Abstract:
A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.
Abstract:
A solid state imaging device includes: solid state imaging elements having a first electrode, a ferroelectric layer, and a transparent second electrode laminated together, and a PN junction between the ferroelectric layer and the first or second electrode; a controller acquiring brightness information of an imaging target, and determining whether each solid state imaging element is set to operate in a high or low sensitivity mode based on the brightness information; and a circuit applying a voltage to the solid state imaging element based on the determination, and setting the solid state imaging element to operate in the high or low sensitivity mode, in which a photovoltaic current from the solid state imaging element which is set to operate in the high or low sensitivity mode is detected, and an image is acquired based on the detection result.
Abstract:
An electronic apparatus includes: a base; a functional element; and a first member and a second member which connect the base and the functional element to each other. The first member and the second member have different elastic moduli from each other. The elastic modulus of the first member is higher than the elastic modulus of the second member. At least a part of the first member is situated more closely to a center of the functional element than the second member, as viewed in a plan view taken from a direction in which the base and the functional element are arrayed.
Abstract:
A connection terminal, in which the width of the side opposite to a first adhesion layer is greater than the width of the first adhesion layer in a cross-sectional shape, is formed on the first adhesion layer which is formed on a flow path forming substrate and etched by an etchant, the connection terminal is covered with a second adhesion layer formed from the same material as that of the first adhesion layer, and an inclined wiring is formed on the connection terminal through the wet etching method with the etchant.
Abstract:
A photoelectric conversion element includes a first electrode, a ferroelectric layer provided on the first electrode, and a second electrode provided on the ferroelectric layer, the second electrode being a transparent electrode, and a pn junction being formed between the ferroelectric layer and the first electrode or the second electrode.
Abstract:
A resonance device includes a first substrate formed of a semiconductor material or a glass material and having a recess which has an opening in a first main surface, a second substrate bonded to the first main surface and configured to close the opening of the recess, and a resonator element housed in the recess. An inner surface of the recess includes a side surface, a bottom surface, and a connection surface connecting the side surface and the bottom surface, the connection surface is a curved surface, and L1