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公开(公告)号：US20150114131A1
公开(公告)日：2015-04-30
申请号：US14188183
申请日：2014-02-24
发明人： Jin Uk Cha , Gyu Seok Kim , Eun Ju Yang , Mi Yang Kim , Suk Jin Ham
CPC分类号： G01N3/24 , G01N3/04 , G01N19/04 , G01N2203/0037
摘要： Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.
摘要翻译： 这里公开了一种接合力测试装置，包括：安装有待测试的多个被检体的样品的保持器; 旋转所述保持器的旋转部分; 以及设置在所述固定末端面向所述保持器的方向上的固定末端，其中在所述保持器旋转时，所述固定末端与所述待测试对象中的任何一个接触，并且将粘合 固定头和被测试对象之间的部分。
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公开(公告)号：US20150136458A1
公开(公告)日：2015-05-21
申请号：US14182206
申请日：2014-02-17
发明人： Eun Ju Yang , Gyu Seok Kim , Suk Jin Ham , Se Yoon Park , Jin Uk Cha , Hee Suk Chung , Mi Yang Kim
CPC分类号： H05K1/09 , C23C14/185 , C23C14/34 , C23C14/5833 , C23F4/00 , C23F4/04 , H05K1/03 , H05K1/0306 , H05K3/027 , H05K3/06 , H05K3/16 , H05K3/388 , H05K2201/0391 , H05K2203/092
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
摘要翻译： 这里公开了一种印刷电路板及其制造方法。 具体地，根据本发明的优选实施例，印刷电路板包括：绝缘层; 以及形成在所述绝缘层上的金属层，其中在所述金属层中，（110）和（112）的晶体取向所占的比例为20〜80％。 通过这样做，本发明的优选实施例提供了一种印刷电路板，其包括具有不同晶体取向的金属层，以最小化妨碍诸如导电性的电特性的因素，并改善机械性能的各向同性和制造印刷电路板的方法 。
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3.发明授权公开(公告)号：US09099329B2
公开(公告)日：2015-08-04
申请号：US13782864
申请日：2013-03-01
发明人： Hee Suk Chung , Gyu Seok Kim , Han Wool Kang , Kyung Ho Lee , Mi Yang Kim , Suk Jin Ham
IPC分类号： H01L29/06 , H01L21/033 , B82Y10/00 , B82Y40/00 , H01L29/66 , H01L29/775 , H01L21/02 , H01L33/18
CPC分类号： H01L29/0676 , B82Y10/00 , B82Y40/00 , H01L21/0254 , H01L21/02603 , H01L21/02614 , H01L29/66469 , H01L29/775 , H01L33/18
摘要： There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.
摘要翻译： 提供了一种In纳米线，其包括基板，形成在基板上的铟薄膜，形成在铟薄膜上并具有通过形成图案的至少一个通孔的绝缘膜，以及从铟垂直地突出的In纳米线 薄膜通过至少一个通孔。
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公开(公告)号：US09095063B2
公开(公告)日：2015-07-28
申请号：US14182206
申请日：2014-02-17
发明人： Eun Ju Yang , Gyu Seok Kim , Suk Jin Ham , Se Yoon Park , Jin Uk Cha , Hee Suk Chung , Mi Yang Kim
CPC分类号： H05K1/09 , C23C14/185 , C23C14/34 , C23C14/5833 , C23F4/00 , C23F4/04 , H05K1/03 , H05K1/0306 , H05K3/027 , H05K3/06 , H05K3/16 , H05K3/388 , H05K2201/0391 , H05K2203/092
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
摘要翻译： 这里公开了一种印刷电路板及其制造方法。 具体地，根据本发明的优选实施例，印刷电路板包括：绝缘层; 以及形成在所述绝缘层上的金属层，其中在所述金属层中，（110）和（112）的晶体取向所占的比例为20〜80％。 通过这样做，本发明的优选实施例提供了一种印刷电路板，其包括具有不同晶体取向的金属层，以最小化妨碍诸如导电性的电特性的因素，并改善机械性能的各向同性和制造印刷电路板的方法 。
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