公开(公告)号：US20190237375A1

公开(公告)日：2019-08-01

申请号：US16132919

申请日：2018-09-17

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ha Yong JUNG ,  Jae Kul LEE ,  Ji Hye SHIM ,  Han Sang CHO ,  Woon Ha CHOI ,  Jae Min CHOI ,  Dong Jin KIM ,  Sung Taek WOO

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L23/48 ,  H01L27/146 ,  H01L23/00

摘要： A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

公开(公告)号：US20190189667A1

公开(公告)日：2019-06-20

申请号：US15982676

申请日：2018-05-17

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ha Yong JUNG ,  Jae Kul LEE ,  Sung Taek WOO ,  Ji Hye SHIM ,  Dong Jin KIM ,  Han Sang CHO ,  Woon Ha CHOI ,  Jae Min CHOI

IPC分类号： H01L27/146 ,  H01L23/00

CPC分类号： H01L27/14636 ,  H01L24/19 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L2224/214

摘要： A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

公开(公告)号：US20190189589A1

公开(公告)日：2019-06-20

申请号：US15986212

申请日：2018-05-22

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ha Yong JUNG ,  Jae Min CHOI ,  Jae Kul LEE ,  Dong Jin KIM ,  Sung Taek WOO ,  Ji Hye SHIM ,  Woon Ha CHOI ,  Han Sang CHO

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48

CPC分类号： H01L25/0652 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/09135 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24155 ,  H01L2224/25171 ,  H01L2224/32145 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48159 ,  H01L2224/48165 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/49176 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2225/06558 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.