公开(公告)号：US11518909B2

公开(公告)日：2022-12-06

申请号：US16645343

申请日：2018-02-13

申请人： Samsung SDI Co., Ltd.

发明人： Kunbae Noh ,  Taeksoo Kwak ,  Junyoung Jang ,  Yoonyoung Koo ,  Yonggoog Kim ,  Jingyo Kim ,  Jin-Hee Bae ,  Jun Sakong ,  Jinwoo Seo ,  Sooyeon Sim ,  Huichan Yun ,  Jiho Lee ,  Kwen-Woo Han ,  Byeong Gyu Hwang

IPC分类号： C09D183/16 ,  H01L21/02 ,  H01L21/306

摘要： Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.

公开(公告)号：US10017646B2

公开(公告)日：2018-07-10

申请号：US15656341

申请日：2017-07-21

申请人： SAMSUNG SDI CO., LTD.

发明人： Sooyeon Sim ,  Jin-Hee Bae ,  TaekSoo Kwak ,  Yonggoog Kim ,  Jingyo Kim ,  Kunbae Noh ,  Huichan Yun ,  Jiho Lee ,  Byeong Gyu Hwang

IPC分类号： C01B33/12 ,  C09D1/00 ,  C09D7/00 ,  C09D7/12 ,  H01L21/02

CPC分类号： C09D1/00 ,  C01B33/12 ,  C09D7/20 ,  C09D7/63 ,  H01L21/02164 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02318

摘要： A composition for forming silica layer includes a silicon-containing polymer and a solvent, wherein a weight average molecular weight of the silicon-containing polymer ranges from about 2,000 to about 100,000 and a branching ratio (a) of the silicon-containing polymer calculated by Equation 1 ranges from about 0.25 to about 0.50. η=k·Ma  [Equation 1] In Equation 1, η is an intrinsic viscosity of a silicon-containing polymer, M is an absolute molecular weight of a silicon-containing polymer, a is a branching ratio, and k is an intrinsic constant.

公开(公告)号：US20170250206A1

公开(公告)日：2017-08-31

申请号：US15263192

申请日：2016-09-12

申请人： Samsung SDI Co., Ltd.

发明人： Kwen-Woo Han ,  Taeksoo Kwak ,  Kunbae Noh ,  Jinwoo Seo ,  Sooyeon Sim ,  Huichan Yun ,  Jiho Lee ,  Junyoung Jang ,  Byeong Gyu Hwang

IPC分类号： H01L27/12 ,  B05D1/00 ,  B05D3/02 ,  H01L21/02

CPC分类号： H01L27/1262 ,  B05D1/005 ,  B05D3/0254 ,  C09D183/16 ,  C23C18/122 ,  C23C18/1283 ,  G02F1/133345 ,  G02F1/133365 ,  G02F1/136277 ,  G02F2202/022 ,  G02F2202/025 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02337 ,  H01L27/1248

摘要： A composition for forming a silica layer, a method for manufacturing a silica layer, a silica layer manufactured by the method, and an electronic device including the silica layer. The composition for forming a silica layer includes a silicon-containing polymer and a solvent compound represented by Chemical Formula 1: