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    READING COMPREHENSION SUPPORT SYSTEM AND READING COMPREHENSION SUPPORT METHOD
    1.
    发明申请
    READING COMPREHENSION SUPPORT SYSTEM AND READING COMPREHENSION SUPPORT METHOD 有权

    公开(公告)号：US20220245181A1

    公开(公告)日：2022-08-04

    申请号：US17622930

    申请日：2020-06-22

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Yoshitaka DOZEN ,  Kazuki HIGASHI ,  Kunitaka YAMAMOTO

    IPC: G06F16/33 ,  G06F40/40 ,  G06F40/253 ,  G06F40/279

    Abstract: A reading comprehension support system or a reading comprehension support method that enables natural language to be input as query text and presents a reader with a part that is highly related to the input text is provided. The reading comprehension support system includes a document readout unit that reads out a subject document, a document division unit that divides the subject document into a plurality of blocks, a first distributed representation acquisition unit that acquires a distributed representation of a word in each of the plurality of blocks, a query text readout unit that reads out query text, a second distributed representation acquisition unit that extracts a word included in the query text and acquires a distributed representation of the word, and a similarity acquisition unit that compares distributed representations of words between the query text and each of the plurality of blocks and obtains similarity. From words included in the block, the similarity acquisition unit searches for a word that matches a word included in the query text, and obtains similarity between a distributed representation of the matching word in the block and a distributed representation of the matching word in the query text.

    AUTHENTICATION SYSTEM FOR ELECTRONIC DEVICE
    2.
    发明申请
    AUTHENTICATION SYSTEM FOR ELECTRONIC DEVICE 有权

    公开(公告)号：US20220237275A1

    公开(公告)日：2022-07-28

    申请号：US17615257

    申请日：2020-06-09

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Shigeru TAMAKI ,  Kengo AKIMOTO ,  Hiromichi GODO ,  Koki INOUE ,  Yoshitaka DOZEN ,  Shunpei YAMAZAKI

    IPC: G06F21/32 ,  G06F21/60 ,  G06N20/00

    Abstract: An authentication system for an electronic device with a high security level is provided. The authentication system includes a data retention means that accumulates first data related to a state of the electronic device being used by a first user registered in advance and generates a first data group, a first authentication means that authenticates a second user operating the electronic device as the first user and releases a locked state, a data acquisition means that acquires second data related to a state of the electronic device being used by the second user in a state where the locked state is released, and a second authentication means that authenticates the second user as the first user on the basis of the first data group and the second data and sets the electronic device to the locked state when the second user is not authenticated. The data retention means has a function of deleting the oldest first data of the plurality of pieces of the first data included in the first data group.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20130334611A1

    公开(公告)日：2013-12-19

    申请号：US13961197

    申请日：2013-08-07

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Hidekazu TAKAHASHI ,  Daiki YAMADA ,  Kyosuke ITO ,  Eiji SUGIYAMA ,  Yoshitaka DOZEN

    IPC: H01L23/66

    CPC classification number: H01L23/66 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.

    Physical Property Prediction Method and Physical Property Prediction System
    5.
    发明申请
    Physical Property Prediction Method and Physical Property Prediction System 审中-公开

    公开(公告)号：US20200349451A1

    公开(公告)日：2020-11-05

    申请号：US16643094

    申请日：2018-08-24

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Kunihiko Suzuki ,  Satoshi SEO ,  Harue OSAKA ,  Yoshitaka DOZEN

    IPC: G06N3/12 ,  G06N20/00 ,  G16C20/70 ,  G16C20/30

    Abstract: A physical property prediction method that allows anyone to predict a physical property of an organic compound easily and accurately is provided. A physical property prediction system that allows anyone to predict a physical property of an organic compound easily and accurately is provided. Provided are a physical property prediction method including the step of learning a correlation between a molecular structure and a physical property of an organic compound and the step of predicting the target physical property value from the molecular structure of an object substance, and a physical property prediction system. A plurality of kinds of fingerprinting methods are used at the same time as notation methods of the molecular structure of the organic compound.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20150255489A1

    公开(公告)日：2015-09-10

    申请号：US14718701

    申请日：2015-05-21

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Takuya TSURUME ,  Yoshitaka DOZEN

    IPC: H01L27/12

    CPC classification number: H01L27/124 ,  H01L21/304 ,  H01L21/76898 ,  H01L27/1218 ,  H01L27/1266 ,  H01L27/13 ,  H01L29/78 ,  H01L29/78603 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: It is an object of the present invention to provide a semiconductor device where, even in a case of stacking a plurality of semiconductor elements provided over a substrate, the stacked semiconductor elements can be electrically connected through the substrate, and a manufacturing method thereof. According to one feature of the present invention, a method for manufacturing a semiconductor device includes the steps of selectively forming a depression in an upper surface of a substrate or forming an opening which penetrates the upper surface through a back surface; forming an element group having a transistor so as to cover the upper surface of the substrate and the depression, or the opening; and exposing the element group formed in the depression or the opening by thinning the substrate from the back surface. A means for thinning the substrate can be performed by partially removing the substrate by performing grinding treatment, polishing treatment, etching by chemical treatment, or the like from the back surface of the substrate.

    Abstract translation: 本发明的目的是提供一种半导体器件，其中即使在堆叠设置在衬底上的多个半导体元件的情况下，堆叠的半导体元件也可以通过衬底电连接及其制造方法。 根据本发明的一个特征，一种制造半导体器件的方法包括以下步骤：在衬底的上表面中选择性地形成凹陷或形成通过背面穿透上表面的开口; 形成具有晶体管以覆盖基板的上表面和凹陷或开口的元件组; 以及通过使基板从后表面变薄而暴露出形成在凹陷或开口中的元件组。 可以通过从基板的背面进行研磨处理，研磨处理，化学处理等的蚀刻等部分去除基板来进行薄板化的方法。

    DOCUMENT CLASSIFICATION SYSTEM AND DOCUMENT CLASSIFICATION METHOD
    7.
    发明申请
    DOCUMENT CLASSIFICATION SYSTEM AND DOCUMENT CLASSIFICATION METHOD 有权

    公开(公告)号：US20240386737A1

    公开(公告)日：2024-11-21

    申请号：US18682496

    申请日：2022-08-17

    Applicant: Semiconductor Energy Laboratory Co., Ltd.

    Inventor： Yoshitaka DOZEN ,  Kunitaka YAMAMOTO

    IPC: G06V30/413 ,  G06V30/418

    Abstract: A document classification system that enables highly accurate document classification is provided. The document classification system includes an input unit, a storage unit, a processing unit, and an output unit. The input unit has a function of receiving document data and reference document data. The storage unit has a function of storing a classification model. The processing unit has a function of creating first classification data to third classification data from the document data and the reference document data. A word contained in the document data and not contained in the reference document data belongs to the first classification data. A word contained in the document data and contained in the reference document data belongs to the second classification data. A word not contained in the document data and contained in the reference document data belongs to the third classification data. The processing unit has a function of creating document comparison data from the first classification data to the third classification data and determining a category of the reference document data using the classification model. The output unit has a function of outputting the category.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的半导体器件和制造方法

    公开(公告)号：US20130228885A1

    公开(公告)日：2013-09-05

    申请号：US13865365

    申请日：2013-04-18

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： Yoshitaka DOZEN ,  Tomoyuki AOKI ,  Hidekazu TAKAHASHI ,  Daiki YAMADA ,  Eiji SUGIYAMA ,  Kaori OGITA ,  Naoto KUSUMOTO

    IPC: H01L23/29

    CPC classification number: H01L23/293 ,  H01L23/49855 ,  H01L23/66 ,  H01L27/1248 ,  H01L27/1266 ,  H01L27/13 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    Abstract: The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer.

    Abstract translation: 本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。 半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。 在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值 在导电层上形成的绝缘层与导电层的厚度比为至少0.2。 此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。

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