公开(公告)号：US20170278859A1

公开(公告)日：2017-09-28

申请号：US15250185

申请日：2016-08-29

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Rahul SHARANGPANI ,  Raghuveer S. MAKALA ,  Senaka KANAKAMEDALA ,  Fei ZHOU ,  Somesh PERI ,  Masanori TSUTSUMI ,  Keerti SHUKLA ,  Yusuke IKAWA ,  Kiyohiko SAKAKIBARA ,  Eisuke TAKII

IPC: H01L27/115 ,  H01L21/02 ,  H01L29/51

CPC classification number: H01L27/11582 ,  H01L21/0214 ,  H01L21/0217 ,  H01L21/02247 ,  H01L21/02326 ,  H01L21/31111 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157 ,  H01L27/11573 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66833 ,  H01L29/7889 ,  H01L29/7926

Abstract: A memory opening can be formed through an alternating stack of insulating layers and sacrificial material layers provided over a substrate. Annular etch stop material portions are provided at each level of the sacrificial material layers around the memory opening. The annular etch stop material portions can be formed by conversion of surface portions of the sacrificial material layers into dielectric material portion, or by recessing the sacrificial material layers around the memory opening and filling indentations around the memory opening. After formation of a memory stack structure, the sacrificial material layers are removed from the backside. The annular etch stop material portions are at least partially converted to form charge trapping material portions. Vertical isolation of the charge trapping material portions among one another around the memory stack structure minimizes leakage between the charge trapping material portions located at different word line levels.