公开(公告)号：US11856320B2

公开(公告)日：2023-12-26

申请号：US18158501

申请日：2023-01-24

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Won Seok Lee ,  Seong Wook Song ,  Yun Seok Choi

IPC分类号： H04N5/917 ,  H04N19/14 ,  H04N23/80

CPC分类号： H04N5/917 ,  H04N19/14 ,  H04N23/80

摘要： The present disclosure provides an image encoder. The image encoder is configured to encode an original image and reduce compression loss. The image encoder comprises an image signal processor and a compressor. The image signal processor is configured to receive a first frame image and a second frame image and generates a compressed image of the second frame image using a boundary pixel image of the first frame image. The image signal processor may include memory configured to store first reference pixel data which is the first frame image. The compressor is configured to receive the first reference pixel data from the memory and generate a bitstream obtained by encoding the second frame image based on a difference value between the first reference pixel data and the second frame image. The image signal processor generates a compressed image of the second frame image using the bitstream generated by the compressor.

公开(公告)号：US11563914B2

公开(公告)日：2023-01-24

申请号：US17129131

申请日：2020-12-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Won Seok Lee ,  Seong Wook Song ,  Yun Seok Choi

IPC分类号： H04N5/917 ,  H04N5/232 ,  H04N19/14 ,  H04N5/77 ,  H04N19/55 ,  H04N9/804 ,  H04N19/433 ,  H04N19/154 ,  H04N19/186 ,  H04N19/503 ,  H04N1/417 ,  H04N5/225

摘要： The present disclosure provides an image encoder. The image encoder is configured to encode an original image and reduce compression loss. The image encoder comprises an image signal processor and a compressor. The image signal processor is configured to receive a first frame image and a second frame image and generates a compressed image of the second frame image using a boundary pixel image of the first frame image. The image signal processor may include memory configured to store first reference pixel data which is the first frame image. The compressor is configured to receive the first reference pixel data from the memory and generate a bitstream obtained by encoding the second frame image based on a difference value between the first reference pixel data and the second frame image. The image signal processor generates a compressed image of the second frame image using the bitstream generated by the compressor.

公开(公告)号：US09136139B2

公开(公告)日：2015-09-15

申请号：US14607265

申请日：2015-01-28

申请人： SAMSUNG ELECTRONICS CO., LTD. ,  Kyungpook National University Industry-Academic Cooperation Foundation

发明人： Young Il Kim ,  Bae Hyung Kim ,  Jong Keun Song ,  Seung Heun Lee ,  Kyung Il Cho ,  Yong Rae Roh ,  Won Seok Lee

IPC分类号： H01L21/3065 ,  H01L21/308 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

摘要翻译： 夹具包括晶片，其包括配置为在进行倒装芯片接合时容纳电容微机械超声换能器（cMUT）的容纳凹槽和形成在容纳槽的底表面中的分离槽，分离槽具有底表面， 当cMUT位于容纳槽的底部表面的部分上时，与位于分离槽的底表面的cMUT的薄膜间隔开。

公开(公告)号：US08975096B2

公开(公告)日：2015-03-10

申请号：US13926278

申请日：2013-06-25

申请人： Samsung Electronics Co., Ltd. ,  Kyungpook National University Industry-Academic Cooperation Foundation

发明人： Young Il Kim ,  Bae Hyung Kim ,  Jong Keun Song ,  Seung Heun Lee ,  Kyung Il Cho ,  Yong Rae Roh ,  Won Seok Lee

IPC分类号： G01R31/26 ,  H01L21/66 ,  A61B8/00 ,  B06B1/02 ,  H01L23/00

CPC分类号： H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

公开(公告)号：US10904436B2

公开(公告)日：2021-01-26

申请号：US16124348

申请日：2018-09-07

申请人： Samsung Electronics Co., Ltd.

发明人： Jae Sung Heo ,  Kyung Ho Kim ,  Won Seok Lee

IPC分类号： H04N5/232 ,  H04N5/367

摘要： An electronic device includes an image sensor including an image generator configured to generate and output a pixel image, an image processing device configured to process the pixel image, and a storage unit configured to store the pixel image, and an application processor configured to generate a mode setting signal and configured to transmit the generated mode setting signal to the image processing device. The image processing device is configured to generate a plurality of path selection signals for selecting a path to use by the image processing device to process the pixel image, based on the mode setting signal. The image processing device selects a compression ratio for the pixel image based on at least one of an input signal of a user, an analysis result of the pixel image, and a motion signal of the image sensor, and compresses the pixel image based on the selected compression ratio.