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公开(公告)号：US11215329B2
公开(公告)日：2022-01-04
申请号：US17170350
申请日：2021-02-08
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon Park , Jun Yong Park
IPC: F21K9/69 , G02B19/00 , F21Y105/16 , F21Y115/10
Abstract: A light emitting apparatus comprises a substrate, a plurality of light-emitting diodes provided on the substrate and arranged in a matrix, and a dome-type window provided above the light-emitting diodes to control the path of light emitted from the light-emitting diodes. The height of the window is 70% or less of the diameter of the lower portion of the window so that the view angle of the light emitted from the light-emitting diodes is 90 degrees or less.
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公开(公告)号：US09324921B2
公开(公告)日：2016-04-26
申请号：US14350323
申请日：2012-10-08
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jun Yong Park , Daewoong Suh , Bo Ram I Jang , Hee Cheul Jung , Kyu Ho Lee , Chang Hoon Kim
CPC classification number: H01L33/483 , H01L33/22 , H01L33/44 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.
Abstract translation: 本发明涉及一种发光二极管封装。 根据本发明，发光二极管封装包括：用于生长的衬底; 形成在用于生长的基板的一侧的表面上的钝化层; 以及具有主体部分和壁部分的封装基板，其中壁部形成在主体部分上。 至少在主体部分，壁部分和钝化层之间形成的空间与外部密封。
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公开(公告)号：US20160111606A1
公开(公告)日：2016-04-21
申请号：US14981301
申请日：2015-12-28
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jun Yong Park , Hee Cheul Jung , In Kyu Park , Daewoong Suh
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.
Abstract translation: 公开了一种发光器件及其制造方法。 根据本公开的优选实施例的发光器件包括：具有底部和侧壁的框架部分; 发光部，其设置在所述框架部上并发光; 以及设置在所述框架部分上以覆盖所述发光部分的窗口部分。
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公开(公告)号：US11563152B2
公开(公告)日：2023-01-24
申请号：US16935030
申请日：2020-07-21
Applicant: SEOUL VIOSYS CO., LTD
Inventor： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
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公开(公告)号：US10355184B2
公开(公告)日：2019-07-16
申请号：US15758302
申请日：2016-09-07
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jun Yong Park , In Kyu Park , Yeo Jin Yoon
Abstract: A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US09240524B2
公开(公告)日：2016-01-19
申请号：US14002966
申请日：2013-03-05
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jun Yong Park , Hee Cheul Jung , In Kyu Park , Seung Wook Lee , Daewoong Suh
IPC: H01L33/48 , H01L33/62 , H01L33/58 , H01L25/075
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.
Abstract translation: 公开了一种发光器件及其制造方法。 根据本公开的优选实施例的发光器件包括：具有底部和侧壁的框架部分; 发光部，其设置在所述框架部上并发光; 以及设置在所述框架部分上以覆盖所述发光部分的窗口部分。
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公开(公告)号：US20140367718A1
公开(公告)日：2014-12-18
申请号：US14002966
申请日：2013-03-05
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jun Yong Park , Hee Cheul Jung , In Kyu Park , Seung Wook Lee , Daewoong Suh
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/48 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to a preferred embodiment of the disclosure comprises: a frame portion having a bottom and a sidewall; a light-emitting portion which is disposed on the frame portion and emits light; and a window portion disposed over the frame portion so as to cover the light-emitting portion.
Abstract translation: 公开了一种发光器件及其制造方法。 根据本公开的优选实施例的发光器件包括：具有底部和侧壁的框架部分; 发光部，其设置在所述框架部上并发光; 以及设置在所述框架部分上以覆盖所述发光部分的窗口部分。
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公开(公告)号：US12107195B2
公开(公告)日：2024-10-01
申请号：US18098030
申请日：2023-01-17
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
CPC classification number: H01L33/486 , H01L33/20 , H01L33/44 , H01L33/505 , H01L33/62 , H01L2224/16 , H01L2933/0033
Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.
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公开(公告)号：US12044367B2
公开(公告)日：2024-07-23
申请号：US18223751
申请日：2023-07-19
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Ki Yon Park , Jun Yong Park
IPC: F21K9/69 , F21Y105/16 , F21Y115/10 , G02B19/00
CPC classification number: F21K9/69 , G02B19/0066 , F21Y2105/16 , F21Y2115/10
Abstract: A light emitting device includes a substrate, a plurality of light emitting diodes, a window, and a reflector. The substrate has a first region and a second region. The plurality of light emitting diodes are disposed on the first region of the substrate. The window has a dome shape and is disposed to cover the first region. The window is configured to control a traveling path of light emitted from the plurality of light emitting diodes. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting diodes. The reflector has an opening that exposes the plurality of light emitting diodes disposed on the substrate. A distance between two adjacent light emitting diodes of the plurality of light emitting diodes can be 500 micrometers or less.
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公开(公告)号：US20200350469A1
公开(公告)日：2020-11-05
申请号：US16935030
申请日：2020-07-21
Applicant: Seoul Viosys Co., Ltd
Inventor： Chi Hyun In , Jun Yong Park , Kyu Ho Lee , Dae Woong Suh , Jong Hyeon Chae , Chang Hoon Kim , Sung Hyun Lee
IPC: H01L33/48
Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.
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