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公开(公告)号：US20180175247A1
公开(公告)日：2018-06-21
申请号：US15609653
申请日：2017-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ju-heon YOON , Jae-in Sim , Gi-bum Kim
CPC classification number: H01L33/405 , H01L33/22 , H01L33/44 , H01L33/60 , H01L33/62 , H01L2933/0016
Abstract: A semiconductor light-emitting device includes a light-emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a reflective electrode layer covering a top surface of the second semiconductor layer; an insulating structure covering a region of the top surface of the second semiconductor layer, the region being around the reflective electrode layer; a first interconnection conductive layer contacting a contact region of the first semiconductor layer through the insulating structure and, together with the insulating structure, constituting an omni-directional reflector (ODR) structure; and a second interconnection conductive layer contacting the reflective electrode layer through the insulating structure.
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公开(公告)号：US20190027649A1
公开(公告)日：2019-01-24
申请号：US15876435
申请日：2018-01-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ju-heon YOON , Jae-in SIM , Gi-bum KIM , Ha-yeong SON , Young-sub SHIN
CPC classification number: H01L33/24 , H01L21/0242 , H01L21/02433 , H01L21/0254 , H01L21/02639 , H01L25/0753 , H01L33/007 , H01L33/08 , H01L33/22 , H01L33/382 , H01L33/405 , H01L33/42 , H01L33/46 , H01L33/60 , H01L51/5218 , H01L51/5234
Abstract: A semiconductor light-emitting device includes a light-emitting structure, a reflective electrode layer, and a transparent cover layer. The light-emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer. The reflective electrode layer covers an upper surface of the second semiconductor layer. The transparent cover layer covers an upper surface of the second semiconductor layer on the reflective electrode layer. The transparent cover layer includes a tail portion including a first portion and a second portion. The first portion covers an edge of the reflective electrode layer and a convex upper surface. The second portion is thinner than and extends from the first portion.
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公开(公告)号：US20160372646A1
公开(公告)日：2016-12-22
申请号：US15147315
申请日：2016-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ju-heon YOON , Hak-hwan KIM , Dae-sup KIM , Jeong-hee KIM , Dong-myung SHIN , Kwang-seok YUN
IPC: H01L33/62 , H01L33/32 , H01L33/38 , H05B37/02 , H01L33/54 , H01L33/50 , H05B33/08 , H01L33/16 , H01L33/22
CPC classification number: H01L33/62 , H01L33/16 , H01L33/20 , H01L33/38 , H05B33/086
Abstract: An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.
Abstract translation: LED封装包括基板，设置在基板上的发光结构，设置在发光结构上的电极结构和设置在电极结构上的外部连接端子，外部连接端子包括长轴和次要 轴。 外部连接端子的长轴垂直于基板的切割面。
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公开(公告)号：US20140252390A1
公开(公告)日：2014-09-11
申请号：US14154312
申请日：2014-01-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ju-heon YOON , Gi-bum KIM , Sang-yeon KIM , Sang-yeob SONG , Won-goo HUR
CPC classification number: H01L33/60 , H01L33/405 , H01L33/46 , H01L2224/13
Abstract: A semiconductor light-emitting device includes a semiconductor region having a light-emitting structure, an electrode layer formed on the semiconductor region, and a reflective protection structure extending exposing the upper surface of the electrode layer and covering the semiconductor region adjacent to the electrode layer.
Abstract translation: 半导体发光器件包括具有发光结构的半导体区域，形成在半导体区域上的电极层，以及反射保护结构，其延伸暴露电极层的上表面并覆盖与电极层相邻的半导体区域 。
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