公开(公告)号：US10961414B2

公开(公告)日：2021-03-30

申请号：US16421568

申请日：2019-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Sang Eui Lee ,  Ken Kokubo ,  Eigo Miyazaki ,  Do Yoon Kim

IPC: H01L21/321 ,  H01L21/306 ,  H01L21/304 ,  H01L21/302 ,  C09K3/14 ,  C09G1/02 ,  C09G1/00

Abstract: A polishing slurry including a composite including a hydrophilic fullerene and an ionic compound, a method of manufacturing the same, and a method of manufacturing a semiconductor device.

公开(公告)号：US11424133B2

公开(公告)日：2022-08-23

申请号：US16825237

申请日：2020-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Do Yoon Kim ,  Boun Yoon

IPC: H01L21/321 ,  H01L21/768 ,  H01L21/288 ,  C09G1/04 ,  C09K3/14 ,  B24B37/04

Abstract: A method of manufacturing a metal structure including forming a metal layer including a metal and a nano-abrasive and supplying slurry on the metal layer to perform chemical mechanical polishing, a metal structure including a metal and a nano-abrasive having an average particle diameter of less than about 5 nanometers, and a metal wire, a semiconductor device, and an electronic device including the same.

公开(公告)号：US11254840B2

公开(公告)日：2022-02-22

申请号：US16750060

申请日：2020-01-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Eigo Miyazaki ,  Do Yoon Kim

IPC: C09G1/02 ,  H01L21/321 ,  H01L21/768

Abstract: A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.

公开(公告)号：US10957557B2

公开(公告)日：2021-03-23

申请号：US16444076

申请日：2019-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do Yoon Kim ,  Kenji Takai

IPC: H01L21/321 ,  C09G1/02 ,  C09K3/14 ,  B24B37/04 ,  H01L21/306 ,  B82Y30/00

Abstract: A polishing slurry includes a carbon polishing particle and an exothermic material.

公开(公告)号：US11795347B2

公开(公告)日：2023-10-24

申请号：US17676928

申请日：2022-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kenji Takai ,  Eigo Miyazaki ,  Do Yoon Kim

IPC: C09G1/02 ,  H01L21/321 ,  H01L21/768

CPC classification number: C09G1/02 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76834 ,  H01L21/76843 ,  H01L21/76877

Abstract: A polishing slurry including a hydrophilic nanocarbon particle having a nitrogen-containing functional group, and a weight ratio of a nitrogen element relative to a carbon element of the hydrophilic nanocarbon particle, the weight ratio expressed as N/C×100% is greater than or equal to about 5 wt %, and a method of manufacturing a semiconductor device using the polishing slurry.

公开(公告)号：US11643768B2

公开(公告)日：2023-05-09

申请号：US16946505

申请日：2020-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong Su Han ,  Do Yoon Kim ,  Tae Gyoon Noh ,  Jun Hoe Choi

IPC: D06F34/05 ,  D06F34/06 ,  D06F34/10 ,  D06F58/48 ,  D06F34/18 ,  D06F58/38 ,  D06F34/26 ,  D06F58/46 ,  D06F58/36 ,  H02J50/00 ,  H02J50/10 ,  H02J50/15 ,  D06F103/34 ,  D06F105/12 ,  D06F103/04 ,  D06F105/58

CPC classification number: D06F34/05 ,  D06F34/06 ,  D06F34/10 ,  D06F34/18 ,  D06F34/26 ,  D06F58/36 ,  D06F58/38 ,  D06F58/46 ,  D06F58/48 ,  H02J50/001 ,  H02J50/10 ,  H02J50/15 ,  D06F2103/04 ,  D06F2103/34 ,  D06F2105/12 ,  D06F2105/58

Abstract: A wireless sensing device disposed a drum along with laundry to measure humidity in the drum, thereby increasing accuracy in estimation of a degree of dryness, a dryer for determining a degree of dryness of the laundry using the wireless sensing device, and a method of controlling the dryer. The wireless sensing device includes a sensing module including a humidity sensor for measuring humidity in a drum of a dryer into which the wireless sensing module is thrown; a sensor communication module transmitting or receiving data with a main communication module of the dryer through wireless communication; a sensor controller configured to control the sensor communication module to transmit a humidity value corresponding to an output of the sensing module to the main communication module; and a sensor power supplier supplying power to the sensing module, the sensor communication module, and the sensor controller.