公开(公告)号：US5208400A

公开(公告)日：1993-05-04

申请号：US815778

申请日：1992-01-02

申请人： Ryuichi Mita ,  Yuji Fukunaga ,  Hironobu Horie ,  Mitsumasa Umemoto ,  Yasuhiro Matsuki

发明人： Ryuichi Mita ,  Yuji Fukunaga ,  Hironobu Horie ,  Mitsumasa Umemoto ,  Yasuhiro Matsuki

IPC分类号： C07C17/20

CPC分类号： C07C17/208

摘要： An improved process for producing allyl bromides by halogen exchange by reaction of an allyl chloride, with a metal bromide, wherein the reaction is conducted in an aprotic polar solvent. The allyl bromides obtained by the process of the invention are useful as intermediates for producing medicines, agricultural chemicals, dyes, and the like.

摘要翻译： 通过烯丙基氯与金属溴化物的反应通过卤素交换生产烯丙基溴的改进方法，其中反应在非质子极性溶剂中进行。 通过本发明方法获得的烯丙基溴可用作生产药物，农药，染料等的中间体。

公开(公告)号：US08241951B2

公开(公告)日：2012-08-14

申请号：US12640156

申请日：2009-12-17

申请人： Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

发明人： Hisatane Komori ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion.

摘要翻译： 一种方法包括制备盖构件; 准备包括基板的图像拾取元件，所述基板包括在主表面上包括多个光电检测器的像素区域，所述第一凹凸部分包括被配置为将光聚集在所述多个光电检测器上的多个第一凸起部分，所述第一凸部 分别具有透镜形状的部分和围绕第一凹凸部的第二凹凸部，第二凹凸部包括多个第二凸部; 并且使用固定构件将盖构件固定到图像拾取元件的区域，该区域在第一凹凸部和第二凹凸部之间。

公开(公告)号：US09765417B2

公开(公告)日：2017-09-19

申请号：US14390514

申请日：2012-04-09

申请人： Yasuhiro Matsuki ,  Tomohiro Inoue

发明人： Yasuhiro Matsuki ,  Tomohiro Inoue

IPC分类号： C22C38/06 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  C22C38/16 ,  B23K11/16 ,  B23K11/087 ,  F16L9/02 ,  C22C38/18 ,  C22C38/08 ,  C21D8/02 ,  C21D8/10 ,  C21D9/08 ,  F16L9/16

CPC分类号： C22C38/06 ,  B23K11/0873 ,  B23K11/16 ,  C21D8/0226 ,  C21D8/105 ,  C21D9/08 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/08 ,  C22C38/16 ,  C22C38/18 ,  F16L9/02 ,  F16L9/165 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/13

摘要： A low-yield ratio high-strength electric resistance welded steel pipe has a yield ratio of 80% or less and a TS of 655 MPa or more. A steel material has a composition containing 0.38% to 0.45% C, 0.1% to 0.3% Si, 1.0% to 1.8% Mn, 0.03% or less P, 0.03% or less S, 0.01% to 0.07% sol. Al, and 0.01% or less N on a mass basis.

公开(公告)号：US08823872B2

公开(公告)日：2014-09-02

申请号：US13212935

申请日：2011-08-18

申请人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

发明人： Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Yasuhiro Matsuki ,  Takanori Suzuki ,  Akiya Nakayama

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L2224/13 ,  H04N5/2253

摘要： An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

摘要翻译： 图像拾取模块包括盖构件，包括光电二极管的图像拾取装置芯片，布置在图像拾取装置芯片周围并将盖构件和图像拾取装置芯片连接在一起的固定构件，布置在侧面的重新布线基板 与图像拾取装置芯片的盖构件相对的连接构件，用于将图像拾取装置芯片与重新布线基板连接的连接构件以及由盖构件，图像拾取装置芯片和固定构件包围的空间。 图像拾取器件芯片包括半导体衬底。 半导体衬底包括穿透衬底的通孔电极。 当将图像拾取模块相对于盖模块的正交投影中的固定构件对应的区域定义为固定区域时，通孔电极和连接构件布置在固定区域中。

公开(公告)号：US08279336B2

公开(公告)日：2012-10-02

申请号：US12795458

申请日：2010-06-07

申请人： Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

发明人： Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(θA−2θC)≦L1+L1′ at any point on the upright surface, and H tan(θA−2θB)+(H1)tan θB≦L1 and θB>θC at any point on the non-vertical surface, where θA is the inclination of incident light, θB is the inclination at a point on the non-vertical surface, θC is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1′ is the distance from the upper edge to the lower edge of the upright surface in the planar direction.

摘要翻译： 固定到拾取元件的盖构件具有非垂直表面和直立表面，并且在直立表面上的任何点处满足H2 tan（＆amp; A-2＆amp; C;＆lt; L1 + L1'）和H tan（＆ ; A-2＆thetas; B）+（H1）tan＆thetas; B＆nlE; L1和＆thetas; B>＆thetas; C在非垂直表面上的任何点，其中＆amp; A; A是入射光的倾角， 在非垂直表面上的点处的倾斜角度; C是直立表面上的点处的倾角，H1是非垂直表面的高度，H2是直立表面的高度，H是高度 框架部分的距离L1是从像素区域的边缘到直立表面的上边缘的距离，L1'是在平面方向上从直立表面的上边缘到下边缘的距离。

公开(公告)号：US5500290A

公开(公告)日：1996-03-19

申请号：US265239

申请日：1994-06-24

申请人： Satoru Udagawa ,  Masaki Abe ,  Satoru Ando ,  Yasuhiro Matsuki ,  Toyofumi Watanabe ,  Yukimitsu Shiohara ,  Masaya Morita ,  Akimasa Kido

发明人： Satoru Udagawa ,  Masaki Abe ,  Satoru Ando ,  Yasuhiro Matsuki ,  Toyofumi Watanabe ,  Yukimitsu Shiohara ,  Masaya Morita ,  Akimasa Kido

IPC分类号： C21D8/04 ,  C23C2/02 ,  B32B15/18

CPC分类号： C21D8/0426 ,  C23C2/02 ,  C21D8/0436 ,  C21D8/0478 ,  Y10S428/941 ,  Y10T428/12458 ,  Y10T428/12792 ,  Y10T428/12799 ,  Y10T428/12937

摘要： A surface treated steel sheet comprises: a steel sheet containing C, Si, Mn, P, S, Ni, Ti, Cu and B; a diffused alloy layer containing Fe, Ni, and P; and a zinc coating layer formed on the diffused alloy layer.A method for producing a surface treated steel sheet comprises the steps of: preparing a steel sheet; coating the steel sheet with a Ni-P coating layer; heat-treating the steel sheet coated with the Ni-P coating layer; and forming a zinc coating layer on the diffused alloy layer.

摘要翻译： 表面处理钢板包括：含有C，Si，Mn，P，S，Ni，Ti，Cu和B的钢板; 含Fe，Ni和P的扩散合金层; 以及形成在扩散合金层上的锌涂层。 一种表面处理钢板的制造方法，其特征在于，包括以下工序：制造钢板; 用Ni-P涂层涂覆钢板; 对涂覆有Ni-P涂层的钢板进行热处理; 并在扩散合金层上形成锌涂层。

公开(公告)号：US08790950B2

公开(公告)日：2014-07-29

申请号：US13211102

申请日：2011-08-16

申请人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

发明人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC分类号： H01L21/00 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

摘要翻译： 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US20120052612A1

公开(公告)日：2012-03-01

申请号：US13211161

申请日：2011-08-16

申请人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

发明人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

摘要翻译： 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120050590A1

公开(公告)日：2012-03-01

申请号：US13211102

申请日：2011-08-16

申请人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

发明人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC分类号： H04N5/335 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

摘要翻译： 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US20100309354A1

公开(公告)日：2010-12-09

申请号：US12795458

申请日：2010-06-07

申请人： Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

发明人： Koji Tsuduki ,  Hisatane Komori ,  Yasuhiro Matsuki ,  Satoru Hamasaki

IPC分类号： H04N5/335

CPC分类号： H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H2 tan(θA−2θC)≦L1+L1′ at any point on the upright surface, and H tan(θA−2θB)+(H1)tan θB≦L1 and θB>θC at any point on the non-vertical surface, where θA is the inclination of incident light, θB is the inclination at a point on the non-vertical surface, θC is the inclination at a point on the upright surface, H1 is the height of the non-vertical surface, H2 is the height of the upright surface, H is the height of the frame portion, L1 is the distance from the edge of a pixel region to the upper edge of the upright surface, and L1′ is the distance from the upper edge to the lower edge of the upright surface in the planar direction.

摘要翻译： 固定到拾取元件的盖构件具有非垂直表面和直立表面，并且在直立表面上的任何点处满足H2 tan（＆amp; A-2＆amp; C;＆lt; L1 + L1'）和H tan（＆ ; A-2＆thetas; B）+（H1）tan＆thetas; B＆nlE; L1和＆thetas; B>＆thetas; C在非垂直表面上的任何点，其中＆amp; A; A是入射光的倾角， 在非垂直表面上的点处的倾斜角度; C是直立表面上的点处的倾角，H1是非垂直表面的高度，H2是直立表面的高度，H是高度 框架部分的距离L1是从像素区域的边缘到直立表面的上边缘的距离，L1'是在平面方向上从直立表面的上边缘到下边缘的距离。