公开(公告)号：US20120111613A1

公开(公告)日：2012-05-10

申请号：US13384084

申请日：2010-07-07

申请人： Ryoichi Oguro ,  Kouji Kase ,  Kazuhiro Hoshino

发明人： Ryoichi Oguro ,  Kouji Kase ,  Kazuhiro Hoshino

IPC分类号： H05K1/09 ,  C23C28/02 ,  B32B15/04 ,  H05K1/02 ,  B32B15/01

CPC分类号： C25D5/48 ,  C23C30/00 ,  C25D1/04 ,  C25D3/562 ,  C25D5/34 ,  C25D7/0628 ,  C25D11/38 ,  H05K1/167 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12049 ,  Y10T428/12076

摘要： A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.5 μm in terms of Rz value prescribed in JIS-B-0601; and performing roughening treatment to a surface of the resistance layer with nickel particles wherein a roughness is within a range of 4.5 to 8.5 μm in terms of Rz value prescribed in JIS-B-0601. The alloy layer is for example formed from phosphorus-containing nickel.

摘要翻译： 提供了具有电阻层的铜箔，其中当制成电阻元件时其变化值较小，能够充分保持与要层压的树脂基板的粘附性，其具有作为电阻的优异特性 用于刚性和柔性基底的元件。 本发明的具有电阻层的铜箔的一个表面上形成有形成有电阻元件的金属层或合金层的铜箔，金属层或合金层的表面经受 用镍颗粒进行粗糙处理。 本发明的具有电阻层的铜箔的制造方法包括：在具有由柱状晶粒构成的结晶的电沉积铜箔的无光泽表面上形成含磷镍电阻层，其中， 在JIS-B-0601中规定的Rz值为2.5〜6.5μm的范围内。 并且以JIS-B-0601中规定的Rz值为基准的粗糙度在4.5〜8.5μm的范围内的镍粒子对电阻层的表面进行粗糙化处理。 合金层例如由含磷的镍形成。

公开(公告)号：US20120205146A1

公开(公告)日：2012-08-16

申请号：US13390403

申请日：2010-08-11

申请人： Ryoichi Oguro ,  Kazuhiro Hoshino

发明人： Ryoichi Oguro ,  Kazuhiro Hoshino

IPC分类号： H05K1/09 ,  C25D5/10 ,  B32B15/00 ,  B32B37/10 ,  B32B15/04

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C23C18/122 ,  C25D1/04 ,  C25D3/32 ,  C25D3/38 ,  C25D5/10 ,  C25D5/16 ,  C25D5/48 ,  C25D7/0614 ,  C25D11/38 ,  H05K1/0242 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/12535 ,  Y10T428/12549 ,  Y10T428/12792

摘要： Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a first roughened surface layer which has been treated by a first roughening treatment by copper metal, a second roughened surface layer which has been treated by a second roughening treatment by copper metal, and a third treated surface layer which has been treated by a third treatment process by zinc metal are sequentially provided on one surface of an untreated copper foil. Also specifically disclosed are: a circuit board which is obtained by laminating the heat-resistant copper foil on a flexible resin substrate or a rigid resin substrate; and a method for producing a copper-clad laminate wherein the heat-resistant copper foil and a heat-resistant resin substrate are thermally pressure-bonded and the roughened copper metal and the third treated surface layer of the zinc metal are alloyed.

摘要翻译： 公开了一种具有优异的高频特性和耐热性的铜箔，同时对树脂基板实现高耐热粘合性。 具体公开了一种耐热铜箔，其具有通过铜金属的第一粗糙化处理进行了处理的第一粗糙化表面层，通过铜金属进行第二粗糙化处理的第二粗糙化表面层， 并且在未处理的铜箔的一个表面上依次设置通过第三处理工艺用锌金属处理的第三处理表面层。 还具体公开的是：通过将耐热铜箔层压在柔性树脂基板或刚性树脂基板上而获得的电路板; 以及一种制造覆铜层压板的方法，其中耐热铜箔和耐热树脂基板被热压粘合，并且将粗糙的铜金属和第三被处理的锌金属表面层合金化。

公开(公告)号：US5792333A

公开(公告)日：1998-08-11

申请号：US874760

申请日：1997-06-13

申请人： Ryoichi Oguro ,  Tadao Nakaoka ,  Kazuyuki Inoue ,  Kazuhiro Hoshino

发明人： Ryoichi Oguro ,  Tadao Nakaoka ,  Kazuyuki Inoue ,  Kazuhiro Hoshino

IPC分类号： C25D1/04 ,  C23F11/00 ,  C25D3/38 ,  C25D5/18 ,  C25D5/48 ,  C25F3/02 ,  H05K3/38

CPC分类号： C25D5/48 ,  C25D3/38 ,  C25D5/18 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723

摘要： A method of surface-roughening a copper foil by subjecting at least one side of the copper foil to electro-plating using an alternating current, wherein a sulfuric acid bath or a sulfuric acid-copper sulfate bath is used as an electrolyte.

摘要翻译： 通过使用铜箔的至少一面使用交流电进行电镀，其中使用硫酸浴或硫酸 - 硫酸铜浴作为电解液，对铜箔进行表面粗糙化的方法。

公开(公告)号：US20110171486A1

公开(公告)日：2011-07-14

申请号：US13072220

申请日：2011-03-25

申请人： Takami MOTEKI ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

发明人： Takami MOTEKI ,  Yuuji Suzuki ,  Kazuhiro Hoshino ,  Kensaku Shinozaki ,  Akira Matsuda

IPC分类号： B32B15/04 ,  B32B15/00 ,  H05K1/02

CPC分类号： C25D1/04 ,  C25D7/0614 ,  H05K1/0237 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/1291

摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

公开(公告)号：US07579576B2

公开(公告)日：2009-08-25

申请号：US11053626

申请日：2005-02-08

申请人： Toshinobu Sugiyama ,  Shinichi Yoshimura ,  Ryoji Suzuki ,  Kazuhiro Hoshino

发明人： Toshinobu Sugiyama ,  Shinichi Yoshimura ,  Ryoji Suzuki ,  Kazuhiro Hoshino

IPC分类号： H01L27/00

CPC分类号： H04N5/335 ,  H01L27/14609 ,  H04N5/374 ,  H04N5/3742

摘要： An arithmetic circuit, which is retained by each pixel in a conventional image sensor, is shared by each column. Signal processing circuits of different configurations are provided on signal transmission paths in an upward direction and a downward direction of a vertical signal line for extracting an image signal from each pixel, whereby image output processing and arithmetic processing are performed completely separately by the different circuit blocks. Thus, image quality of an actual image is improved and optimum design for arithmetic processing is made possible. Specifically, an I-V converter circuit unit, a CDS circuit unit and the like are provided on the image output side. A current mirror circuit unit, an analog memory array unit, a comparator unit, a bias circuit unit, a data latch unit, an output data bus unit and the like are provided on the arithmetic processing side.

摘要翻译： 由常规图像传感器中的每个像素保留的算术电路由每列共享。 不同配置的信号处理电路在垂直信号线的向上方向和下方的信号传输路径上提供，用于从每个像素提取图像信号，从而通过不同的电路块完全分别执行图像输出处理和运算处理 。 因此，改善了实际图像的图像质量，使得可以进行算术处理的最佳设计。 具体地，在图像输出侧设置有I-V转换器电路单元，CDS电路单元等。 算术处理侧设置电流镜电路单元，模拟存储器阵列单元，比较单元，偏置电路单元，数据锁存单元，输出数据总线单元等。

公开(公告)号：US06759642B2

公开(公告)日：2004-07-06

申请号：US09767922

申请日：2001-01-23

申请人： Kazuhiro Hoshino

发明人： Kazuhiro Hoshino

IPC分类号： H01L2700

CPC分类号： H04N5/2253

摘要： A camera module including a light-transmissible board having an infrared rays cutting function on one surface of which a wiring pattern is formed, an image pickup element having a photodetecting portion which is flip-chip-mounted on the same surface of the light-transmissible board while the photodetecting portion is opposite to an area where there is no wiring-pattern, and a lens unit which is mounted on the other surface of the light-transmissible board so as to be located above the photodetecting portion of the image pickup element.

摘要翻译： 一种照相机模块，包括在其一个表面上形成有布线图案的具有红外线切割功能的透光板，具有倒装芯片安装在光传输的同一表面上的光电检测部分的图像拾取元件 光检测部分与不存在布线图形的区域相反，并且透镜单元安装在透光板的另一个表面上，以便位于图像拾取元件的光电检测部分的上方。

公开(公告)号：US20100270063A1

公开(公告)日：2010-10-28

申请号：US12827018

申请日：2010-06-30

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： H05K1/09 ,  B32B15/01

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D1/20 ,  Y10T428/12438 ,  Y10T428/12458 ,  Y10T428/12514 ,  Y10T428/12771 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

公开(公告)号：US07771841B2

公开(公告)日：2010-08-10

申请号：US11639439

申请日：2006-12-15

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： B32B15/00

CPC分类号： H05K3/025 ,  C25D1/04 ,  C25D1/20 ,  Y10T428/12438 ,  Y10T428/12458 ,  Y10T428/12514 ,  Y10T428/12771 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成满足以下等式的剥离层：10＆lt; nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

公开(公告)号：US07414663B2

公开(公告)日：2008-08-19

申请号：US11001029

申请日：2004-12-02

申请人： Kazuhiro Hoshino ,  Hirofumi Sumi ,  Kazuya Yonemoto

发明人： Kazuhiro Hoshino ,  Hirofumi Sumi ,  Kazuya Yonemoto

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H04N5/2253 ,  H04N5/2257

摘要： The method for manufacturing a camera module of the present invention includes forming a bump on each electrode portion of an imaging element. Next, a through hole is formed in a substrate. The imaging element is then mounted on a first side of the substrate having at least one bump such that a light receiving portion of the imaging element receives light via the through-hole of the substrate. A periphery of the imaging element is sealed to the substrate. Next, a lens unit is mounted on a second side of the substrate.

摘要翻译： 本发明的摄像机模块的制造方法包括在摄像元件的每个电极部分上形成凸块。 接下来，在基板上形成通孔。 然后将成像元件安装在具有至少一个凸起的基板的第一侧上，使得成像元件的光接收部分经由基板的通孔接收光。 成像元件的周边被密封到基底。 接下来，将透镜单元安装在基板的第二侧上。

公开(公告)号：US07375757B1

公开(公告)日：2008-05-20

申请号：US09652150

申请日：2000-08-31

申请人： Kazuhiro Hoshino ,  Hirofumi Sumi ,  Kazuya Yonemoto

发明人： Kazuhiro Hoshino ,  Hirofumi Sumi ,  Kazuya Yonemoto

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H04N5/2253 ,  H04N5/2257

摘要： The system and apparatus of the present invention are directed to a camera module in which an operational defect (generation of a ghost image) as a result of a reduction in thickness is eliminated. The camera module includes a substrate provided with a through-hole for light transmission, a light receiving portion provided on a first surface of an imaging element. The imaging element is flip chip mounted on a first side of the substrate such that the light receiving portion is exposed through the through-hole, and a shielding layer on a back surface of the imaging element wherein the back surface is opposite the first surface having the light receiving portion. A lens unit is mounted a second side of the substrate.

摘要翻译： 本发明的系统和装置涉及一种相机模块，其中消除了作为厚度减小的结果的操作缺陷（产生幻影）。 相机模块包括设置有用于光透射的通孔的基板，设置在成像元件的第一表面上的光接收部分。 成像元件是倒装芯片安装在基板的第一侧上，使得光接收部分通过通孔露出，并且在成像元件的后表面上的屏蔽层，其中后表面与第一表面相对， 光接收部分。 透镜单元安装在基板的第二侧。