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公开(公告)号：US20190019780A1
公开(公告)日：2019-01-17
申请号：US15941299
申请日：2018-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung Jun KIM , Yong Min KWON , Geun Woo KO , Pun Jae CHOI , Dong Ho KIM
IPC: H01L25/075 , H01L33/62 , H01L33/54 , H01L33/56
Abstract: A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
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公开(公告)号：US20190019779A1
公开(公告)日：2019-01-17
申请号：US15827843
申请日：2017-11-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Min KWON , Kyoung Jun KIM
Abstract: A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.
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公开(公告)号：US20150243853A1
公开(公告)日：2015-08-27
申请号：US14516548
申请日：2014-10-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Nam Goo CHA , Yong Min KWON , Kyoung Jun KIM
CPC classification number: H01L33/486 , H01L33/0079 , H01L33/0095 , H01L33/16 , H01L33/62 , H01L2224/16225 , H01L2224/94 , H01L2933/0033 , H01L2933/0066
Abstract: A method of manufacturing a light emitting diode (LED) package may include forming a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate, forming first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, bonding a first surface of a light transmissive substrate opposite to a second surface thereof to the light emitting structure, identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate, forming one or more through holes in the light transmissive substrate to correspond to the first and second electrodes, and forming first and second via electrodes by filling the through holes with a conductive material.
Abstract translation: 制造发光二极管（LED）封装的方法可以包括在生长衬底上形成具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，形成连接的第一和第二电极 分别将第一和第二导电型半导体层与其第二表面相反的第一表面与发光结构接合，识别通过第二表面的第二表面的第一和第二电极的位置 所述透光基板在所述透光基板中形成一个或多个通孔，以对应于所述第一和第二电极，以及通过用导电材料填充所述通孔来形成第一和第二通孔电极。
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