公开(公告)号：US20130228885A1

公开(公告)日：2013-09-05

申请号：US13865365

申请日：2013-04-18

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yoshitaka DOZEN ,  Tomoyuki AOKI ,  Hidekazu TAKAHASHI ,  Daiki YAMADA ,  Eiji SUGIYAMA ,  Kaori OGITA ,  Naoto KUSUMOTO

IPC: H01L23/29

CPC classification number: H01L23/293 ,  H01L23/49855 ,  H01L23/66 ,  H01L27/1248 ,  H01L27/1266 ,  H01L27/13 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer.

Abstract translation: 本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。 半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。 在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值 在导电层上形成的绝缘层与导电层的厚度比为至少0.2。 此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。

公开(公告)号：US20130313329A1

公开(公告)日：2013-11-28

申请号：US13958816

申请日：2013-08-05

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoyuki AOKI ,  Susumu SEKIGUCHI ,  Shingo EGUCHI

IPC: G06K19/077 ,  H01Q7/00

CPC classification number: G06K19/07794 ,  G06K19/077 ,  G06K19/07773 ,  H01F5/003 ,  H01F41/041 ,  H01Q1/2225 ,  H01Q7/00 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: In an antenna and a semiconductor device including the antenna, an object is to reduce the distance between electrodes of a capacitor as much as possible, reduce the area of the electrode of the capacitor as much as possible, and prevent the suppression of response sensitivity and a response range of the semiconductor device. The present invention relates to an antenna including an antenna coil provided over a first region of a base and a capacitor which uses a second region of the base as a dielectric body and which has electrodes provided for opposite planes of the second region of the base, wherein the second region of the base is thinner than the first region of the base, and also relates to a semiconductor device including the antenna.

Abstract translation: 在包括天线的天线和半导体装置中，目的是尽可能地减小电容器的电极之间的距离，尽可能地减小电容器的电极的面积，并且防止响应灵敏度的抑制， 半导体器件的响应范围。 本发明涉及一种天线，包括设置在基座的第一区域上的天线线圈和使用基座的第二区域作为电介质体的电容器，并且具有设置在基座的第二区域的相对平面的电极， 其中所述基座的所述第二区域比所述基底的所述第一区域薄，并且还涉及包括所述天线的半导体器件。

公开(公告)号：US20130270720A1

公开(公告)日：2013-10-17

申请号：US13912309

申请日：2013-06-07

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoyuki AOKI ,  Takuya TSURUME ,  Hiroki ADACHI ,  Nozomi HORIKOSHI ,  Hisashi OHTANI

IPC: H01L23/29

CPC classification number: H01L23/29 ,  G06K19/07749 ,  H01L21/563 ,  H01L23/145 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/60 ,  H01L23/66 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/13 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3025 ,  Y10T428/31522 ,  H01L2924/00

Abstract: A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip.