公开(公告)号：US11594544B2

公开(公告)日：2023-02-28

申请号：US16942456

申请日：2020-07-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyojoon Ryu ,  Younghwan Son ,  Seogoo Kang ,  Jesuk Moon ,  Junghoon Jun ,  Kohji Kanamori ,  Jeehoon Han

IPC: H01L27/1157 ,  H01L27/11582 ,  H01L27/11573 ,  H01L27/11565

Abstract: A semiconductor device includes; gate layers stacked on a substrate, a channel layer extending through the gate layers, a string select gate layer disposed on the channel layer and a string select channel layer extending through the string select gate layer to contact the channel layer. The string select channel layer includes a first portion below the string select gate layer including a first protruding region, a second portion extending through the string select gate layer, and a third portion above the string select gate layer including a second protruding region.

公开(公告)号：US11637117B2

公开(公告)日：2023-04-25

申请号：US17032277

申请日：2020-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyojoon Ryu ,  Kwanyong Kim ,  Seogoo Kang ,  Sunil Shim ,  Wonseok Cho ,  Jeehon Han

IPC: H01L27/1157 ,  H01L23/522 ,  H01L27/11573 ,  H01L27/11582 ,  H01L27/11565

Abstract: A semiconductor device includes; a memory stack disposed on a substrate and including a lower gate electrode, an upper gate stack including a string selection line, a vertically extending memory gate contact disposed on the lower gate electrode, and a vertically extending selection line stud disposed on the string selection line. The string selection line includes a material different from that of the lower gate electrode, and the selection line stud includes a material different from that of the memory gate contact.

公开(公告)号：US20220359563A1

公开(公告)日：2022-11-10

申请号：US17651633

申请日：2022-02-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngji Noh ,  Jung-Hwan Park ,  Kwangyoung Jung ,  Hyojoon Ryu ,  Jeehoon Han

IPC: H01L27/11582 ,  H01L27/11556 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11526 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L23/528

Abstract: Provided are three-dimensional semiconductor memory devices and electronic systems including the same. The device includes a substrate, stack structures each including interlayer dielectric layers and gate electrodes, which are alternately and repeatedly stacked on the substrate, vertical channel structures which penetrate the stack structures, and a separation structure, which extends in a first direction across between the stack structures. The separation structure includes first parts each having a pillar shape, which extend in a third direction perpendicular to a top surface of the substrate, and second parts, which extend between the interlayer dielectric layers from sidewalls of the first parts and which connect the first parts to each other in the first direction. The separation structure is spaced apart from the vertical channel structures in a second direction which intersects the first direction.

公开(公告)号：US20220344244A1

公开(公告)日：2022-10-27

申请号：US17571874

申请日：2022-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyojoon Ryu ,  Bongyong Lee ,  Heesuk Kim ,  Junhee Lim ,  Sangyoun Jo ,  Kohji Kanamori ,  Jeehoon Han

IPC: H01L23/48 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11526 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11582

Abstract: A semiconductor device includes a first structure and a second structure thereon. The first structure includes a substrate, circuit elements on the substrate, a lower interconnection structure electrically connected to the circuit elements, and lower bonding pads, which are electrically connected to the lower interconnection structure. The second structure includes a stack structure including: gate electrodes and interlayer insulating layers, which are alternately stacked and spaced apart in a vertical direction; a plate layer that extends on the stack structure; channel structures within the stack structure, separation regions, which penetrate at least partially through the stack structure, and upper bonding pads, which are electrically connected to the gate electrodes and the channel structures, and are bonded to corresponding ones of the lower bonding pads.

公开(公告)号：US11411078B2

公开(公告)日：2022-08-09

申请号：US16701427

申请日：2019-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyojoon Ryu ,  Kiyoon Kang ,  Seogoo Kang ,  Shinhwan Kang ,  Jesuk Moon ,  Byunggon Park ,  Jaeryong Sim ,  Jinsoo Lim ,  Jisung Cheon ,  Jeehoon Han

IPC: H01L27/11565 ,  H01L27/11582 ,  H01L29/06 ,  H01L23/31 ,  G11C5/06 ,  H01L27/1157 ,  H01L27/11573

Abstract: A semiconductor device including a substrate having a cell, peripheral, and boundary area; a stack structure on the cell area and including insulating and interconnection layers that are alternately stacked; a molding layer on the peripheral area boundary areas; a selection line isolation pattern extending into the stack structure; a cell channel structure passing through the stack structure; and first dummy patterns extending into the molding layer on the peripheral area, wherein upper surfaces of the first dummy patterns, an upper surface of the selection line isolation pattern, and an upper surface of the cell channel structure are coplanar, and at least one of the first dummy patterns extends in parallel with the selection line isolation pattern or cell channel structure from upper surfaces of the first dummy patterns, the upper surface of the selection line isolation pattern, and the upper surface of the cell channel structure toward the substrate.