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公开(公告)号：US20130037494A1
公开(公告)日：2013-02-14
申请号：US13571286
申请日：2012-08-09
IPC分类号： B01D21/00
CPC分类号： B01D21/0045 , B01D21/0057 , B01D21/006 , B01D21/0069 , B01D21/01 , B01D21/2416
摘要： The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.
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公开(公告)号：US08945401B2
公开(公告)日：2015-02-03
申请号：US13571286
申请日：2012-08-09
CPC分类号： B01D21/0045 , B01D21/0057 , B01D21/006 , B01D21/0069 , B01D21/01 , B01D21/2416
摘要： The disclosed method and apparatus separates solid impurities from a fluid containing solid impurities. The method and apparatus allow the introduction of influent comprising a fluid containing solid impurities into a plurality of channels and allowing at least a portion of the solid impurities initially present in the influent to settle on upward-facing surfaces of a plurality of plates forming the channels or slide down the upward-facing surfaces, while permitting fluid, which has been depleted of at least a portion of solid impurities, to flow upward toward the top edges of the plurality of plates. The influent is introduced into the plurality of channels in a manner that inhibits a disrupting or disturbing of the solid impurities, which have separated from the influent.
摘要翻译： 所公开的方法和装置将固体杂质与含有固体杂质的流体分离。 该方法和装置允许将包含固体杂质的流体的流入物引入多个通道中，并允许最初存在于流入物中的至少一部分固体杂质沉积在形成通道的多个板的向上的表面上 或者向下滑动向上的表面，同时允许已经耗尽至少一部分固体杂质的流体朝向多个板的顶部边缘向上流动。 流入物以抑制与流入物分离的固体杂质的破坏或干扰的方式引入多个通道。
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公开(公告)号：US06307258B1
公开(公告)日：2001-10-23
申请号：US09218180
申请日：1998-12-22
IPC分类号： H01L2302
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.
摘要翻译： 半导体管芯载体包括限定用于保持一个或多个半导体管芯，导电引线和具有穿过其形成的孔的盖板的壳体。 壳体包括绝缘侧壁和连接到侧壁的端板。 侧壁和端板可以一体地模制在一起。 一个或多个侧壁包括用于接收引线的开口，使得内部引线部分在空腔内延伸，并且外部引线部分从壳体外部的侧壁延伸。 侧壁可以包括用于接收盖板的凹部。 盖板中的孔允许保持在壳体中的半导体管芯暴露于环境中。
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公开(公告)号：US6050850A
公开(公告)日：2000-04-18
申请号：US911283
申请日：1997-08-14
IPC分类号： H01R12/71 , H01R12/55 , H01R13/645 , H01R13/73 , H01R24/00 , H01R107/00 , H02B1/01
CPC分类号： H01R12/7047 , H01R13/645
摘要： A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate. The male and female connector housings include side walls having complementary polarization features. The polarization features on the female connector housing may be formed on a detachable polarization cap. A side of the male connector housing includes a stop member for providing a positive stop for the female connector and to prevent rocking. The stop member is configured to permit side-to-side nesting of male connector housings.
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公开(公告)号：US06857173B1
公开(公告)日：2005-02-22
申请号：US09705710
申请日：2000-11-06
CPC分类号： H01L21/67121 , H01L2924/0002 , Y10T29/49139 , Y10T29/49147 , Y10T29/5142 , Y10T29/5193 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.
摘要翻译： 引线插入机包括基板供给，导电引线供应和引线插入机构。 导电引线插入形成在基板的侧壁上的引线通道中。 还公开了一种制造半导体管芯载体的方法，包括以下步骤：形成多个导电引线，形成用于保持半导体管芯的基板，所述基板具有限定基板的外表面的多个绝缘侧壁， 所述侧壁具有穿过其形成的多个引线通道，并且同时将所述导电引线中的至少一个插入所述侧壁中的一个的引导通道中以保持在其中，并且至少另一个所述导电引线进入另一个的引导通道 的侧壁保留在其中。
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公开(公告)号：US06709891B2
公开(公告)日：2004-03-23
申请号：US10231347
申请日：2002-08-30
IPC分类号： H01L2144
CPC分类号： H01L23/057 , H01L24/48 , H01L2224/05599 , H01L2224/48091 , H01L2224/48247 , H01L2224/85444 , H01L2924/00014 , H01L2924/01079 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor die carrier includes a housing that defines a cavity for holding one or more semiconductor dies, electrically conductive leads, and a cover plate having an aperture formed therethrough. The housing includes insulative side walls and a end plate joined to the side walls. The side walls and the end plate may be molded together as a one-piece unit. One or more of the side walls includes openings for receiving the leads so that an internal lead section extends within the cavity and an external lead section extends from the side walls external of the housing. The side walls may include a recess for receiving the cover plate. The aperture in the cover plate allows a semiconductor die held in the housing to be exposed to the environment.
摘要翻译： 半导体管芯载体包括限定用于保持一个或多个半导体管芯，导电引线和具有穿过其形成的孔的盖板的壳体。 壳体包括绝缘侧壁和连接到侧壁的端板。 侧壁和端板可以一体地模制在一起。 一个或多个侧壁包括用于接收引线的开口，使得内部引线部分在空腔内延伸，并且外部引线部分从壳体外部的侧壁延伸。 侧壁可以包括用于接收盖板的凹部。 盖板中的孔允许保持在壳体中的半导体管芯暴露于环境中。
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公开(公告)号：US06334794B1
公开(公告)日：2002-01-01
申请号：US09261256
申请日：1999-03-03
IPC分类号： H01R1364
CPC分类号： H01R12/7047 , H01R13/645
摘要： A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate. The male and female connector housings include side walls having complementary polarization features. The polarization features on the female connector housing may be formed on a detachable polarization cap. A side of the male connector housing includes a stop member for providing a positive stop for the female connector and to prevent rocking. The stop member is configured to permit side-to-side nesting of male connector housings.
摘要翻译： 公连接器与母连接器连接以建立电连接。 阳连接器和阴连接器各自包括具有在其相对端部处的压紧突片的连接器壳体，用于将连接器壳体固定到基板。 压紧片是交错的或斜对位的，使得一个压紧片靠近连接器壳体的第一侧，另一个压紧件靠近连接器壳体的第二侧。 交错或对角定位的压紧片可以使连接器壳体抵抗基板上的摇摆或其他运动。 压紧片的布置还允许连接器壳体与另一类似设计的连接器壳体嵌套或合并。 嵌套或合并的连接器壳体节省了衬底空间，并且允许在衬底上的给定空间中的更高密度的接触，无论该空间是在衬底的边缘还是内部。 阳连接器和阴连接器壳体包括具有互补极化特征的侧壁。 阴连接器壳体上的偏振特征可以形成在可拆卸的偏振盖上。 阳连接器壳体的一侧包括用于为阴连接器提供正止动件并防止摇摆的止动构件。 止动构件构造成允许阳连接器壳体的侧向嵌套。
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公开(公告)号：US06461197B2
公开(公告)日：2002-10-08
申请号：US09860606
申请日：2001-05-21
IPC分类号： H01R2400
CPC分类号： H01R43/16 , H01R12/712 , H01R13/05 , H01R13/26
摘要： An electrical connector includes a male connector and a female connector. The female connector includes a female connector housing and a plurality of female contact pins. The female contact pins includes a contact portion, a stabilizer portion, and a tail portion. The contact portion extends from the stabilizer portion at an angle. A lateral distance spanned by the angled contact portion is substantially the same as or less than the width of the stabilizer portion in the same direction. The female contact pins are arranged on the female connector housing in clusters of four. The clusters are arranged in rows such that each pair of rows defines five rows of female contact pins. The male connector includes a male connector housing and a plurality of male contact pins. The male connector housing has a plurality of buttresses extending therefrom. The male contact pins are arranged on the male connector housing to correspond to the arrangement of female contact pins. Each of the male contact pins has a slight angle to prevent separation between the male contact pin and its corresponding buttress.
摘要翻译： 电连接器包括阳连接器和阴连接器。 阴连接器包括阴连接器壳体和多个阴接触销。 母接触销包括接触部分，稳定器部分和尾部。 接触部分从稳定器部分以一定角度延伸。 由倾斜的接触部分跨越的横向距离与稳定器部分在相同方向上的宽度基本上相同或小于稳定器部分的宽度。 母接头销以四个组合布置在阴连接器壳体上。 簇排列成行，使得每对行都限定五排阴接触针。 阳连接器包括阳连接器壳体和多个阳接触销。 阳连接器壳体具有从其延伸的多个支撑。 阳接触针布置在阳连接器壳体上以对应于阴接触针的布置。 每个阳接触针具有小的角度，以防止阳接触销与其对应的支柱之间的分离。
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公开(公告)号：US06305987B1
公开(公告)日：2001-10-23
申请号：US09249300
申请日：1999-02-12
IPC分类号： H01R2400
CPC分类号： H01R13/7172 , H01R13/6641 , H01R13/6658 , H01R24/64 , H05K1/141 , H05K1/18
摘要： An integrated module includes a connector for detachable connection to a signal source, with the connector having internal electrically conductive pins, and a housing defining a cavity for holding at least one semiconductor die. The housing includes side walls and an end plate joined to the side walls. Electrically conductive leads extend through at least one of the side walls with each of the leads including an internal lead section extending within the cavity and an external lead section extending externally of the cavity through at least one side wall. One of the side walls of the housing includes a portion that is attached to the connector, with the side walls and a bottom part of the connector being formed as one integrally molded part or as two separate parts that are joined together using processes such as ultrasonic welding. A printed circuit board can also form part of the integrated module, with the printed circuit board either being mounted in spaced parallel relation to the end plate on pegs that extend upwardly from the side walls of the housing, or the printed circuit board can be mounted between the connector and the housing either perpendicular to or parallel with the end plate of the housing. Passive components can be mounted on the printed circuit board and electrically connected to pins within the connector as well as to semiconductor dies mounted on the end plate within the housing. The electrically conductive leads extending from the side wall on one side of the integrated module can be offset relative to the electrically conductive leads extending from the opposite side wall such that two identical integrated modules can be mounted close to each other with the electrically conductive leads overlapping, thus optimizing space utilization.
摘要翻译： 集成模块包括用于可拆卸地连接到信号源的连接器，其中连接器具有内部导电销，以及壳体，其限定用于保持至少一个半导体管芯的空腔。 壳体包括侧壁和连接到侧壁的端板。 导电引线延伸通过至少一个侧壁，其中每个引线包括在腔内延伸的内部引线部分和通过至少一个侧壁延伸到空腔外部的外部引线部分。 壳体的一个侧壁包括附接到连接器的部分，其中侧壁和连接器的底部形成为一个整体模制部件，或者形成为使用诸如超声波之类的过程连接在一起的两个分离部件 焊接。 印刷电路板还可以形成集成模块的一部分，其中印刷电路板或者以与壳体的侧壁向上延伸的销钉上的端板隔开平行的关系安装，或者可以安装印刷电路板 在连接器和壳体之间垂直于或平行于壳体的端板。 无源组件可以安装在印刷电路板上并电连接到连接器内的引脚以及安装在壳体内的端板上的半导体管芯。 从集成模块一侧的侧壁延伸的导电引线可以相对于从相对侧壁延伸的导电引线偏移，使得两个相同的集成模块可以彼此靠近地安装，导电引线重叠 ，从而优化空间利用。
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公开(公告)号：US06266246B1
公开(公告)日：2001-07-24
申请号：US09484047
申请日：2000-01-18
申请人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
发明人： Stanford W. Crane, Jr. , Lakshminarasimha Krishnapura , Yun Li , Moises Behar , Dan Fuoco , Bill Ahearn
IPC分类号： H05K720
CPC分类号： H01L23/5382 , H01L23/49861 , H01L23/5385 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48137 , H01L2224/49171 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/30107 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.
摘要翻译： 多芯片模块包括具有绝缘侧壁和端板的壳体，从侧壁延伸的导电引线，安装到端板的集成电路（IC）模具和安装到端板的一个或多个互连模具。 端板由诸如铜的散热材料制成。 每个互连裸片位于一对IC芯片之间。 导电材料将IC芯片连接到互连裸片，将IC芯片连接到导电引线，并将互连裸片连接到导电引线。 互连管芯用于互连IC管芯并将IC管芯与导电引线互连。 互连裸片可以由形成在硅衬底上的布线层来实现。
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