公开(公告)号：US20160372646A1

公开(公告)日：2016-12-22

申请号：US15147315

申请日：2016-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-heon YOON ,  Hak-hwan KIM ,  Dae-sup KIM ,  Jeong-hee KIM ,  Dong-myung SHIN ,  Kwang-seok YUN

IPC: H01L33/62 ,  H01L33/32 ,  H01L33/38 ,  H05B37/02 ,  H01L33/54 ,  H01L33/50 ,  H05B33/08 ,  H01L33/16 ,  H01L33/22

CPC classification number: H01L33/62 ,  H01L33/16 ,  H01L33/20 ,  H01L33/38 ,  H05B33/086

Abstract: An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.

Abstract translation: LED封装包括基板，设置在基板上的发光结构，设置在发光结构上的电极结构和设置在电极结构上的外部连接端子，外部连接端子包括长轴和次要 轴。 外部连接端子的长轴垂直于基板的切割面。