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公开(公告)号：US20220068681A1
公开(公告)日：2022-03-03
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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公开(公告)号：US10334421B2
公开(公告)日：2019-06-25
申请号：US15458051
申请日：2017-03-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongpil Cho , Youngjoo Lee
Abstract: Disclosed is a near field communication device which includes an antenna, a transmission amplifier, a matching circuit connected between the antenna and the transmission amplifier, and a transmitter. The transmitter transmits a transmit clock to the matching circuit through the transmission amplifier, extracts an extraction clock from a waveform formed in the matching circuit, stores a phase difference between the transmit clock and the extraction clock, and controls transmission of an information signal through the antenna, the transmission amplifier, and the matching circuit based on the phase difference.
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公开(公告)号：US10044413B2
公开(公告)日：2018-08-07
申请号：US15269126
申请日：2016-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongpil Cho , Junesoo Kim , Youngjoo Lee
Abstract: A radio-frequency (RF) communication device having a near field communication (NFC) function includes a first detection mode circuit configured to output an RF input signal received by an antenna as a first RF signal while the first detection mode circuit is enabled, and a second detection mode circuit configured to amplify the RF input signal and output the amplified RF input signal as a second RF signal while the second detection mode circuit is enabled. The first detection mode circuit is enabled during a first time period, and the second detection mode circuit is enabled during a second time period. The second time period is shorter than the first time period. The first and second detection mode circuits are enabled alternately and repeatedly.
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4.发明授权公开(公告)号：US09553069B2
公开(公告)日：2017-01-24
申请号：US14852825
申请日：2015-09-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ilyoung Han , Kyoungran Kim , Donggil Shim , Geunsik Oh , Youngjoo Lee , Junho Lee , Sukwon Lee
CPC classification number: H01L24/75 , B23K3/087 , B23K37/04 , H01L2224/75252 , H01L2224/75704 , H01L2224/75705 , H01L2224/7598
Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.
Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。
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Patent Agency Ranking
公开(公告)号：US09305193B2
公开(公告)日：2016-04-05
申请号：US14183900
申请日：2014-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngjoo Lee , Iljong Song , Cholsu Yoon
IPC: G06K7/10
CPC classification number: G06K7/10237 , G06K7/10158 , G06K7/10217
Abstract: A contactless communication device is provided which includes a field strength detecting circuit configured to detect a strength of a field induced on an antenna; a card circuit configured to demodulate a signal received via the antenna during a reception interval of a card mode; a processing unit configured to process the demodulated signal; and a reader circuit configured to transmit data via the antenna during a transmission interval of the card mode, the data provided from the processing unit, wherein an output power of the reader circuit is adjusted according to the field strength detected.
Abstract translation: 提供一种非接触式通信装置，其包括：场强检测电路，被配置为检测在天线上感应的场强; 卡电路，被配置为在卡模式的接收间隔期间解调经由所述天线接收的信号; 处理单元，被配置为处理所述解调信号; 以及读取器电路，被配置为在所述卡模式的传输间隔期间从所述处理单元提供的数据经由所述天线发送数据，其中，根据检测到的场强调整所述读取器电路的输出功率。
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公开(公告)号：US11823927B2
公开(公告)日：2023-11-21
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
CPC classification number: H01L21/67288 , G01N21/41 , G01N21/65 , G01N21/9505 , G02B7/021 , G06T5/20 , G06T7/0004 , G01N2021/653 , G01N2201/06113 , G06T2207/30148
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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公开(公告)号：US11605567B2
公开(公告)日：2023-03-14
申请号：US17212914
申请日：2021-03-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jitae Park , Youngjoo Lee , Taekyun Kang , Doo Young Gwak , Aekyung Kim , Hyowon Bae , Kyunggon You , Seongjin In , Sang Yoon Han
Abstract: Disclosed are a method of monitoring a semiconductor device fabrication process and a method of fabricating a semiconductor device using the same. The monitoring method may include determining a normalization range of a target byproduct, which is a measurement target of byproducts produced in a chamber by an etching process, the byproducts including the target byproduct and a non-target byproduct, the target byproduct including first and second target byproducts, which are respectively produced by and before the etching process on a to-be-processed layer, obtaining a first index from a ratio of the target byproduct to the non-target byproduct, obtaining a second index by subtracting an emission intensity of the second target byproduct from the first index, obtaining a third index by integrating the second index on a time interval, and estimating a result of the etching process and presence or absence of a failure, based on the third index.
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公开(公告)号：US20140317530A1
公开(公告)日：2014-10-23
申请号：US14257877
申请日：2014-04-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Deogmoh Chang , Daehwan Kim , Youngjoo Lee , Jaeyun Jung , Minsuk Choi , Youngki Hong
IPC: H04L29/08
CPC classification number: H04M1/7253 , H04M1/72519 , H04W4/80
Abstract: A method includes connecting the first electronic device to a second electronic device, determining whether a transfer event occures on a first transfer area of a screen of the first device, transferring the input control authority of the first electronic device to the second electronic device in response to occurrence of the transfer event, and recovering the input control authority of the first electronic device from the second electronic device in response to occurrence of the transfer event on the second device. An electronic device includes a controller configured to transfer the input control authority of the electronic device to the external device in response to occurrence of the transfer event, and recover the input control authority of the electronic device from the external device in response to occurrence of the transfer event on a second transfer area of a second screen of the external device.
Abstract translation: 一种方法包括将第一电子设备连接到第二电子设备，确定传输事件是否发生在第一设备的屏幕的第一传送区域上，作为响应将第一电子设备的输入控制权限传送到第二电子设备 发生转移事件，以及响应于第二设备上的传送事件的发生，从第二电子设备恢复第一电子设备的输入控制权限。 电子设备包括：控制器，被配置为响应于转移事件的发生将电子设备的输入控制权限传送到外部设备;以及响应于所发生的事件，从外部设备恢复电子设备的输入控制权限 在外部设备的第二屏幕的第二传送区域上传送事件。
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9.发明授权公开(公告)号：US11488875B2
公开(公告)日：2022-11-01
申请号：US16847727
申请日：2020-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junbum Park , Younghwan Kim , Jongsu Kim , Youngjoo Lee , Yoojin Jeong
Abstract: A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.
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