公开(公告)号：US20180216787A1

公开(公告)日：2018-08-02

申请号：US15656094

申请日：2017-07-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Wook CHUNG ,  Kyung Wook HWANG

IPC: F21K9/232 ,  H01L25/075 ,  H01L33/06 ,  H01L33/32 ,  H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  F21K9/27

CPC classification number: F21K9/232 ,  F21K9/23 ,  F21K9/27 ,  F21V3/02 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/06 ,  H01L33/32 ,  H01L33/502 ,  H01L33/505 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/49107 ,  H01L2224/73265

Abstract: An LED device includes a transparent substrate having a bar-like shape and having a first surface and a second surface opposed thereto, a plurality of LED chips mounted on the first surface of the transparent substrate and electrically connected to each other, each of the plurality of LED chips having a reflective layer disposed on a surface mounted in the transparent substrate, a first connection terminal and a second connection terminal disposed on opposing ends of the transparent substrate and electrically connected to the plurality of LED chips, a bonding layer interposed between the plurality of LED chips and the transparent substrate and including a metal filler, and a wavelength conversion portion covering the first surface and the second surface of the transparent substrate and the plurality of LED chips.