公开(公告)号：US20230275193A1

公开(公告)日：2023-08-31

申请号：US18088226

申请日：2022-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin HONG ,  Gunwoo KIM ,  Seonghwan SHIN ,  Tackmo LEE

IPC: H01L33/48 ,  H01L25/16

CPC classification number: H01L33/483 ,  H01L25/167 ,  H01L24/32

Abstract: A display module includes: a substrate; a side wiring extending along a side surface of the substrate, the side wiring electrically connecting a TFT layer of the substrate at a first end of the side wiring with a rear wiring layer of the substrate at a second end of the side wiring; a front cover disposed on and bonded with a mounting surface of the substrate; a metal plate disposed on and bonded with the rear surface; a side cover covering the side wiring and the side surface; a waterproof member configured to seal the second end of the side wiring from outside and prevent moisture permeation; and a side end member disposed on and covering the side cover and the waterproof member, and the side end member being grounded to the metal plate.

公开(公告)号：US20230282602A1

公开(公告)日：2023-09-07

申请号：US18095281

申请日：2023-01-10

Applicant: SAMSUNG ELECTRONICS Co., LTD.

Inventor： Soonmin HONG ,  Tackmo LEE ,  Gunwoo Kim ,  Seonghwan Shin

IPC: H01L23/60 ,  H01L25/16 ,  H01L23/31 ,  H05K5/00 ,  H05K5/04

CPC classification number: H01L23/60 ,  H01L23/3192 ,  H01L25/167 ,  H05K5/04 ,  H05K5/0021 ,  H01L24/29 ,  H01L2224/32245

Abstract: A display module includes: a substrate having a mounting surface, four side surfaces, and a rear surface opposite to the mounting surface, the substrate including a thin film transistor layer (TFT) provided on the mounting surface; a plurality of inorganic light-emitting diodes provided on the mounting surface of the substrate; a side wiring electrically connected to the TFT layer and extending along a first pair of side surfaces among the four side surfaces of the substrate; a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction; a metal plate provided on the rear surface of the substrate; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side of the side cover and grounded to the metal plate, wherein the side member is provided on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces.

公开(公告)号：US20230253388A1

公开(公告)日：2023-08-10

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Gyun HEO ,  Tackmo LEE ,  Kyungwoon JANG ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L25/167 ,  H01L33/62 ,  G09G3/32 ,  G09G2300/026 ,  G09G2300/0842 ,  G09G2300/0426 ,  G09G2300/0452

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US20240203910A1

公开(公告)日：2024-06-20

申请号：US18590302

申请日：2024-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tackmo LEE ,  Changkyu CHUNG ,  Gunwoo KIM ,  Soonmin HONG

IPC: H01L23/60 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/60 ,  H01L23/3192 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L24/33 ,  H01L2224/29028 ,  H01L2224/32145 ,  H01L2224/32175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/12041 ,  H01L2924/1426

Abstract: A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal cover covering the rear surface and a first area of the side surface, the first area extending from the rear surface; and a side member positioned below the outer area from the mounting surface and adhered to a second area of the side surface, the second area extending from the mounting surface, and at least a portion of the metal cover. The metal cover includes a rear portion covering the rear surface, a side portion covering the first area of the side surface, and a bent portion bent between the rear portion and the side portion.

公开(公告)号：US20230027649A1

公开(公告)日：2023-01-26

申请号：US17745458

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin HONG ,  Seonghwan SHIN ,  Tackmo LEE ,  Hyeongik KIM

IPC: H01L27/15 ,  H01L33/62 ,  H01L25/075

Abstract: A display module includes a substrate including a mounting surface and a side surface; a Thin Film Transistor (TFT) layer provided on the mounting surface of the substrate; a plurality of inorganic light emitting diodes mounted on the mounting surface of the substrate; an anisotropic conductive layer provided on an upper surface of the TFT layer and electrically connecting the TFT layer to the plurality of inorganic light emitting diodes; a front cover covering the mounting surface; and a side cover surrounding the side surface. A side end of the front cover extends to a region outside the mounting surface, the side cover is bonded to a lower surface of the front cover and to the side surface of the substrate which correspond to the region outside of the mounting surface, and a side end of the anisotropic conductive layer is provided on an inner side with respect to the side end of the front cover.

公开(公告)号：US20210375833A1

公开(公告)日：2021-12-02

申请号：US16629768

申请日：2018-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngchul LEE ,  Taesang PARK ,  Kyoree LEE ,  Tackmo LEE ,  Gyun HEO ,  Youngjun MOON ,  Won CHOI

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  H01L25/16

Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.

公开(公告)号：US20200259056A1

公开(公告)日：2020-08-13

申请号：US16786514

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin HONG ,  Gyuhwa KIM ,  Jeonggen YOON ,  Tackmo LEE ,  Gyun HEO ,  Youngjun MOON ,  Kyungwoon JANG

IPC: H01L33/62 ,  H01L25/16 ,  H01L27/12

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.

公开(公告)号：US20250031497A1

公开(公告)日：2025-01-23

申请号：US18906800

申请日：2024-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonghwan SHIN ,  Gunwoo KIM ,  Tackmo LEE ,  Soonmin HONG

IPC: H01L33/56 ,  H01L25/075 ,  H01L25/16 ,  H01L27/15

Abstract: A display module includes: a substrate including a mounting surface having a thin-film transistor (TFT) layer is formed thereon, a side surface, and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface; an anisotropic conductive layer on the TFT layer and configured to electrically connect the TFT layer with the plurality of inorganic light-emitting elements; a front cover for covering the mounting surface; a side cover for surrounding the side surface; and a metal plate adhered to the rear surface. A side end of the front cover extends to a region outside the mounting surface. The side cover is made of a moisture-proof material for preventing moisture from permeating, and extends to at least a part of a side surface of the metal plate from a lower portion of the front cover corresponding to the region outside the mounting surface.

公开(公告)号：US20240313189A1

公开(公告)日：2024-09-19

申请号：US18674482

申请日：2024-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gunwoo KIM ,  Seongho SON ,  Jongsung LEE ,  Changjoon LEE ,  Seonghwan SHIN ,  Tackmo LEE ,  Soonmin HONG

IPC: H01L33/64 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/644 ,  H01L25/167 ,  H01L27/124

Abstract: A display apparatus includes: a display module array including a plurality of display modules arranged in a matrix, wherein each display module of the plurality of display modules includes: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface of the substrate; a metal plate adhered to the rear surface of the substrate and configured to dissipate heat generated by the substrate; a front cover covering the mounting surface; a first conductive layer on the mounting surface; and a second conductive layer between the front cover and the first conductive layer.

公开(公告)号：US20230223388A1

公开(公告)日：2023-07-13

申请号：US18121939

申请日：2023-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Tackmo LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L25/0753

Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.