公开(公告)号：US20180362430A1

公开(公告)日：2018-12-20

申请号：US16061764

申请日：2016-11-10

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Rajesh CHOWDHURY ,  Eylem TARKIN-TAS ,  Xuezhi JIN

IPC: C07C41/01 ,  C07C46/08

CPC classification number: C07C41/01 ,  C07C37/11 ,  C07C46/08 ,  C08G65/44 ,  C08G65/485 ,  C07C50/08 ,  C07C39/15 ,  C07C43/295

Abstract: A phenylene ether oligomer is prepared by a process that includes partially converting 2,6-dimethylphenol to 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl and/or 3,3′,5,5′-tetramethyldiphenoquinone, converting the residual 2,6 dimethylphenol to poly(2,6-dimethyl-1,4-phenylene ether) and any 3,3′,5,5′-tetramethyl-4,4′-dihydroxybiphenyl to 3,3′,5,5′-tetramethyldiphenoquinone, and reacting the poly(2,6-dimethyl-1,4-phenylene ether) and 3,3′,5,5′-tetramethyldiphenoquinone to form the phenylene ether oligomer. The preparation can be conducted without isolation of intermediates.

公开(公告)号：US20190152206A1

公开(公告)日：2019-05-23

申请号：US15778449

申请日：2016-11-22

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Carolyn A. DEGONZAGUE ,  Eylem TARKIN-TAS ,  Ying NA

IPC: B32B27/28 ,  B32B27/38 ,  B32B5/02 ,  B32B5/08 ,  B32B5/26 ,  B32B7/04 ,  C08J5/24

Abstract: A composite comprises a reinforcing fabric and an at least partially cured composition at least partially coating the reinforcing fabric, wherein the reinforcing fabric comprises first fibers wrapped with, woven with, or wrapped and woven with polyimide fibers, and the at least partially cured composition comprises the product of 30 to 70 weight percent of a poly(phenylene ether) having a number average molecular weight of 600 to 2000 AMU, 30 to 70 weight percent of a curable component, and a curing agent, wherein weight percent is based on the combined weight of poly(phenylene ether) and the curable component.

公开(公告)号：US20170247566A1

公开(公告)日：2017-08-31

申请号：US15519300

申请日：2015-09-24

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Eylem TARKIN-TAS ,  Edward Norman PETERS

IPC: C09D171/12 ,  C09D163/04 ,  C08J5/24 ,  B32B5/26 ,  C09D179/04 ,  C09D163/00 ,  B32B5/02 ,  C09D7/00 ,  C08J5/04

CPC classification number: C09D171/12 ,  B32B5/02 ,  B32B5/022 ,  B32B5/08 ,  B32B5/22 ,  B32B5/26 ,  B32B2250/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2262/14 ,  B32B2264/02 ,  B32B2264/0214 ,  B32B2307/204 ,  B32B2457/08 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08J2371/12 ,  C08J2379/04 ,  C08J2471/12 ,  C08L71/12 ,  C09D7/20 ,  C09D163/00 ,  C09D163/04 ,  C09D179/04 ,  C08L63/00 ,  C08L79/04 ,  C08L9/00 ,  C08L83/04

Abstract: A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.