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    Light-emitting diode package
    2.
    发明授权
    Light-emitting diode package 有权

    公开(公告)号：US10355184B2

    公开(公告)日：2019-07-16

    申请号：US15758302

    申请日：2016-09-07

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Jun Yong Park ,  In Kyu Park ,  Yeo Jin Yoon

    IPC: H01L23/31 ,  H01L25/16 ,  H01L33/60 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

    Abstract: A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.

    Ultraviolet ray emitting device having maximized electrode area for improved heat dissipation
    5.
    发明授权
    Ultraviolet ray emitting device having maximized electrode area for improved heat dissipation 有权

    公开(公告)号：US11069846B2

    公开(公告)日：2021-07-20

    申请号：US15572051

    申请日：2016-04-25

    Applicant: SEOUL VIOSYS CO., LTD.

    Inventor： Jun Yong Park ,  Jae Hyun Park ,  Yeo Jin Yoon ,  In Kyu Park

    IPC: H01L33/64 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

    Abstract: A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.

    Light-emitting device and method of manufacturing the same
    6.
    发明授权
    Light-emitting device and method of manufacturing the same 有权

    公开(公告)号：US10158050B2

    公开(公告)日：2018-12-18

    申请号：US15673046

    申请日：2017-08-09

    Applicant: Seoul Viosys Co., Ltd.

    Inventor： Jun Yong Park ,  Hee Cheul Jung ,  In Kyu Park ,  Daewoong Suh

    IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L25/075

    Abstract: A light-emitting diode package includes a frame portion with a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other. A light-emitting diode is mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween. The frame portion includes a depressed portion formed on an upper surface thereof, and the depressed portion includes the chip-mounting region defined on a bottom thereof. The depressed portion also includes a step portion disposed at an outer upper end thereof.

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