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44 条记录 (耗时 0.022 秒)

    Method of producing a vacuum circuit breaker
    1.
    发明授权
    Method of producing a vacuum circuit breaker 失效
    一种真空断路器的制造方法

    公开(公告)号：US4231814A

    公开(公告)日：1980-11-04

    申请号：US013807

    申请日：1979-02-22

    申请人： Ryuji Watanabe ,  Hideo Arakawa ,  Keiichi Kuniya

    发明人： Ryuji Watanabe ,  Hideo Arakawa ,  Keiichi Kuniya

    IPC分类号： H01H1/02 ,  C21D1/44

    CPC分类号： H01H1/0203 ,  Y10T29/49105

    摘要： A method of producing a vacuum circuit breaker, the breaker contacts of which are made of a cast alloy which contains copper or a copper alloy as its main component and, as the sub-component, a metal having a lower melting point and a higher vapor pressure than the main component and having a solubility limit to the main component at room temperature, e.g. lead, bismuth or an alloy of lead and bismuth, the sub-component being contained in excess of said solubility limit. The cast alloy is heated at a temperature not lower than 800.degree. C. but not so high as to cause a melting of the cast alloy, in a vacuum atmosphere which ranges in a pressure between 10.sup.-4 and 10.sup.-6 Torr, before the alloy is mounted as the breaker contacts in the vacuum circuit breaker. A plastic working may be imparted to the cast alloy before the mounting, by, for example, forging. Further, a second heat treatment may be effected on the cast alloy to which the plastic working has been imparted, under the same condition as the first heating. The heating is effective in promoting the spheroidization of the sub-component, and contributes to the prevention of exudation of sub-component to the surface of the breaker contact.

    摘要翻译： 一种制造真空断路器的方法，其断路器触点由含有铜或铜合金作为其主要成分的铸造合金制成，并且作为副组分，具有较低熔点和较高蒸气的金属 压力高于主要组分，并且在室温下具有对主要组分的溶解度极限，例如 铅，铋或铅和铋的合金，所述子成分含有超过所述溶解度极限。 将铸造合金在不低于800℃的温度下加热，但不高于在10-4和10-6托之间的压力范围内的真空气氛中引起熔融的铸造合金， 合金作为断路器触点安装在真空断路器中。 可以通过例如锻造在安装之前对铸造合金施加塑性加工。 此外，在与第一加热相同的条件下，可以对已经施加塑性加工的铸造合金进行第二热处理。 加热有利于促进副成分的球化，有助于防止副成分向断路器接触面的渗出。

    Vacuum-type circuit breaker
    2.
    发明授权
    Vacuum-type circuit breaker 失效
    真空式断路器

    公开(公告)号：US4229631A

    公开(公告)日：1980-10-21

    申请号：US922368

    申请日：1978-07-06

    申请人： Hideo Arakawa ,  Takashi Namekawa ,  Keiichi Kuniya ,  Hiroyuki Sugawara

    发明人： Hideo Arakawa ,  Takashi Namekawa ,  Keiichi Kuniya ,  Hiroyuki Sugawara

    IPC分类号： H01H33/66 ,  H01H1/02 ,  H01H1/025

    CPC分类号： H01H1/0203

    摘要： A vacuum-type circuit breaker comprising an evacuated container, and a pair of contacts disposed in the container and adapted to be moved between an open position and a closed position to permit a circuit breaking arc to be generated across the contacts, the contacts being made of a copper alloy containing manganese. The vacuum-type circuit breaker provided with the contacts of the aforementioned type has a higher dielectric strength than conventional vacuum-type circuit breakers.

    摘要翻译： 一种真空型断路器，包括抽真空的容器，以及设置在容器中的一对触点，其适于在打开位置和关闭位置之间移动，以允许在触头两端产生断路电弧，触点被制成 的含有锰的铜合金。 设置有上述类型的触点的真空型断路器具有比传统的真空型断路器更高的介电强度。

    Vacuum-type circuit breaker
    4.
    发明授权
    Vacuum-type circuit breaker 失效
    真空式断路器

    公开(公告)号：US4091248A

    公开(公告)日：1978-05-23

    申请号：US589673

    申请日：1975-06-24

    申请人： Hideo Arakawa ,  Keiichi Kuniya

    发明人： Hideo Arakawa ,  Keiichi Kuniya

    IPC分类号： C22C9/00 ,  H01H1/02 ,  H01H1/025 ,  H01H33/66

    CPC分类号： H01H1/0203

    摘要： In a vacuum-type circuit breaker, a contact is composed of a principal component material of Cu alloy, to which a Pb-Bi alloy, containing either 18 to 45 weight % Bi or 65 to 80 weight % Bi and at least one of either cobalt or iron are added. Said contact is provided with a structure in which at least one of either cobalt phase or iron phase is dispersed in a copper matrix and Pb-Bi alloy phase is dispersed in the grain boundary, and has extremely low chopping current.

    摘要翻译： 在真空型断路器中，接触由Cu合金的主要成分材料构成，Pb-Bi合金含有18-45重量％Bi或65-80重量％Bi和至少一个 加入钴或铁。 所述接触具有这样的结构，其中钴相或铁相中的至少一种分散在铜基体中，并且Pb-Bi合金相分散在晶界中，并且具有极低的切断电流。

    Method of fabricating electrode plate for supporting semiconductor device
    6.
    发明授权
    Method of fabricating electrode plate for supporting semiconductor device 失效
    制造用于支撑半导体器件的电极板的方法

    公开(公告)号：US4254548A

    公开(公告)日：1981-03-10

    申请号：US37025

    申请日：1979-05-08

    申请人： Hideo Arakawa ,  Keiichi Kuniya ,  Masabumi Ohashi

    发明人： Hideo Arakawa ,  Keiichi Kuniya ,  Masabumi Ohashi

    IPC分类号： C22C49/00 ,  H01L21/48 ,  H01L21/52 ,  H01L23/492 ,  H01R43/02

    CPC分类号： H01L23/4928 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49213

    摘要： A bundle of carbon fibers each coated with copper or copper alloy is uniformly wound around a core rod under tension, and subjected to a hot press treatment in a non-oxidizing atmosphere. The core rod is then cut off along the surface of a plate formed by the hot-press to form a supporting electrode plate for a semiconductor device. The electrode plate thus fabricated incorporates therein carbon fibers in a spiral and concentric circular array around the core rod.

    摘要翻译： 各自涂覆有铜或铜合金的一束碳纤维在张力下均匀地缠绕在芯棒上，并在非氧化气氛中进行热压处理。 然后沿着由热压机形成的板的表面切断芯棒，以形成用于半导体器件的支撑电极板。 如此制造的电极板在其中包含围绕芯棒的螺旋和同心圆形阵列中的碳纤维。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US4196442A

    公开(公告)日：1980-04-01

    申请号：US911078

    申请日：1978-05-31

    申请人： Keiichi Kuniya ,  Hideo Arakawa ,  Kunihiro Maeda ,  Keiichi Morita

    发明人： Keiichi Kuniya ,  Hideo Arakawa ,  Kunihiro Maeda ,  Keiichi Morita

    IPC分类号： C22C49/00 ,  H01L21/52 ,  H01L21/58 ,  H01L23/051 ,  H01L23/373 ,  H01L23/492 ,  H01L23/48

    CPC分类号： H01L23/4928 ,  H01L23/051 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/01079

    摘要： A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.

    摘要翻译： 半导体器件包括半导体衬底和焊接到半导体衬底的一个表面的至少一个支撑电极。 支撑电极由具有嵌入导电金属的基体中的纤维的复合体构成。 纤维的热膨胀系数基本上等于或小于半导体衬底的热膨胀系数。 纤维至少在复合体的表面部分中以环形，圆形，螺旋状或类似图案排列，复合体在该表面部分上结合到基底上。

    Article hanging system, slidable wire holder, detachable wire holder, wire hook and wire gripper
    9.
    发明授权
    Article hanging system, slidable wire holder, detachable wire holder, wire hook and wire gripper 有权
    悬挂系统，滑动线架，可拆卸线架，线钩和线夹

    公开(公告)号：US07617649B2

    公开(公告)日：2009-11-17

    申请号：US11427596

    申请日：2006-06-29

    申请人： Hideo Arakawa

    发明人： Hideo Arakawa

    IPC分类号： E04B2/00

    CPC分类号： F16B35/041 ,  A47F5/0006 ,  A47F5/0846 ,  A47F5/0892 ,  A47G1/1686 ,  F16B35/06 ,  F16B37/045 ,  F16B45/00 ,  Y10T24/31 ,  Y10T24/3976 ,  Y10T24/4544

    摘要： An article hanging system capable of easily changing an exhibit position and an exhibit height of an article such as a goods exhibited in a shop, a hanger and a display shelf comprises a ceiling rail assembly, a wire holder slidably retained to the ceiling rail assembly, a wire hanging down from the wire holder, a gripper fixably attachable at a desired position along the wire, a wire holder attached to a lower end of the wire and a floor rail assembly to which the wire holder is slidably retained. Each of the rail assemblies comprises longitudinal rails extending in a longitudinal direction (the Y-direction) and lateral rails slidable with respect to the longitudinal rail as being spanned between the longitudinal rails. Each of the wire holders are slidable along the lateral rail.

    摘要翻译： 能够容易地改变展示位置的物品悬挂系统和商店，衣架和展示架中展示的商品等物品的展示高度，包括：天花板导轨组件，可滑动地保持在天花板导轨组件上的线架， 从电线支架垂下的电线，可固定地连接在沿线的期望位置的夹具，附接到电线的下端的电线保持架以及电线架可滑动地保持在其上的地板导轨组件。 每个轨道组件包括沿纵向方向（Y方向）延伸的纵向轨道，以及横跨在纵向轨道之间相对于纵向轨道滑动的横向轨道。 每个线夹可沿着侧轨滑动。