摘要:
A driver circuit for providing an output signal for switching an electrical load on and off has a field-effect transistor having a gate terminal and an output for providing the output signal to the electrical load, a buffer circuit connected to the gate terminal of the field-effect transistor to impress a charge change current on the gate terminal of the field-effect transistor based on a drive signal, and a comparator having a first input for receiving the gate voltage and a second input for receiving the output signal to determine whether the gate voltage and the output voltage fulfill a predetermined relationship with respect to each other, and to provide the drive signal to the buffer circuit so that the charge change current is changed in magnitude when the predetermined relationship is fulfilled as compared to the charge change current when the predetermined relationship is not fulfilled.
摘要:
A driver circuit for providing an output signal for switching an electrical load on and off has a field-effect transistor having a gate terminal and an output for providing the output signal to the electrical load, a buffer circuit connected to the gate terminal of the field-effect transistor to impress a charge change current on the gate terminal of the field-effect transistor based on a drive signal, and a comparator having a first input for receiving the gate voltage and a second input for receiving the output signal to determine whether the gate voltage and the output voltage fulfill a predetermined relationship with respect to each other, and to provide the drive signal to the buffer circuit so that the charge change current is changed in magnitude when the predetermined relationship is fulfilled as compared to the charge change current when the predetermined relationship is not fulfilled.
摘要:
The present invention relates to a method for fabricating an integrated semiconductor circuit having a conductor structure buried in a semiconductor substrate, and to an integrated semiconductor circuit, in which case the integrated semiconductor circuit may be an application specific semiconductor circuit or a semiconductor circuit that can be adapted for an application.
摘要:
The present invention relates to an input circuit for receiving an input signal in an integrated circuit, having a differential amplifier whose first input can have a predetermined reference voltage applied to it and whose second input can have the input signal applied to it, and having a current source for operating the differential amplifier at its operating point, wherein a setting circuit is connected to the current source in order to set the operating point of the differential amplifier in an optimum manner on the basis of the predetermined reference voltage.
摘要:
The invention relates to a method for controlling the reading-in of a data signal at an input of an electrical circuit to an input latch with the aid of a clock signal, with the data item, which is indicated by the data signal, being transferred to the input latch with a clock edge of the clock signal, with the clock edge of the clock signal being shifted in time as a function of a time delay between a signal edge of the input signal at the input and the clock edge, such that the time delay between the signal edge of the data signal and the clock edge is within a predetermined time window.
摘要:
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.
摘要:
One embodiment of the invention provides an output driver for an integrated circuit. The output driver has a driver circuit for driving an input signal onto an output line. The driver circuit is dimensioned in such a way as to supply a current intensity dependent on the input signal to be driven and/or a potential dependent on the input signal to be driven on the output line. The current value and/or the potential value lie in a current intensity range and/or potential range defined by a predetermined specification. The driver strength of the driver circuit may be set in accordance with a control signal. A measuring circuit is provided to measure the current intensity of the current flowing on the output line and/or the potential of the output line. A control circuit serves for setting the driver strength of the driver circuit so that the potential on the output line is set to a potential value and/or the current intensity is set to a current value, wherein the set potential value and the set current value may lie in a lower power range of the current intensity range and/or potential range prescribed by the specification.
摘要:
The present invention relates to an input circuit for receiving an input signal in an integrated circuit, having a differential amplifier whose first input can have a predetermined reference voltage applied to it and whose second input can have the input signal applied to it, and having a current source for operating the differential amplifier at its operating point, wherein a setting circuit is connected to the current source in order to set the operating point of the differential amplifier in an optimum manner on the basis of the predetermined reference voltage.
摘要:
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region and an activation region arranged within the substrate. The activation region is generally in contact with the conduction region and is configured to change its electrical resistance when activation occurs.
摘要:
The invention relates to a method for operating semiconductor chips, particularly memory chips, which are arranged in groups on modules which are connected to a common data bus wherein each semiconductor chip on each module is connected to at least one data line in the common data bus comprising the following method steps: a) selecting a group of semiconductor chips from the semiconductor chips arranged on the modules based on a prescribed selection criterion independently of module, the selected group of semiconductor chips using data lines in the common data bus over the entire bus width; b) activating the semiconductor chips in the selected group; and c) performing data interchange between the data lines in the common data bus and the selected group of semiconductor chips.