公开(公告)号：US10862015B2

公开(公告)日：2020-12-08

申请号：US16188777

申请日：2018-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In Hyung Lee ,  Sung Min Jang ,  Soon Won Jeong

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/40 ,  H01L33/52 ,  H01L33/50

Abstract: A semiconductor light emitting device package includes a lead frame structure including a first lead frame and a second lead frame. A resin portion is adjacent to side surfaces of the first lead frame and the second lead frame. A semiconductor light-emitting device is mounted on the first lead frame and the second lead frame, in the form of a flip chip, by eutectic bonding. Each of the first lead frame and the second lead frame has a plurality of first grooves extended in a first direction.

公开(公告)号：US10851294B2

公开(公告)日：2020-12-01

申请号：US15719724

申请日：2017-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Ho You ,  In Hyung Lee ,  Tae Hoon Kim ,  Jong Won Park ,  Chul Soo Yoon ,  Chi Woo Lee

IPC: C09K11/61 ,  C09K11/02 ,  C09K11/57

Abstract: There is provided a fluoride phosphor composite including: fluoride phosphor core particles that may be expressed by the empirical formula AxMFy:Mn4+, wherein A may be at least one selected from the group consisting of Li, Na, K, Rb, and Cs, M may be at least one selected from the group consisting of Si, Ti, Zr, Hf, Ge, and Sn, the composition ratio (x) of A may satisfy 2≤x≤3, the composition ratio (y) of F may satisfy 4≤y≤7, each fluoride phosphor composite particle may be coated with a Mn-free fluoride coating. The Mn-free fluoride coating may have a thickness less than or equal to 35% of the size of each fluoride phosphor composite particle.

公开(公告)号：US09917231B2

公开(公告)日：2018-03-13

申请号：US14839798

申请日：2015-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Won Park ,  In Hyung Lee ,  Tae Hoon Kim ,  Ji Ho You ,  Chi Woo Lee ,  Chul Soo Yoon

IPC: H01L33/50 ,  H01L33/52 ,  C09K11/61

CPC classification number: H01L33/502 ,  C09K11/617 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A fluoride phosphor may include: a fluoride represented by a composition formula: AxMFy:Mnz4+, where A is at least one selected from among Li, Na, K, Rb, and Cs, M is at least one selected from among Si, Ti, Zr, Hf, Ge and Sn, a composition ratio (x) of A satisfies 2≦x≦3, a composition ratio (y) of F satisfies 4≦y≦7, and a composition ratio (z) of Mn satisfies 0

公开(公告)号：US09809744B2

公开(公告)日：2017-11-07

申请号：US14963268

申请日：2015-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Ho You ,  In Hyung Lee ,  Tae Hoon Kim ,  Jong Won Park ,  Chul Soo Yoon ,  Chi Woo Lee

IPC: B32B5/16 ,  C09K11/57 ,  C09K11/61 ,  C09K11/02

CPC classification number: C09K11/617 ,  C09K11/025 ,  C09K11/57 ,  C09K11/61 ,  Y02B20/181

Abstract: There is provided a fluoride phosphor composite including: fluoride phosphor core particles that may be expressed by the empirical formula AxMFy:Mn4+, wherein A may be at least one selected from the group consisting of Li, Na, K, Rb, and Cs, M may be at least one selected from the group consisting of Si, Ti, Zr, Hf, Ge, and Sn, the composition ratio (x) of A may satisfy 2≦x≦3, the composition ratio (y) of F may satisfy 4≦y≦7, each fluoride phosphor composite particle may be coated with a Mn-free fluoride coating. The Mn-free fluoride coating may have a thickness less than or equal to 35% of the size of each fluoride phosphor composite particle.

公开(公告)号：US09490401B2

公开(公告)日：2016-11-08

申请号：US15015951

申请日：2016-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： In Hyung Lee ,  Jong Won Park ,  Hyong Sik Won ,  Chul Soo Yoon ,  Dong Hoon Lee

IPC: H01L33/00 ,  H01L33/50 ,  C09K11/00 ,  H05B33/10 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/502 ,  C09K11/00 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H05B33/10 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: There is provided a method of manufacturing a light emitting device which includes preparing a light emitting element emitting excitation light and a substrate on which the light emitting element is disposed. A fluoride phosphor is provided to absorb excitation light emitted from the light emitting element to emit visible light, and is represented by Chemical Formula (1). The fluoride phosphor is disposed on at least one of the light emitting element and the substrate, wherein Chemical Formula (1): AxMFy:Mn4+ (wherein 2≦x≦3 and 4≦y≦7, A is at least one element selected from the group consisting of Li, Na, K, Rb, and Cs, and M is at least one element selected from the group consisting Si, Ti, Zr, Hf, Ge, and Sn).

Abstract translation: 提供一种制造发光器件的方法，其包括制备发射激发光的发光元件和其上设置有发光元件的衬底。 提供氟化物荧光体以吸收从发光元件发射的激发光以发射可见光，并且由化学式（1）表示。 氟化物荧光体设置在发光元件和基板中的至少一个上，其中化学式（1）：AxMFy：Mn4 +（其中2≤x≤3且4≤y≤7，A为至少一种选自 由Li，Na，K，Rb和Cs组成的组，M是选自Si，Ti，Zr，Hf，Ge和Sn中的至少一种元素）。