following steps is provided. A white LED light source is modulated to emit a first white light. At least one LED light source is modulated to emit a second white light, wherein the second white light includes at least one broad-spectrum monochromatic light. The first white light and the second white light are mixed to produce a third white light. The color rendering index (CRI) of the third white light is greater than those of the first white light and the second white light, and the color coordinates of the first white light, the second white light, and the third white light are different from each other. Furthermore, an LED light source module and a package structure thereof are also provided.

    摘要翻译： 提供了包括以下步骤的相关色温（CCT）调制方法。 白光LED光源被调制以发射第一白光。 至少一个LED光源被调制以发射第二白光，其中第二白光包括至少一个广谱单色光。 将第一白光和第二白光混合以产生第三白光。 第三白光的显色指数（CRI）大于第一白光和第二白光的显色指数（CRI），第一白光，第二白光和第三白光的色坐标不同于 彼此。 此外，还提供了LED光源模块及其封装结构。

    LIGHT EMITTING DIODE PACKAGE STRUCTURE
    10.
    发明申请
    LIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
    发光二极管封装结构

    公开(公告)号：US20130168714A1

    公开(公告)日：2013-07-04

    申请号：US13633878

    申请日：2012-10-03

    申请人： Chao-Wei Li ,  Hung-Lieh Hu

    发明人： Chao-Wei Li ,  Hung-Lieh Hu

    IPC分类号： H01L33/52 ,  H01L33/50

    CPC分类号： H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/648

    摘要： A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.

    摘要翻译： 提供了一种发光二极管封装结构，包括基板，密封组件，光学元件，至少一个发光二极管芯片和封装材料层。 密封组件设置在基板上。 光学元件设置在密封组件上，并且在光学元件，密封组件和基板之间形成封闭空间。 发光二极管芯片设置在基板上并位于封闭空间中。 包装材料层位于封闭空间中，并且至少设置在发光二极管芯片的上表面上，其中包装材料层包括具有高粘度的液体和多个固体颗粒，并且具有 高粘度大于3000mPa·s。