公开(公告)号：US11648594B2

公开(公告)日：2023-05-16

申请号：US16890490

申请日：2020-06-02

申请人： Samsung Electronics Co., Ltd.

发明人： Seung Min Shin ,  Hun Jae Jang ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC分类号： B08B7/00 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/311

CPC分类号： B08B7/0042 ,  B08B3/10 ,  B08B7/0064 ,  H01L21/31111 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67098 ,  H01L21/67248 ,  H01L21/68764

摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US11721565B2

公开(公告)日：2023-08-08

申请号：US16690498

申请日：2019-11-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yong Jun Choi ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Sung Hyun Park ,  Seung Min Shin ,  Kun Tack Lee ,  Jinwoo Lee ,  Hun Jae Jang ,  Ji Hoon Cha

IPC分类号： H01L21/67 ,  H01L21/687 ,  B08B3/08

CPC分类号： H01L21/67167 ,  B08B3/08 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67063 ,  H01L21/68707

摘要： A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

公开(公告)号：US11631599B2

公开(公告)日：2023-04-18

申请号：US16683753

申请日：2019-11-14

申请人： Samsung Electronics Co., Ltd.

发明人： Ji Hoon Cha ,  Jinwoo Lee ,  Seok Hoon Kim ,  In Gi Kim ,  Seung Min Shin ,  Yong Jun Choi

IPC分类号： H01L21/67 ,  H01L21/687

摘要： An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.

公开(公告)号：US11605545B2

公开(公告)日：2023-03-14

申请号：US16692051

申请日：2019-11-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hun Jae Jang ,  Seung Min Shin ,  Seok Hoon Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Jinwoo Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC分类号： H01L21/67 ,  B08B7/00

摘要： A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

公开(公告)号：US20200335361A1

公开(公告)日：2020-10-22

申请号：US16692051

申请日：2019-11-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hun Jae JANG ,  Seung Min Shin ,  Seok Hoon Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Jinwoo Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC分类号： H01L21/67 ,  B08B7/00

摘要： A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.

公开(公告)号：US12042828B2

公开(公告)日：2024-07-23

申请号：US18299279

申请日：2023-04-12

申请人： Samsung Electronics Co., Ltd.

发明人： Seung Min Shin ,  Hun Jae Jang ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC分类号： B08B7/00 ,  B08B3/10 ,  H01L21/311 ,  H01L21/67 ,  H01L21/687

CPC分类号： B08B7/0042 ,  B08B3/10 ,  B08B7/0064 ,  H01L21/31111 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67098 ,  H01L21/67248 ,  H01L21/68764

摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US20230249230A1

公开(公告)日：2023-08-10

申请号：US18299279

申请日：2023-04-12

申请人： Samsung Electronics Co., Ltd.

发明人： Seung Min SHIN ,  Hun Jae Jang ,  Seok Hoon Kim ,  Young-Hoo Kim ,  In Gi Kim ,  Tae-Hong Kim ,  Kun Tack Lee ,  Ji Hoon Cha ,  Yong Jun Choi

IPC分类号： B08B7/00 ,  B08B3/10 ,  H01L21/67 ,  H01L21/687 ,  H01L21/311

CPC分类号： B08B7/0042 ,  B08B3/10 ,  B08B7/0064 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/31111 ,  H01L21/67098

摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

公开(公告)号：US20170187856A1

公开(公告)日：2017-06-29

申请号：US15508903

申请日：2015-07-28

申请人： Samsung Electronics Co., Ltd

发明人： Wook Tae Kim ,  Dong Soo Jung ,  In Gi Kim ,  Seon Mi Park ,  Gyu Ha Jo

IPC分类号： H04M1/18 ,  H04M1/02 ,  H04B1/3888 ,  B05D7/00

CPC分类号： H04M1/185 ,  B05D7/52 ,  C23C16/26 ,  H04B1/3888 ,  H04M1/0266

摘要： Disclosed herein is an electronic apparatus to allow a window to have an anti-scratch and anti-shock protection by allowing a coating unit including a coating layer having a high hardness and a coating layer having a low hardness, to be coated on an upper portion of the window. An electronic apparatus includes a display module, a window disposed on an upper portion of the display module to protect the display module, and a coating unit coated on an upper portion of the window to have a hardness to prevent the window from being damaged, wherein the coating unit comprises a first coating layer coated on the upper portion of the window and a second coating layer coated on an upper portion of the first coating layer to have a high hardness to prevent the window from being scratched, wherein the first coating layer is coated to have a relatively lower hardness than the second coating layer to absorb a shock applied to the window.