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    Electroless gold plating solution
    3.
    发明授权
    Electroless gold plating solution 失效
    化学镀金液

    公开(公告)号：US07022169B2

    公开(公告)日：2006-04-04

    申请号：US10732323

    申请日：2003-12-10

    申请人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato

    发明人： Ryota Iwai ,  Tomoaki Tokuhisa ,  Masaru Kato

    IPC分类号： C23C18/42 ,  C23C18/44 ,  B05D1/18

    CPC分类号： C23C18/42 ,  C23C18/44

    摘要： An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite and the decomposition inhibitor is cytosine, the pH 6.0 or less is excluded. In the formula, R1 to R4 denote hydrogen atom(s), alkyl group(s) having 1 to 10 carbon atom(s), which may have substituent(s), aryl group(s) having 6 to 10 carbon atoms, which may have substituent(s), alkoxy group(s) having 1 to 10 carbon atom(s), which may have substituent(s), amino group(s) (—NH2), hydroxyl group(s) (—OH), ═O, or halogen atom(s), R2 and R3 or R3 and R4 may crosslink with each other and form a saturated or unsaturated ring and the saturated or unsaturated ring may include oxygen, sulfur or nitrogen atom(s), each of the above-mentioned substituents may be a halogen atom or a cyano group, and may be a single bond or a double bond.

    摘要翻译： 提供一种无电镀金液，其不含有氰化合物作为金源，并且含有通式（1）表示的分解抑制剂，条件是在溶液含有亚硫酸盐金分子和分解物的情况下 抑制剂是胞嘧啶，不包括pH6.0或更低。 在式中，R 1至R 4表示氢原子，可具有取代基的具有1至10个碳原子的烷基（一个或多个） s），可具有取代基的碳原子数6〜10的芳基，可以具有取代基的碳原子数1〜10的烷氧基，氨基（s） ）（-NH 2），羟基（-OH），-O或卤素原子，R 2和R 3， / SUB或R 3和R 4可以彼此交联并形成饱和或不饱和环，并且饱和或不饱和环可以包括氧，硫或氮原子（ s），上述取代基中的每一个可以是卤素原子或氰基，并且可以是单键或双键。

    Electroless gold plating solution
    4.
    发明授权
    Electroless gold plating solution 有权
    化学镀金液

    公开(公告)号：US06855191B2

    公开(公告)日：2005-02-15

    申请号：US10353460

    申请日：2003-01-29

    申请人： Masaru Kato ,  Ryota Iwai

    发明人： Masaru Kato ,  Ryota Iwai

    IPC分类号： C23C18/44 ,  H05K3/24 ,  C23C18/52 ,  B22F7/00

    CPC分类号： C23C18/44 ,  H05K3/244

    摘要： An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.

    摘要翻译： 提供一种无电镀金液，其中通过置换反应沉积的金的量为至少15mug / cm 2，并且无电镀金液包括被金氧化的还原剂和还原剂， 与上述还原剂具有相同类型或不同的类型，并被基底金属氧化。 该溶液可以在一个步骤中形成具有良好粘附性和低孔隙率的均匀金涂层。

    MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD
    5.
    发明申请
    MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD 审中-公开
    微晶 - 非晶态金合金和镀膜，以及这些镀层解决方案，以及镀膜形成方法

    公开(公告)号：US20120031764A1

    公开(公告)日：2012-02-09

    申请号：US13202050

    申请日：2010-02-17

    申请人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

    发明人： Tetsuya Osaka ,  Yutaka Okinaka ,  Kazutaka Senda ,  Ryota Iwai ,  Masaru Kato

    IPC分类号： C25D3/48 ,  C25D7/00

    CPC分类号： C25D3/62

    摘要： Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.

    摘要翻译： 公开了具有优异的电性能和优异的机械性能的微晶 - 非晶金合金镀膜。 可以通过使微晶相和非晶相以特定比例以混合状态存在来获得包括晶体结构的有利性质和非晶结构的有利特性的物理性质。 微晶的平均粒径为30nm以下，微晶的体积分数为10〜90％，Knoop硬度为Hk 180以上，电阻率为200μΩ·cm-cm以下。 在膜中，可以提高硬度和耐磨性，同时保持金属固有的良好的电阻率值和化学稳定性，几乎不起作用。 因此，该膜作为用于连接诸如连接器和继电器的电气或电子部件的材料是有用的。