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公开(公告)号：US20230008351A1
公开(公告)日：2023-01-12
申请号：US17859900
申请日：2022-07-07
Applicant: SEMES CO., LTD.
Inventor： Sang Eun NOH , Dae Sung KIM , Ho Jin JANG
IPC: G03F7/16
Abstract: Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes: a first process chamber having a first treating space therein; a second process chamber having a second treating space therein; and an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space, in which the exhaust unit includes an integrated exhaust line in which a pressure reduction unit is installed, a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the first process chamber and a second point of the integrated exhaust line, and an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber.
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公开(公告)号：US20220102169A1
公开(公告)日：2022-03-31
申请号：US17486060
申请日：2021-09-27
Applicant: SEMES CO., LTD.
Inventor： Dae Sung KIM , Sang Eun NOH , Ho Jin JANG , Jae Hoon PARK
IPC: H01L21/67 , H01L21/687 , H01L21/673 , H01L21/02
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprising: a treating vessel including an outer cup and an inner cup placed in an inner side of the outer cup, the inner cup and the outer cup in combination defining a recollecting route for a recollecting a liquid; a rotatable spin head placed within the treating vessel on which a cleaning jig is placed; wherein the treating vessel comprises a first protrusion protruding from an inner side surface of the outer cup to direct a cleaning liquid scattering from the cleaning jig toward a surface of the inner cup.
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公开(公告)号：US20240017284A1
公开(公告)日：2024-01-18
申请号：US18138038
申请日：2023-04-22
Applicant: SEMES CO., LTD.
Inventor： Dae Sung KIM , Jae Hyun LIM , Kyo Sang YOON , Ho Jin JANG , A Rah CHO
IPC: B05C9/08
CPC classification number: B05C9/08
Abstract: An apparatus for processing a substrate includes a processing vessel disposed in a process chamber and including a processing space in which a substrate is accommodated; a liquid supply line configured to process the substrate by supplying processing liquid to the substrate in the processing space; an exhaust line connected to the processing vessel and configured to exhaust gas in the processing space; a spraying portion disposed on the exhaust line and configured to spray cleaning liquid to remove contaminants accumulated in the exhaust line; and a washing liquid discharge line branched from the exhaust line and including a suction portion therein to suction cleaning liquid waste including contaminants removed from the exhaust line by the cleaning liquid and to discharge the cleaning liquid waste to the outside.
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公开(公告)号：US20240219828A1
公开(公告)日：2024-07-04
申请号：US18340535
申请日：2023-06-23
Applicant: SEMES CO., LTD.
Inventor： Ho Jin JANG
IPC: G03F7/00
CPC classification number: G03F7/0025 , G03F7/70866
Abstract: The inventive concept provides a substrate treating method on which there is no generation of a portion on which a development is not performed, among a front surface of a substrate during a puddle process. The substrate treating method includes positioning a substrate in a treating space; forming a liquid film of a treating liquid on the substrate by supplying the treating liquid to a rotating substrate; and puddling including stopping the supplying of the treating liquid and reacting a thin film on the substrate with the liquid film on the substrate, and wherein an exhaust pressure provided at the treating space during the puddling is lower than an exhaust pressure provided at the treating space during the forming of the liquid film.
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Patent Agency Ranking
公开(公告)号：US20240178011A1
公开(公告)日：2024-05-30
申请号：US18507070
申请日：2023-11-12
Applicant: SEMES CO., LTD.
Inventor： Ho Jin JANG
IPC: H01L21/67 , H01L21/02 , H01L21/687
CPC classification number: H01L21/67051 , H01L21/02052 , H01L21/6715 , H01L21/67184 , H01L21/68764
Abstract: Disclosure provides a substrate processing apparatus, an operating method thereof, and photo spinner equipment, the substrate processing apparatus being capable of preventing fumes of processing liquid from blocking a duct. The substrate processing apparatus supplying processing liquid to a substrate to perform processing includes a substrate support unit configured to support the substrate, a liquid supply unit configured to supply liquid to the substrate, and a liquid recovery unit configured to recover the liquid from the substrate. The liquid recovery unit includes a recovery cup formed to surround the substrate support unit and an air injection unit configured to inject air to an internal space of the recovery cup.
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公开(公告)号：US20220390859A1
公开(公告)日：2022-12-08
申请号：US17831935
申请日：2022-06-03
Applicant: SEMES CO., LTD.
Inventor： Ho Jin JANG
Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a first process chamber having a first treatment space therein; a second process chamber having a second treatment space therein; and an exhaust unit exhausting atmospheres of the first treatment space and the second treatment space, in which the exhaust unit includes: an integrated exhaust line; a first exhaust line connecting the first process chamber and the integrated exhaust line; a second exhaust line connecting the second process chamber and the integrated exhaust line; and a partition wall partitioning a partial section of a flow path within the integrated exhaust line into a first flow path through which a fluid exhausted through the first exhaust line flows and a second flow path through which a fluid discharged through the second exhaust line flows.
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公开(公告)号：US20240416383A1
公开(公告)日：2024-12-19
申请号：US18739684
申请日：2024-06-11
Applicant: SEMES CO., LTD.
Inventor： Ho Jin JANG , Jae Hoon PARK
Abstract: Disclosed is an apparatus for treating a substrate, the apparatus including: an outer cup having a treatment space with an open top; a support unit for supporting a substrate in the treatment space; a guide cup disposed in the treatment space and arranged to surround the support unit; a liquid supply unit for supplying a treatment liquid to a top surface of the substrate supported by the support unit; and a trap ring disposed in a gap between the guide cup and the outer cup to capture the treatment liquid flowing through the gap, in which the trap ring is formed with an exhaust hole through which gas flowing through the gap passes, and the trap ring has a capture space for capturing the treatment liquid on a top surface thereof.
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公开(公告)号：US20240192611A1
公开(公告)日：2024-06-13
申请号：US18332998
申请日：2023-06-12
Applicant: SEMES CO., LTD.
Inventor： Ho Jin JANG
IPC: G03F7/00
CPC classification number: G03F7/70866 , G03F7/70908
Abstract: The inventive concept provides a substrate treating method at a treating space. The substrate treating method includes coating a substrate with a first liquid by supplying the first liquid to the substrate; and cleaning a substrate by supplying a second liquid to remove a portion of the first liquid remaining on a specific region of the substrate, the second liquid being different from the first liquid, and wherein an atmosphere of the treating space is exhausted while the coating of the substrate and the cleaning of the substrate is performed, and an exhausting pressure of the treating space during the coating of the substrate is different from an exhausting pressure of the treating space during the cleaning of the substrate.
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公开(公告)号：US20220075270A1
公开(公告)日：2022-03-10
申请号：US17469366
申请日：2021-09-08
Applicant: Semes Co., Ltd
Inventor： Jun Ho KIM , Sang Hoon LEE , Jong Seok SEO , Ho Jin JANG , Gyeong Won SONG
Abstract: The inventive concept provides a bake unit. The bake unit comprising: a housing having an upper cover and a lower frame, the upper cover and the lower cover in combination providing a treatment space for heat treatment of a substrate; a heater provided in the treatment space for heating a substrate placed thereon; a heater cup configured to surround the heater; and a first purge gas supply unit for providing a first purge gas flow to block inflow of outer air through a gap between the lower frame and the heater cup.
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