摘要:
A resistance variable memory apparatus (100) of the present invention includes a current suppressing element (116) which is connected in series with each resistance variable layer (114) and whose threshold voltage is VF, and is configured to apply a first voltage V1 to a first wire (WL) associated with a selected nonvolatile memory element, apply a second voltage V2 to a second wire (BL) associated with the selected nonvolatile memory element, apply a third voltage V3 to a first wire (WL) which is not associated with the selected nonvolatile memory element and apply a fourth voltage V4 to a second wire (BL) which is not associated with the selected memory element when writing data or reading data, wherein V2≦V3
摘要:
A resistance variable memory apparatus (100) of the present invention includes a current suppressing element (116) which is connected in series with each resistance variable layer (114) and whose threshold voltage is VF, and is configured to apply a first voltage V1 to a first wire (WL) associated with a selected nonvolatile memory element, apply a second voltage V2 to a second wire (BL) associated with the selected nonvolatile memory element, apply a third voltage V3 to a first wire (WL) which is not associated with the selected nonvolatile memory element and apply a fourth voltage V4 to a second wire (BL) which is not associated with the selected memory element when writing data or reading data, wherein V2≦V3
摘要:
A resistance variable memory apparatus (100) of the present invention includes a current suppressing element (116) which is connected in series with each resistance variable layer (114) and whose threshold voltage is VF, and is configured to apply a first voltage V1 to a first wire (WL) associated with a selected nonvolatile memory element, apply a second voltage V2 to a second wire (BL) associated with the selected nonvolatile memory element, apply a third voltage V3 to a first wire (WL) which is not associated with the selected nonvolatile memory element and apply a fourth voltage V4 to a second wire (BL) which is not associated with the selected memory element when writing data or reading data, wherein V2≦V3
摘要:
A resistance variable memory apparatus (100) of the present invention includes a current suppressing element (116) which is connected in series with each resistance variable layer (114) and whose threshold voltage is VF, and is configured to apply a first voltage V1 to a first wire (WL) associated with a selected nonvolatile memory element, apply a second voltage V2 to a second wire (BL) associated with the selected nonvolatile memory element, apply a third voltage V3 to a first wire (WL) which is not associated with the selected nonvolatile memory element and apply a fourth voltage V4 to a second wire (BL) which is not associated with the selected memory element when writing data or reading data, wherein V2≦V3
摘要:
Memory cells (MC) are formed at intersections of bit lines (BL) extending in the X direction and word lines (WL) extending in the Y direction. A plurality of basic array planes sharing the word lines (WL), each formed for a group of bit lines (BL) aligned in the Z direction, are arranged side by side in the Y direction. In each basic array plane, bit lines in even layers and bit lines in odd layers are individually connected in common. Each of selection switch elements (101 to 104) controls switching of electrical connection/non-connection between the common-connected even layer bit line and a global bit line (GBL), and each of selection switch elements (111 to 114) control switching of connection/non-connection between the common-connected odd layer bit line and the global bit line (GBL).
摘要:
Memory cells (MC) are formed at intersections of bit lines (BL) extending in the X direction and word lines (WL) extending in the Y direction. A plurality of basic array planes sharing the word lines (WL), each formed for a group of bit lines (BL) aligned in the Z direction, are arranged side by side in the Y direction. In each basic array plane, bit lines in even layers and bit lines in odd layers are individually connected in common. Each of selection switch elements (101 to 104) controls switching of electrical connection/non-connection between the common-connected even layer bit line and a global bit line (GBL), and each of selection switch elements (111 to 114) control switching of connection/non-connection between the common-connected odd layer bit line and the global bit line (GBL).
摘要:
A nonvolatile memory element comprises a first electrode layer (103), a second electrode (107), and a resistance variable layer (106) which is disposed between the first electrode layer (103) and the second electrode layer (107), a resistance value of the resistance variable layer varying reversibly according to electric signals having different polarities which are applied between the electrodes (103), (107), wherein the resistance variable layer (106) has a first region comprising a first oxygen-deficient tantalum oxide having a composition represented by TaOx (0
摘要:
A nonvolatile semiconductor apparatus of the present invention comprises (103), a second electrode (105), and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), a resistance value of the resistance variable layer being switchable reversibly in response to an electric signal applied between the electrodes (103), (105), wherein the resistance variable layer (104) comprises an oxide containing tantalum and nitrogen.
摘要:
A nonvolatile memory element comprises a first electrode layer (103), a second electrode (107), and a resistance variable layer (106) which is disposed between the first electrode layer (103) and the second electrode layer (107), a resistance value of the resistance variable layer varying reversibly according to electric signals having different polarities which are applied between the electrodes (103), (107), wherein the resistance variable layer (106) has a first region comprising a first oxygen-deficient tantalum oxide having a composition represented by TaOx (0
摘要:
A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate (301), (ii) a variable resistance element (309) having: lower and upper electrodes (309a, 309c); and a variable resistance layer (309b) whose resistance value reversibly varies based on voltage signals each of which has a different polarity and is applied between the electrodes (309a, 309c), and (iii) a MOS transistor (317) formed on the substrate (301), wherein the variable resistance layer (309b) includes: oxygen-deficient transition metal oxide layers (309b-1, 309b-2) having compositions MOx and MOy (where x