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公开(公告)号:US20170358545A1
公开(公告)日:2017-12-14
申请号:US15440621
申请日:2017-02-23
发明人: JU-IL CHOI , HYOJU KIM , KWANGJIN MOON , SUJEONG PARK , JUBIN SEO , NAEIN LEE , HO-JIN LEE
IPC分类号: H01L23/00
CPC分类号: H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/0345 , H01L2224/0401 , H01L2224/05022 , H01L2224/05564 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/1146 , H01L2224/11462 , H01L2224/1147 , H01L2224/11614 , H01L2224/11849 , H01L2224/13007 , H01L2224/13017 , H01L2224/13018 , H01L2224/13026 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/16146 , H01L2224/16237 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要: A pad is disposed on a substrate. A bump structure is disposed on the pad and electrically connected to the pad. The bump structure includes a first copper layer and a second copper layer sequentially stacked on the pad and a solder ball on the second copper layer. A first X-ray diffraction (XRD) peak intensity ratio of (111) plane to (200) plane of the first copper layer is greater than a second XRD peak intensity ratio of (111) plane to (200) plane of the second copper layer.