公开(公告)号：US09219026B2

公开(公告)日：2015-12-22

申请号：US14485918

申请日：2014-09-15

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji Tsukagoshi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/29139 ,  H01L2924/00014 ,  H01L2224/8384

Abstract: A semiconductor device has an island portion on which a semiconductor chip is adhered through intermediation of an insulating paste. Recessed portions having an inverted pyramid shape are formed in a semiconductor chip placing region of the island portion. A first opening angle formed by a normal extending upward from a vertex of each of the plurality of recessed portions each having an inverted pyramid shape and an opening line extending to an outer side of the semiconductor chip placing region is smaller than a second opening angle formed by the normal and an opening line extending to an inner side of the semiconductor chip placing region.

Abstract translation: 半导体器件具有岛状部分，半导体芯片通过绝缘膏粘合在其上。 在岛部的半导体芯片配置区域中形成具有倒金字塔形状的凹部。 由从多个凹部中的每个具有倒金字塔形状的顶点向上延伸的法线形成的第一开放角度和延伸到半导体芯片放置区域的外侧的开口线小于形成的第二开启角度 通过延伸到半导体芯片放置区域的内侧的法线和开口线。

公开(公告)号：US08933386B2

公开(公告)日：2015-01-13

申请号：US13669858

申请日：2012-11-06

Applicant: Seiko Instruments Inc.

Inventor： Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Koji Tsukagoshi ,  Keiichiro Hayashi

IPC: G01J1/42 ,  H01L31/0203

CPC classification number: G01J1/42 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/1039 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate (2), a glass substrate (9) with a cavity having divided and exposed through-hole electrodes (5) on the periphery thereof, and an optical sensor element (3) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Abstract translation: 提供了高可靠性，紧凑型和低成本的光学传感器装置。 光学传感器装置包括玻璃盖基板（2），具有在其周边上具有分开和暴露的通孔电极（5）的空腔的玻璃基板（9）和安装在玻璃上的光学传感器元件（3） 盖基板，并且具有玻璃盖基板和具有空腔的玻璃基板结合在一起的结构。 通过与玻璃基板气密密封，确保高可靠性。 通过使用分割的通孔电极，封装尺寸减小，并且在制造中可以批量生产的装置的数量增加，这降低了成本。

公开(公告)号：US09240498B2

公开(公告)日：2016-01-19

申请号：US14485901

申请日：2014-09-15

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Hiroyuki Fujita ,  Sadao Oku ,  Koji Tsukagoshi ,  Keiichiro Hayashi

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Phosphate-based glass doped with copper ions having infrared blocking filter characteristics is formed into particles and is mixed with a transparent encapsulating resin to encapsulate a semiconductor element. The glass particles have a particle diameter four times or more as large as a wavelength of infrared radiation to be blocked. An optical semiconductor device can be obtained having a stable filter characteristics thereof even if an incident light angle changes and is resistant to moisture.

Abstract translation: 掺有具有红外阻挡滤光器特性的铜离子的磷酸盐基玻璃形成颗粒，并与透明封装树脂混合以封装半导体元件。 玻璃粒子的粒径为被阻挡的红外线的波长的四倍以上。 即使入射光角度变化并且耐潮湿，也可以获得具有稳定的滤光器特性的光学半导体器件。

公开(公告)号：US09029968B2

公开(公告)日：2015-05-12

申请号：US13676404

申请日：2012-11-14

Applicant: Seiko Instruments Inc.

Inventor： Koji Tsukagoshi ,  Hitoshi Kamamori ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi

IPC: H01L31/0232 ,  G01J1/44 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/44 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/42

Abstract: An optical sensor element is mounted in a package which includes a glass substrate having a cavity, and a glass lid substrate bonded to the other substrate to close the cavity. The glass substrate with the cavity has metalized wiring patterns on front and rear surfaces thereof, and a through hole filled with metal to form a through-electrode interconnecting the wiring patterns on the front and rear surfaces. A metalized wiring pattern on the rear surface of the glass lid substrate is electrically connected to the wiring pattern on the front surface of the other substrate with an adhesive containing conductive particles. The glass lid substrate is made either of glass having a filter function or glass having a light shielding property with an opening therethrough filled with glass having a filter function.

Abstract translation: 光学传感器元件安装在包括具有空腔的玻璃基板的封装中，并且将玻璃盖基板粘合到另一基板上以封闭空腔。 具有空腔的玻璃基板在其前表面和后表面上具有金属化布线图案，以及填充有金属的通孔，以形成将前后表面上的布线图案互连的贯通电极。 玻璃盖基板的后表面上的金属化布线图案与含有导电性粒子的粘合剂电连接到另一基板的前表面上的布线图案。 玻璃盖基板由具有过滤功能的玻璃或具有遮光性的玻璃制成，其中具有过滤功能的玻璃填充有开口。

公开(公告)号：US09997645B2

公开(公告)日：2018-06-12

申请号：US15059674

申请日：2016-03-03

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji Tsukagoshi

IPC: H01L31/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/0232 ,  H01L23/31 ,  H01L23/498 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  H01L23/3157 ,  H01L23/49838 ,  H01L31/02002 ,  H01L31/02162 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of each of a plurality of leads are molded with a resin so as to be integrated, the part of each of the plurality of leads being embedded in and completely surrounded by the first resin molded portion. The second resin molded portion is molded over at least a portion of the first resin molded portion to form an outer shape of the package and has embedded therein and completely surrounds a part of each of the plurality of leads. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

公开(公告)号：US09362195B2

公开(公告)日：2016-06-07

申请号：US14319414

申请日：2014-06-30

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Koji Tsukagoshi ,  Sadao Oku ,  Hiroyuki Fujita ,  Keiichiro Hayashi ,  Masaru Akino

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/24

CPC classification number: H01L23/3114 ,  H01L23/24 ,  H01L23/49551 ,  H01L23/49861 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00012

Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.

Abstract translation: 提供一种包括具有中空部分的封装的半导体器件，其可以满足尺寸和厚度的减小的需要。 半导体装置包括：具有中空部（10）的树脂成形体（1），具有安装有半导体芯片（6）的内底面，围绕中空部（10）的环绕部（1b） 和底面部分（1a）; 内引线（2e，2f）; 和从树脂成形体（1）露出的外引线（2a，2b）。 埋在模制构件（1）中的内部引线包括具有穿过其形成的通孔的L形引线延伸部分。