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公开(公告)号：US20140374772A1
公开(公告)日：2014-12-25
申请号：US14483036
申请日：2014-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-In YANG , Tae-Hyung KIM , Si-Hyuk LEE , Sang-Yeob SONG , Cheol-Soo SONE , Hak-Hwan KIM , Jin-Hyun LEE
CPC classification number: H01L33/62 , H01L33/0025 , H01L33/005 , H01L33/007 , H01L33/0079 , H01L33/20 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer.
Abstract translation: 半导体发光器件及其制造方法。 半导体发光器件包括依次堆叠在衬底上的第一电极层，绝缘层，第二电极层，第二半导体层，有源层和第一半导体层，通过 基板与第一电极层电连接，第二触点通过基板，第一电极层和绝缘层与第二电极层连通。 第一电极层通过填充穿过第二电极层，第二半导体层和有源层的接触孔而电连接到第一半导体层，并且绝缘层围绕接触孔的内周表面以绝缘 来自第二电极层的第一电极层。
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公开(公告)号：US20150115281A1
公开(公告)日：2015-04-30
申请号：US14594039
申请日：2015-01-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-In YANG , Tae-Hyung KIM , Si-Hyuk LEE , Sang-Yeob SONG , Cheol-Soo SONE , Hak-Hwan KIM , Jin-Hyun LEE
CPC classification number: H01L33/62 , H01L33/0025 , H01L33/005 , H01L33/007 , H01L33/0079 , H01L33/20 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer.
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公开(公告)号：US20150236224A1
公开(公告)日：2015-08-20
申请号：US14607864
申请日：2015-01-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chang-Hoon KWAK , Hak-Hwan KIM , Byung-Kwon YOON , Hyo-Jin LEE , Han-Na HEO
CPC classification number: H01L33/504 , G02B6/0023 , G02B6/0073 , G02B6/009 , H01L25/167 , H01L33/486 , H01L33/505 , H01L33/62 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: Provided are a light emitting device package and a method of fabricating the same. The package includes a package body including a lead frame, a light emitting device mounted on the package body, a bonding wire configured to electrically connect an electrode formed on a top surface of the light emitting device with the lead frame, a phosphor sheet attached on the light emitting device, and a phosphor molding portion to cover the light emitting device and the phosphor sheet.
Abstract translation: 提供一种发光器件封装及其制造方法。 该封装包括一个封装主体，它包括一个引线框架，一个安装在封装主体上的发光器件，一个接合线，它被配置成将形成在发光器件顶表面上的电极与引线框架电连接， 发光装置和用于覆盖发光装置和荧光体片的荧光体成型部。
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公开(公告)号：US20150125983A1
公开(公告)日：2015-05-07
申请号：US14594020
申请日：2015-01-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-In YANG , Tae-Hyung KIM , Si-Hyuk LEE , Sang-Yeob SONG , Cheol-Soo SONE , Hak-Hwan KIM , Jin-Hyun LEE
CPC classification number: H01L33/62 , H01L33/0025 , H01L33/005 , H01L33/007 , H01L33/0079 , H01L33/20 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A semiconductor light-emitting device, and a method of manufacturing the same. The semiconductor light-emitting device includes a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to be electrically connected to the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the insulating layer to communicate with the second electrode layer. The first electrode layer is electrically connected to the first semiconductor layer by filling a contact hole that passes through the second electrode layer, the second semiconductor layer, and the active layer, and the insulating layer surrounds an inner circumferential surface of the contact hole to insulate the first electrode layer from the second electrode layer.
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